Semiconductor device and method for manufacturing the semiconductor device

ABSTRACT

First to third insulators are successively formed in this order over a first conductor over a semiconductor substrate; a hard mask with a first opening is formed thereover; a resist mask with a second opening is formed thereover; a third opening is formed in the third insulator; a fourth opening is formed in the second insulator; the resist mask is removed; a fifth opening is formed in the first to third insulators; a second conductor is formed to cover an inner wall and a bottom surface of the fifth opening; a third conductor is formed thereover; polishing treatment is performed so that the hard mask is removed, and that levels of top surfaces of the second and third conductors and the third insulator are substantially equal to each other; and an oxide semiconductor is formed thereover. The second insulator is less permeable to hydrogen than the first and third insulators, the second conductor is less permeable to hydrogen than the third conductor.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to, for example, a transistor and asemiconductor device. The present invention relates to, for example, amethod for manufacturing a transistor and a semiconductor device. Thepresent invention relates to a display device, a light-emitting device,a lighting device, a power storage device, a memory device, a processor,or an electronic device, for example. The present invention relates to amethod for manufacturing a display device, a liquid crystal displaydevice, a light-emitting device, a memory device, or an electronicdevice. The present invention relates to a method for driving a displaydevice, a liquid crystal display device, a light-emitting device, astorage device, or an electronic device.

Note that one embodiment of the present invention is not limited to theabove technical field. The technical field of one embodiment of theinvention disclosed in this specification and the like relates to anobject, a method, or a manufacturing method. Furthermore, one embodimentof the present invention relates to a process, a machine, manufacture,or a composition of matter.

In this specification and the like, a semiconductor device generallymeans a device that can function by utilizing semiconductorcharacteristics. A display device, a light-emitting device, a lightingdevice, an electro-optical device, a semiconductor circuit, and anelectronic device include a semiconductor device in some cases.

2. Description of the Related Art

In recent years, transistors using oxide semiconductors (typically,In—Ga—Zn oxide) have been actively developed and are used in integratecircuits, and the like. Oxide semiconductors have been researched sinceearly times. In 1988, there was a disclosure of a crystal In—Ga—Zn oxidethat can be used for a semiconductor element (see Patent Document 1). In1995, a transistor including an oxide semiconductor was invented, andits electrical characteristics were disclosed (see Patent Document 2).

Much attention has been focused on a semiconductor device which uses acombination of a transistor in which silicon (Si) is used for asemiconductor layer and a transistor in which an oxide semiconductor isused for a semiconductor layer (see Patent Document 3).

REFERENCE Patent Documents

[Patent Document 1] Japanese Published Patent Application No. S63-239117

[Patent Document 2] Japanese translation of PCT internationalapplication No. H11-505377

[Patent Document 3] Japanese Published Patent Application No.2011-119674

SUMMARY OF THE INVENTION

An object is to provide a semiconductor device including a transistorwith stable electrical characteristics. Another object is to provide asemiconductor device including a transistor with a low leakage currentin an off state. Another object is to provide a semiconductor deviceincluding a transistor with normally-off electrical characteristics.Another object is to provide a semiconductor device including a highlyreliable transistor.

Another object is to provide a module including any of the abovesemiconductor devices. Another object is to provide an electronic deviceincluding any of the above semiconductor devices or the module. Anotherobject is to provide a novel semiconductor device. Another object is toprovide a novel module. Another object is to provide a novel electronicdevice.

Note that the descriptions of these objects do not disturb the existenceof other objects. In one embodiment of the present invention, there isno need to achieve all the objects. Other objects will be apparent fromand can be derived from the description of the specification, thedrawings, the claims, and the like.

(1) One embodiment of the present invention is a method formanufacturing a semiconductor device, including the steps of forming afirst conductor over a semiconductor substrate; forming a firstinsulator over the first conductor; forming a second insulator that isless permeable to hydrogen than the first insulator, over the firstinsulator; forming a third insulator over the second insulator; forminga hard mask with a first opening over the third insulator; forming aresist mask with a second opening over the hard mask; etching the thirdinsulator using the resist mask to form a third opening in the thirdinsulator; etching the second insulator using the resist mask to form afourth opening in the second insulator; removing the resist mask;etching the first to third insulators using the hard mask to form afifth opening in the first to third insulators; forming a secondconductor to cover an inner wall and a bottom surface of the fifthopening; forming a third conductor over the second conductor to fill thefifth opening; performing polishing treatment on the hard mask, thesecond conductor, and the third conductor so that the hard mask isremoved, and that levels of top surfaces of the second conductor, thethird conductor, and the third insulator are substantially equal to eachother; and forming an oxide semiconductor over the second conductor andthe third conductor. In the embodiment, the second insulator is incontact with the second conductor at an edge of the fifth opening, andthe second conductor is less permeable to hydrogen than the thirdconductor.

(2) Another embodiment of the present invention is the method formanufacturing a semiconductor device described in (1) in which a maximumvalue of the width of the second opening is smaller than a minimum valueof the width of the first opening.

(3) Another embodiment of the present invention is the method formanufacturing a semiconductor device described in (1) or (2) in whichthe second conductor includes tantalum and nitrogen.

(4) Another embodiment of the present invention is the method formanufacturing a semiconductor device described in any one of (1) to (3)in which the second insulator includes aluminum and oxygen.

(5) Another embodiment of the present invention is a semiconductordevice including a semiconductor substrate, a first insulator over thesemiconductor substrate, a second insulator over the first insulator, athird insulator over the second insulator, a plug embedded in the firstto third insulators, and an oxide semiconductor over the thirdinsulator. In the embodiment, a first transistor is formed in thesemiconductor substrate, the first transistor is electrically connectedto the plug, the plug includes a first conductor and a second conductor,the first conductor is in contact with the first to third insulators,the second conductor is in contact with the first conductor, a secondtransistor is provided to include the oxide semiconductor, the secondinsulator is less permeable to hydrogen than the first insulator, andthe first conductor is less permeable to hydrogen than the secondconductor.

(6) Another embodiment of the present invention is the semiconductordevice described in (5) in which the first conductor includes tantalumand nitrogen.

(7) Another embodiment of the present invention is the semiconductordevice described in (5) or (6) in which the second insulator includesaluminum and oxygen.

(8) Another embodiment of the present invention is the semiconductordevice described in any one of (5) to (7) in which the oxidesemiconductor includes indium, an element M, zinc, and oxygen; and theelement M is Ti, Ga, Y, Zr, La, Ce, Nd, Sn, or Hf.

(9) Another embodiment of the present invention is the semiconductordevice described in any one of (5) to (8) in which the semiconductorsubstrate includes silicon.

A semiconductor device including a transistor with stable electricalcharacteristics can be provided. A semiconductor device including atransistor with a low leakage current in an off state can be provided. Asemiconductor device including a transistor with normally-off electricalcharacteristics can be provided. A semiconductor device including ahighly reliable transistor can be provided.

A module including any of the above semiconductor devices can beprovided. An electronic device including any of the above semiconductordevices or the module can be provided. A novel semiconductor device canbe provided. A novel module can be provided. A novel electronic devicecan be provided.

Note that the description of these effects does not preclude theexistence of other effects. One embodiment of the present invention doesnot have to have all the effects listed above. Other effects will beapparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1D are cross-sectional views and top views illustrating amethod for manufacturing a semiconductor device of one embodiment of thepresent invention.

FIGS. 2A to 2D are cross-sectional views and top views illustrating themethod for manufacturing a semiconductor device of one embodiment of thepresent invention.

FIGS. 3A to 3D are cross-sectional views and top views illustrating themethod for manufacturing a semiconductor device of one embodiment of thepresent invention.

FIGS. 4A to 4D are cross-sectional views and top views illustrating themethod for manufacturing a semiconductor device of one embodiment of thepresent invention.

FIGS. 5A to 5C are cross-sectional views and a top view illustrating themethod for manufacturing a semiconductor device of one embodiment of thepresent invention.

FIGS. 6A to 6C are cross-sectional views illustrating the method formanufacturing a semiconductor device of an embodiment of the presentinvention.

FIGS. 7A to 7C are cross-sectional views and a top view illustrating themethod for manufacturing a semiconductor device of one embodiment of thepresent invention.

FIGS. 8A and 8B are a cross-sectional view and a top view illustratingthe method for manufacturing a semiconductor device of one embodiment ofthe present invention.

FIGS. 9A to 9D are cross-sectional views and top views illustrating themethod for manufacturing a semiconductor device of one embodiment of thepresent invention.

FIGS. 10A to 10D are cross-sectional views and top views illustratingthe method for manufacturing a semiconductor device of one embodiment ofthe present invention.

FIGS. 11A and 11B are a cross-sectional view and a top view illustratingthe method for manufacturing a semiconductor device of one embodiment ofthe present invention.

FIGS. 12A and 12B are a cross-sectional view and a top view illustratingthe method for manufacturing a semiconductor device of one embodiment ofthe present invention.

FIGS. 13A to 13D are cross-sectional views illustrating structures of asemiconductor device of one embodiment of the present invention.

FIGS. 14A to 14C are cross-sectional views each illustrating a structureof a semiconductor device of one embodiment of the present invention.

FIGS. 15A to 15D are cross-sectional views illustrating structures of asemiconductor device of an embodiment of the present invention.

FIG. 16 is a cross-sectional view illustrating a structure of asemiconductor device of one embodiment of the present invention.

FIG. 17 is a cross-sectional view illustrating a structure of asemiconductor device of one embodiment of the present invention.

FIG. 18 is a cross-sectional view illustrating a structure of asemiconductor device of one embodiment of the present invention.

FIGS. 19A and 19B are cross-sectional views illustrating a method formanufacturing a semiconductor device of one embodiment of the presentinvention.

FIGS. 20A and 20B are cross-sectional views illustrating the method formanufacturing a semiconductor device of one embodiment of the presentinvention.

FIGS. 21A and 21B are cross-sectional views illustrating the method formanufacturing a semiconductor device of one embodiment of the presentinvention.

FIGS. 22A and 22B are cross-sectional views illustrating the method formanufacturing a semiconductor device of one embodiment of the presentinvention.

FIGS. 23A and 23B are cross-sectional views illustrating the method formanufacturing a semiconductor device of one embodiment of the presentinvention.

FIGS. 24A to 24F are cross-sectional views illustrating a method formanufacturing a semiconductor device of one embodiment of the presentinvention.

FIGS. 25A to 25F are cross-sectional views illustrating the method formanufacturing a semiconductor device of an embodiment of the presentinvention.

FIGS. 26A to 26C each illustrate an atomic ratio range of an oxidesemiconductor of one embodiment of the present invention.

FIG. 27 illustrates an InMZnO₄ crystal.

FIGS. 28A and 28B are each a band diagram of a layered structureincluding an oxide semiconductor.

FIGS. 29A to 29E show structural analysis of a CAAC-OS and a singlecrystal oxide semiconductor by XRD and selected-area electrondiffraction patterns of a CAAC-OS.

FIGS. 30A to 30E show a cross-sectional TEM image and plan-view TEMimages of a CAAC-OS and images obtained through analysis thereof.

FIGS. 31A to 31D show electron diffraction patterns and across-sectional TEM image of an nc-OS.

FIGS. 32A and 32B show cross-sectional TEM images of an a-like OS.

FIG. 33 shows a change in crystal part of an In—Ga—Zn oxide induced byelectron irradiation.

FIGS. 34A and 34B are circuit diagrams each illustrating a semiconductordevice of one embodiment of the present invention.

FIGS. 35A to 35C are each a circuit diagram illustrating a memory deviceof one embodiment of the present invention.

FIG. 36 is a circuit diagram illustrating a memory device of oneembodiment of the present invention.

FIGS. 37A to 37C are circuit diagrams and a timing chart illustratingone embodiment of the present invention.

FIGS. 38A to 38C are a graph and circuit diagrams illustrating oneembodiment of the present invention.

FIGS. 39A and 39B are a circuit diagram and a timing chart illustratingone embodiment of the present invention.

FIGS. 40A and 40B are a circuit diagram and a timing chart illustratingone embodiment of the present invention.

FIGS. 41A to 41E are a block diagram, circuit diagrams, and waveformdiagrams for illustrating one embodiment of the present invention.

FIGS. 42A and 42B are a circuit diagram and a timing chart illustratingone embodiment of the present invention.

FIGS. 43A and 43B are circuit diagrams each illustrating one embodimentof the present invention.

FIGS. 44A to 44C are circuit diagrams each illustrating one embodimentof the present invention.

FIGS. 45A and 45B are circuit diagrams each illustrating one embodimentof the present invention.

FIGS. 46A to 46C are circuit diagrams each illustrating one embodimentof the present invention.

FIGS. 47A and 47B are circuit diagrams each illustrating one embodimentof the present invention.

FIG. 48 is a block diagram illustrating a semiconductor device of oneembodiment of the present invention.

FIG. 49 is a circuit diagram illustrating a semiconductor device of oneembodiment of the present invention.

FIGS. 50A and 50B are top views each illustrating a semiconductor deviceof one embodiment of the present invention.

FIGS. 51A and 51B are block diagrams illustrating a semiconductor deviceof one embodiment of the present invention.

FIGS. 52A and 52B are cross-sectional views each illustrating asemiconductor device of one embodiment of the present invention.

FIG. 53 is a cross-sectional view illustrating a semiconductor device ofone embodiment of the present invention.

FIGS. 54A to 54F are perspective views each illustrating an electronicdevice of one embodiment of the present invention.

FIGS. 55A and 55B are cross-sectional SEM images in Example 1.

FIGS. 56A and 56B are cross-sectional SEM images in Example 1.

FIGS. 57A and 57B are cross-sectional SEM images in Example 1.

FIGS. 58A and 58B are cross-sectional SEM images in Example 1.

FIG. 59 is a cross-sectional STEM image in Example 1.

FIG. 60 is a cross-sectional STEM image in Example 1.

FIGS. 61A and 61B are cross-sectional views illustrating samplestructures in Example 2.

FIG. 62 shows TDS measurement results in Example 2.

FIG. 63 shows TDS measurement results in Example 2.

FIGS. 64A and 64B are graphs showing measurement results of sheetresistance in Example 2.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments according to the present invention will be described indetail with reference to the accompanying drawings. Note that thepresent invention is not limited to the description below, and it iseasily understood by those skilled in the art that modes and details ofthe present invention can be modified in various ways. In addition, thepresent invention should not be construed as being limited to thedescription in the embodiments given below. In describing structures ofthe invention with reference to the drawings, the same referencenumerals are used in common for the same portions in different drawings.Note that the same hatch pattern is applied to similar parts, and thesimilar parts are not especially denoted by reference numerals in somecases.

A structure in one of the following embodiments can be appropriatelyapplied to, combined with, or replaced with another structure in anotherembodiment, for example, and the resulting structure is also oneembodiment of the present invention.

Note that the size, the thickness of films (layers), or regions indrawings is sometimes exaggerated for simplicity.

In this specification, the terms “film” and “layer” can be interchangedwith each other.

A voltage usually refers to a potential difference between a givenpotential and a reference potential (e.g., a source potential or aground potential (GND)). Thus, a voltage can be referred to as apotential and vice versa. Note that in general, a potential (a voltage)is relative and is determined depending on the amount relative to acertain potential. Therefore, a potential which is represented as a“ground potential” or the like is not always 0 V. For example, thelowest potential in a circuit may be represented as a “groundpotential”. Alternatively, a substantially intermediate potential in acircuit may be represented as a “ground potential”. In these cases, apositive potential and a negative potential are set using the potentialas a reference.

Note that the ordinal numbers such as “first” and “second” in thisspecification are used for convenience and do not denote the order ofsteps or the stacking order of layers. Therefore, for example, the term“first” can be replaced with the term “second”, “third”, or the like asappropriate. In addition, the ordinal numbers in this specification andthe like do not correspond to the ordinal numbers which specify oneembodiment of the present invention in some cases.

Note that a “semiconductor” includes characteristics of an “insulator”in some cases when the conductivity is sufficiently low, for example.Furthermore, a “semiconductor” and an “insulator” cannot be strictlydistinguished from each other in some cases because a border between the“semiconductor” and the “insulator” is not clear. Accordingly, a“semiconductor” in this specification can be called an “insulator” insome cases. Similarly, an “insulator” in this specification can becalled a “semiconductor” in some cases.

Furthermore, a “semiconductor” includes characteristics of a “conductor”in some cases when the conductivity is sufficiently high, for example.Furthermore, a “semiconductor” and a “conductor” cannot be strictlydistinguished from each other in some cases because a border between the“semiconductor” and the “conductor” is not clear. Accordingly, a“semiconductor” in this specification can be called a “conductor” insome cases. Similarly, a “conductor” in this specification can be calleda “semiconductor” in some cases.

Note that an impurity in a semiconductor refers to, for example,elements other than the main components of a semiconductor. For example,an element with a concentration of lower than 0.1 atomic % is animpurity. When an impurity is contained, the density of states (DOS) maybe formed in a semiconductor, the carrier mobility may be decreased, orthe crystallinity may be decreased, for example. In the case where thesemiconductor is an oxide semiconductor, examples of an impurity whichchanges characteristics of the semiconductor include Group 1 elements,Group 2 elements, Group 13 elements, Group 14 elements, Group 15elements, and transition metals other than the main components of thesemiconductor; specifically, there are hydrogen (included in water),lithium, sodium, silicon, boron, phosphorus, carbon, and nitrogen, forexample. When the semiconductor is an oxide semiconductor, oxygenvacancies may be formed by entry of impurities such as hydrogen, forexample. Furthermore, when the semiconductor layer is silicon, examplesof an impurity which changes the characteristics of the semiconductorinclude oxygen, Group 1 elements except hydrogen, Group 2 elements,Group 13 elements, and Group 15 elements.

Note that the channel length refers to, for example, the distancebetween a source (a source region or a source electrode) and a drain (adrain region or a drain electrode) in a region where a semiconductor (ora portion where a current flows in a semiconductor when a transistor ison) and a gate electrode overlap with each other or a region where achannel is formed in a plan view of the transistor. In one transistor,channel lengths in all regions are not necessarily the same. In otherwords, the channel length of one transistor is not fixed to one value insome cases. Therefore, in this specification, the channel length is anyone of values, the maximum value, the minimum value, or the averagevalue in a region where a channel is formed.

The channel width refers to, for example, the length of a portion wherea source and a drain face each other in a region where a semiconductor(or a portion where a current flows in a semiconductor when a transistoris on) and a gate electrode overlap with each other, or a region where achannel is formed. In one transistor, channel widths in all regions arenot necessarily the same. In other words, the channel width of onetransistor is not fixed to one value in some cases. Therefore, in thisspecification, the channel width is any one of values, the maximumvalue, the minimum value, or the average value in a region where achannel is formed.

Note that depending on transistor structures, a channel width in aregion where a channel is formed actually (hereinafter referred to as aneffective channel width) is different from a channel width shown in aplan view of the transistor (hereinafter referred to as an apparentchannel width) in some cases. For example, in a transistor having athree-dimensional structure, an effective channel width is greater thanan apparent channel width shown in a plan view of the transistor, andits influence cannot be ignored in some cases. For example, in aminiaturized transistor having a three-dimensional structure, theproportion of a channel region formed in a side surface of asemiconductor is high in some cases. In that case, an effective channelwidth obtained when a channel is actually formed is greater than anapparent channel width shown in the plan view.

In a transistor having a three-dimensional structure, an effectivechannel width is difficult to measure in some cases. For example, toestimate an effective channel width from a design value, it is necessaryto assume that the shape of a semiconductor is known as an assumptioncondition. Therefore, in the case where the shape of a semiconductor isnot known accurately, it is difficult to measure an effective channelwidth accurately.

Therefore, in this specification, in a plan view of a transistor, anapparent channel width that is a length of a portion where a source anda drain face each other in a region where a semiconductor and a gateelectrode overlap with each other is referred to as a surrounded channelwidth (SCW) in some cases. Further, in this specification, in the casewhere the term “channel width” is simply used, it may represent asurrounded channel width or an apparent channel width. Alternatively, inthis specification, in the case where the term “channel width” is simplyused, it may represent an effective channel width in some cases. Notethat the values of a channel length, a channel width, an effectivechannel width, an apparent channel width, a surrounded channel width,and the like can be determined by obtaining and analyzing across-sectional TEM image and the like.

Note that in the case where field-effect mobility, a current value perchannel width, and the like of a transistor are obtained by calculation,a surrounded channel width may be used for the calculation. In thatcase, a value different from one in the case where an effective channelwidth is used for the calculation is obtained in some cases.

Note that in this specification and the like, silicon oxynitride refersto a substance in which the proportion of oxygen is higher than that ofnitrogen. The silicon oxynitride preferably contains oxygen, nitrogen,silicon, and hydrogen at concentrations ranging from 55 atomic % to 65atomic %, 1 atomic % to 20 atomic %, 25 atomic % to 35 atomic %, and 0.1atomic % to 10 atomic %, respectively. Silicon nitride oxide refers to asubstance in which the proportion of nitrogen is higher than that ofoxygen. The silicon nitride oxide preferably contains nitrogen, oxygen,silicon, and hydrogen at concentrations ranging from 55 atomic % to 65atomic %, 1 atomic % to 20 atomic %, 25 atomic % to 35 atomic %, and 0.1atomic % to 10 atomic %, respectively.

In this specification, the term “parallel” indicates that the angleformed between two straight lines is greater than or equal to −10° andless than or equal to 10°, and accordingly also includes the case wherethe angle is greater than or equal to −5° and less than or equal to 5°.In addition, the term “substantially parallel” indicates that the angleformed between two straight lines is greater than or equal to −30° andless than or equal to 30°. In addition, the term “perpendicular”indicates that an angle formed between two straight lines is 80° to100°, and accordingly includes the case where the angle is 85° to 95°.In addition, the term “substantially perpendicular” indicates that theangle formed between two straight lines is greater than or equal to 60°and less than or equal to 120°.

In this specification, trigonal and rhombohedral crystal systems areincluded in a hexagonal crystal system.

Embodiment 1

In this embodiment, a semiconductor device and a method formanufacturing the semiconductor device of one embodiment of the presentinvention are described with reference to FIGS. 1A to 1D, FIGS. 2A to2D, FIGS. 3A to 3D, FIGS. 4A to 4D, FIGS. 5A to 5C, FIGS. 6A to 6C,FIGS. 7A to 7C, FIGS. 8A and 8B, FIGS. 9A to 9D, FIGS. 10A to 10D, FIGS.11A and 11B, FIGS. 12A and 12B, FIGS. 13A to 13D, FIGS. 14A to 14C,FIGS. 15A to 15D, FIG. 16, FIG. 17, FIG. 18, FIGS. 19A and 19B, FIGS.20A and 20B, FIGS. 21A and 21B, FIGS. 22A and 22B, FIGS. 23A and 23B,FIGS. 24A to 24F, and 25A to 25F.

<Method for Forming Wiring and Plug>

A method for forming a wiring and a plug as components of asemiconductor device of one embodiment of the present invention isdescribed below with reference to cross-sectional views and top viewsillustrated in FIGS. 1A to 1D, FIGS. 2A to 2D, FIGS. 3A to 3D, and FIGS.4A to 4D. FIGS. 1A to 1D, FIGS. 2A to 2D, FIGS. 3A to 3D, and FIGS. 4Ato 4D are cross-sectional views each taken along dashed dotted lineX1-X2 and top views.

FIGS. 1A to 1D, FIGS. 2A to 2D, FIGS. 3A to 3D, and FIGS. 4A to 4D showa process for connecting a conductor 12 (also referred to as aconductive film or a wiring in some cases) and conductors 20 a and 21 awhich are embedded in an opening 17 f formed in insulators 13 a, 14 b,and 15 c. Here, an upper part and a lower part of the opening 17 f havedifferent shapes: the lower part of the opening 17 f (also referred toas an opening 17 fa) functions as a via hole or a contact hole, and theupper part of the opening 17 f (also referred to as an opening 17 fb)functions as a groove in which a wiring pattern or the like is embedded.Thus, part of the conductor 20 a and part of the conductor 21 a whichare embedded in the opening 17 fa function as a plug, and part of theconductor 20 a and part of the conductor 21 a which are embedded in theopening 17 fb function as a wiring or the like.

First, the conductor 12 is formed over a substrate. The conductor 12 mayhave either a single-layer structure or a stacked-layer structure. Notethat the substrate is not illustrated in FIGS. 1A to 1D, FIGS. 2A to 2D,FIGS. 3A to 3D, and FIGS. 4A to 4D. Another conductor, insulator,semiconductor, or the like may be provided between the substrate and theconductor 12.

The conductor 12 can be formed by a method similar to those for forminga hard mask 16, a conductor 20, a conductor 21, and the like which aredescribed later.

Next, an insulator 13 is formed over the conductor 12. The insulator 13may have either a single-layer structure or a stacked structure. Theinsulator 13 can be formed by a sputtering method, a chemical vapordeposition (CVD) method, a molecular beam epitaxy (MBE) method, a pulsedlaser deposition (PLD) method, an atomic layer deposition (ALD) method,or the like.

A CVD method can be classified into a plasma enhanced CVD (PECVD) methodusing plasma, a thermal CVD (TCVD) method using heat, a photo CVD methodusing light, and the like. Moreover, the CVD method can include a metalCVD (MCVD) method and a metal organic CVD (MOCVD) method depending on asource gas.

Then, an insulator 14 is formed over the insulator 13. The insulator 14may have either a single-layer structure or a stacked structure. Theinsulator 14 can be formed by a sputtering method, a CVD method, an MBEmethod, a PLD method, an ALD method, or the like.

It is preferable that the insulator 14 be formed using a material whichis less permeable to hydrogen and water than the insulator 13. Theinsulator 14 can be formed using, for example, aluminum oxide, aluminumoxynitride, gallium oxide, gallium oxynitride, yttrium oxide, yttriumoxynitride, hafnium oxide, or hafnium oxynitride. The use of such amaterial enables the insulator 14 to function as an insulating film thatexhibits an effect of blocking diffusion of hydrogen and water.

Then, an insulator 15 is formed over the insulator 14. The insulator 15may have either a single-layer structure or a stacked structure. Theinsulator 15 can be deposited by a sputtering method, a CVD method, anMBE method, a PLD method, an ALD method, or the like.

Next, a material of the hard mask 16 is deposited over the insulator 15.Here, the material of the hard mask 16 may be a conductor such as ametal material, or an insulator. In addition, the material of the hardmask 16 may be either a single layer or a stack of an insulator and aconductor. Note that in this specification and the like, a hard maskrefers to a mask formed using a material (a metal material or aninsulating material) other than a resist. The material of the hard mask16 can be deposited by a sputtering method, a CVD method, an MBE method,a PLD method, an ALD method, or the like.

Next, the material of the hard mask 16 is etched using a resist maskformed by lithography or the like, whereby the hard mask 16 with anopening 17 a is formed (see FIGS. 1A and 1B). Here, FIG. 1A correspondsto a cross section taken along dashed dotted line X1-X2 shown in FIG.1B. In the same manner, each cross-sectional view shown in the followingdescription corresponds to a cross section taken along dashed dottedline X1-X2 shown in the corresponding top view.

The opening 17 a corresponds to the opening 17 fb to be formed in alater step, i.e., a groove in which a wiring pattern is embedded.Therefore, the top-view shape of the opening 17 a corresponds to thewiring pattern.

For details of lithography, description of a resist mask 18 a to beshown later can be referred to. In addition, dry etching is preferablyemployed for the etching for forming the hard mask 16. For the dryetching process, description of the insulator 15 or the like can bereferred to.

Next, the resist mask 18 a with an opening 17 b is formed over theinsulator 15 and the hard mask 16 (see FIGS. 1C and 1D). Here, it ispreferable that the resist mask 18 a cover the hard mask 16. Note thatthe case where a resist is simply formed also includes the case where anorganic coating film or the like is formed below the resist.

Here, the opening 17 b corresponds to the opening 17 fa to be formed ina later step, i.e., a via hole or a contact hole. Therefore, thetop-view shape of the opening 17 b corresponds to that of the via holeor the contact hole. In addition, it is preferable that the opening 17 bcorresponding to the via hole or the contact hole be formed in theopening 17 a that correspond to the groove in which the wiring patternis embedded. In that case, a maximum value of the width of the opening17 b is less than or equal to a minimum value of the width of theopening 17 a. For example, the width of the opening 17 b in thedirection of X1-X2 shown in FIGS. 1C and 1D is less than or equal to thewidth of the opening 17 a in the direction of X1-X2 shown in FIGS. 1Aand 1B. In that case, the via hole or the contact hole can be formedwith a margin with respect to the groove for the wiring pattern.

Note that the top-view shape of the opening 17 b is, but not limited to,circular; the top-view shape can alternatively be, for example, ellipticor polygonal, e.g., a triangle or a quadrangle. In the case where apolygonal shape is employed, corners thereof may be rounded.

Note that in lithography, first, a resist is exposed to light through aphotomask. Next, a region exposed to light is removed or left using adeveloping solution, so that a resist mask is formed. Then, etchingthrough the resist mask is conducted. As a result, the conductor, thesemiconductor, the insulator, or the like can be processed into adesired shape. The resist mask is formed by, for example, exposure ofthe resist to light using KrF excimer laser light, ArF excimer laserlight, extreme ultraviolet (EUV) light, or the like. Alternatively, aliquid immersion technique may be employed in which a portion between asubstrate and a projection lens is filled with liquid (e.g., water) toperform light exposure. An electron beam or an ion beam may be usedinstead of the above-mentioned light. Note that a photomask is notnecessary in the case of using an electron beam or an ion beam. Notethat dry etching treatment such as ashing or wet etching treatment canbe used for removal of the resist mask. Alternatively, wet etchingtreatment is performed in addition to dry etching treatment. Furtheralternatively, dry etching treatment is performed in addition to wetetching treatment.

Next, the insulator 15 is etched using the resist mask 18 a to form aninsulator 15 a with an opening 17 c (see FIGS. 2A and 2B). Here, theetching is performed until a top surface of the insulator 14 is exposedin the opening 17 c. Note that dry etching is preferably employed forthe etching.

As a dry etching apparatus, a capacitively coupled plasma (CCP) etchingapparatus including parallel-plate electrodes can be used. Thecapacitively coupled plasma etching apparatus including theparallel-plate electrodes may have a structure in which a high-frequencypower source is applied to one of the parallel-plate electrodes.Alternatively, the capacitively coupled plasma etching apparatus mayhave a structure in which different high-frequency power sources areapplied to one of the parallel-plate electrodes. Alternatively, thecapacitively coupled plasma etching apparatus may have a structure inwhich high-frequency power sources with the same frequency are appliedto the parallel-plate electrodes. Alternatively, the capacitivelycoupled plasma etching apparatus may have a structure in whichhigh-frequency power sources with different frequencies are applied tothe parallel-plate electrodes. Alternatively, a dry etching apparatusincluding a high-density plasma source can be used. As the dry etchingapparatus including a high-density plasma source, an inductively coupledplasma (ICP) etching apparatus can be used, for example.

Next, the insulator 14 is etched using the resist mask 18 a to form aninsulator 14 a with an opening 17 d (see FIGS. 2C and 2D). Here, theetching is performed until the surface of the insulator 13 is exposed inthe opening 17 d. Note that dry etching is preferably employed for theetching. As a dry etching apparatus, an apparatus similar to thatdescribed above can be used.

It is not necessary to stop the etching at the top surface of theinsulator 13 when the opening 17 d is formed. For example, after theopening 17 d is formed, part of the insulator 13 may be etched to forman insulator 13 b in which a recessed portion is formed in a regionunder the opening 17 d, as illustrated in FIG. 5A.

Next, the resist mask 18 a is removed (see FIGS. 3A and 3B). In the casewhere an organic coating film is formed under the resist mask 18 a, itis preferably removed together with the resist mask 18 a. Dry etchingtreatment such as ashing or wet etching treatment can be used forremoval of the resist mask 18 a. Alternatively, wet etching treatment isperformed in addition to dry etching treatment. Further alternatively,dry etching treatment can be performed in addition to wet etchingtreatment.

After the resist mask 18 a is removed, a by-product 22 might be formedso as to surround the edge of a top portion of the opening 17 c (seeFIGS. 5B and 5C). The by-product 22 contains a component which iscontained in the insulator 14, the insulator 15, or the resist mask 18a; or a component which is contained in an etching gas for the insulator14 or the insulator 15. The by-product 22 can be removed in the nextstep for forming an opening 17 e.

Next, the insulator 13, the insulator 14 a, and the insulator 15 a areetched using the hard mask 16 to form the insulator 13 a, the insulator14 b, and an insulator 15 b, in which the opening 17 e is formed (seeFIGS. 3C and 3D). Here, the etching is performed until the top surfaceof the conductor 12 is exposed in the opening 17 e. The edge of theopening 17 a of the hard mask 16 is also etched in some cases, whereby ahard mask 16 a may be formed. The edge of the opening 17 a of the hardmask 16 a has a tapered shape, and an upper part of the edge of theopening 17 a is rounded. Note that dry etching is preferably employedfor the etching. As a dry etching apparatus, an apparatus similar tothat described above can be used.

Here, the opening 17 e can be regarded as being composed of an opening17 ea which is located in a lower part and formed using the insulator 14a as a mask, and an opening 17 eb which is located in an upper part andformed using the hard mask 16 as a mask. The opening 17 ea functions asa via hole or a contact hole in a later step, and the opening 17 ebfunctions as a groove in which a wiring pattern or the like is embeddedin a later step.

The edge (also referred to as the inner wall) of the opening 17 eb inthe insulator 15 b preferably has a tapered shape. Note that the taperedportion of the insulator 15 b may be seen from above, as illustrated inFIG. 3D.

The edge (also referred to as the inner wall) of the opening 17 ea inthe insulators 13 a and 14 b preferably has a tapered shape. Note thatthe upper part of the edge of the opening 17 ea, which is provided inthe insulator 14 b, is preferably rounded. Owing to such a shape of theopening 17 ea, the conductor 20 having a high blocking property againsthydrogen can be formed with good coverage in a later step. Note that thetapered portion of the insulator 13 a may be seen from above, asillustrated in FIG. 3D.

To perform the dry etching so that the opening 17 ea has such a shape,it is preferable that the etching rate of the insulator 13 not beextremely higher than the etching rate of the insulator 14 a. Forexample, the etching rate of the insulator 13 is set to less than orequal to eight times, preferably less than or equal to six times,further preferably less than or equal to four times the etching rate ofthe insulator 14 a.

Dry etching under the above-described conditions can shape the edge ofthe opening 17 ea into a tapered shape. In addition, even in the casewhere the by-product 22 is formed as illustrated in FIGS. 5B and 5C, theby-product 22 can be removed, and the upper part of the edge of theopening 17 ea of the insulator 14 b can be rounded.

Note that the shape of the opening 17 e is not limited to theabove-described shape. For example, the inner walls of the openings 17ea and 17 eb can be substantially perpendicular to the conductor 12 andthe insulator 14 b. Alternatively, the opening 17 eb may be formed inthe insulators 15 b and 14 b; further alternatively, the opening 17 ebmay be formed in the insulators 15 b, 14 b, and 13 a.

Next, the conductor 20 is formed in the opening 17 e, and the conductor21 is formed over the conductor 20 so as to be embedded in the opening17 e (see FIGS. 4A and 4B). Here, it is preferable that the conductor 20be formed with good coverage so as to cover the inner wall and bottomsurface of the opening 17 e. In particular, it is preferable that theconductor 20 be in contact with the insulator 14 b at the edge of theopening 17 e; and it is further preferable that the opening formed inthe insulators 13 a and 14 b be covered with the conductor 20 so thatthe conductor 20 is provided along the inner wall of the opening. Whenthe edge of the opening 17 ea in the insulators 13 a and 14 b has atapered shape, and the upper part of the edge of the opening 17 ea ofthe insulator 14 b is rounded in the above manner, the coverage with theconductor 20 can be further improved.

The conductor 20 is preferably formed using a conductor which is lesspermeable to hydrogen than the conductor 21. For the conductor 20, ametal nitride such as tantalum nitride or titanium nitride is used, andtantalum nitride is particularly preferably used. Such a conductor 20can prevent diffusion of impurities such as hydrogen and water into theconductor 21. In addition, effects, e.g., preventing diffusion of metalcomponents contained in the conductor 21, preventing oxidation of theconductor 21, and improving adhesion of the conductor 21 with theopening 17 e, can be obtained. Furthermore, in the case where theconductor 20 is formed using stacked layers, for example, titanium,tantalum, titanium nitride, tantalum nitride, or the like may be used.Moreover, in the case where tantalum nitride is deposited as theconductor 20, heat treatment may be performed using a rapid thermalanneal (RTA) apparatus after the deposition.

The conductor 20 can be formed by a sputtering method, a CVD method, anMBE method, a PLD method, an ALD method, or the like. Here, it ispreferable that the formation of the conductor 20 be performed by amethod providing good coverage, e.g., a collimated sputtering method, anMCVD method, or an ALD method.

Here, a collimated sputtering method enables highly directive filmformation because a collimator is provided between a target and asubstrate. Sputtered particles having vertical components for thesubstrate pass through the collimator to reach the substrate. Therefore,the sputtered particles are likely to reach the bottom surface of theopening 17 ea that has a high aspect ratio, whereby a film issufficiently deposited over the bottom surface of the opening 17 ea. Inaddition, since the inner walls of the openings 17 ea and 17 eb have atapered shape in the above manner, the film can also be sufficientlydeposited on the inner walls of the openings 17 ea and 17 eb.

When the conductor 20 is formed by an ALD method, the conductor 20 canhave good coverage, and formation of a pin hole and the like in theconductor 20 can be prevented. Forming the conductor 20 in the abovemanner can further prevent impurities such as hydrogen and water frompassing through the conductor 20 and diffusing into the conductor 21. Inthe case where tantalum nitride is deposited as the conductor 20 by anALD method, for example, pentakis(dimethylamino)tantalum (structuralformula: Ta[N(CH₃)₂]₅) can be used as a precursor.

The conductor 21 may be formed to have a single-layer structure or astacked-layer structure including a conductor containing, for example,one or more kinds of boron, nitrogen, oxygen, fluorine, silicon,phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel,copper, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium,silver, indium, tin, tantalum, and tungsten. The conductor 21 can beformed by a sputtering method, a CVD method, an MBE method, a PLDmethod, an ALD method, or the like. Since the conductor 21 is formed soas to be embedded in the opening 17 e, a CVD method (an MCVD method, inparticular) is preferably used.

Next, polishing treatment is performed on the conductor 21, theconductor 20, the hard mask 16 a, and the insulator 15 b to form theconductor 20 a and the conductor 21 a which are embedded in the opening17 f (see FIGS. 4C and 4D). As the polishing treatment, mechanicalpolishing, chemical polishing, chemical mechanical polishing (CMP) orthe like may be employed. For example, CMP treatment removes the upperpart of the insulator 15 b, the upper part of the conductor 21, theupper part of the conductor 20, and the hard mask 16 a, whereby theinsulator 15 c, the conductor 21 a, and the conductor 20 a which haveflat top surfaces can be formed.

Here, the opening 17 f can be regarded as being composed of the opening17 fa which is located in the lower part and functions as a via hole ora contact hole, and the opening 17 fb which is located in the upper partand functions as a groove in which the wiring pattern or the like isembedded. The opening 17 fa is formed in the insulator 13 a and theinsulator 14 b, and the opening 17 fb is formed in the insulator 15 c.Part of the conductor 20 a and part of the conductor 21 a which areembedded in the opening 17 fa function as a plug, and part of theconductor 20 a and part of the conductor 21 a which are embedded in theopening 17 fb function as a wiring and the like.

The conductor 20 a is preferably in contact with the insulator 14 b atthe edge of the opening 17 fa. It is further preferable that theconductor 20 a be in contact with the insulator 14 b at the roundedportion of the upper part of the opening 17 fa and be in contact withthe insulator 13 a and the insulator 14 b at the tapered portion of theedge of the opening 17 fa. In addition, it is preferable that theconductor 20 a be in contact with the inner wall of the opening 17 fa ofthe insulator 13 a and the inner wall of the opening 17 fb of theinsulator 15 c.

As described in this embodiment, the conductor 20 is formed after theopening 17 e that is composed of the opening 17 ea functioning as a viahole or a contact hole and the opening 17 eb functioning as a groove inwhich the wiring patter and the like is embedded, in which case the partof the conductor 20 a functioning as a wiring and the part of theconductor 20 a functioning as a plug are integrated. In that case, forexample, the conductor 20 a is continuously formed in the vicinity ofthe boundary between the opening 17 ea and the opening 17 eb, which canimprove the blocking function against hydrogen and water. In the casewhere the wiring and the plug are each formed by a single damasceneprocess, formation of a conductor and polishing treatment such as CMPtreatment each need to be performed once in order to form each of theplug and the wiring. In contrast, by the method described in thisembodiment, formation of a conductor and polishing treatment are eachperformed once, whereby the wiring and the plug can be formedcollectively; as a result, the number of steps can be reduced.

Here, in the semiconductor device described in this embodiment, an oxidesemiconductor is provided over a semiconductor substrate, and theabove-described stacked insulators and the conductors that are embeddedin the opening formed in the insulators and function as a wiring and aplug are provided between the semiconductor substrate and the oxidesemiconductor. In the semiconductor device described in this embodiment,a transistor is formed using the oxide semiconductor, and an elementlayer including the transistor is formed over an element layer includingthe semiconductor substrate. A transistor may be formed in the elementlayer including the semiconductor substrate. In addition, an elementlayer including a capacitor and the like may be provided as appropriate.For example, an element layer including a capacitor may be provided overthe element layer including the oxide semiconductor or between theelement layer including the semiconductor substrate and the elementlayer including the oxide semiconductor.

In the semiconductor device with such a structure, the conductor 20 a ispreferably in contact with the insulator 14 b at the edge of the opening17 fa formed in the insulator 14 b, as illustrated in FIGS. 4C and 4D.In other words, the opening 17 fa formed in the insulator 14 b ispreferably sealed up with the conductor 20 a.

Here, since the insulator 14 b has a function of blocking diffusion ofhydrogen and water, impurities such as hydrogen and water can beprevented from diffusing from the insulator 13 a into the element layerincluding the oxide semiconductor, through the insulator 14 b. Theconductor 20 a has a function of blocking diffusion of hydrogen andwater and is provided so as to fill the opening 17 f of the insulator 14b. This can prevent impurities such as hydrogen and water from diffusinginto the element layer including the oxide semiconductor through theconductor 21 a in the opening 17 f in the insulator 14 b.

Separating the semiconductor substrate from the oxide semiconductor bythe insulator 14 b and the conductor 20 a in this manner can preventimpurities such as hydrogen and water included in the element layerincluding the semiconductor substrate and the like from diffusing intothe upper layers through the plug (conductor 21) or the via hole(opening 17 fa) formed in the insulator 14 b. In particular, in the casewhere a silicon substrate is used as the semiconductor substrate,hydrogen is used to terminate dangling bonds of the silicon substrate;therefore, the amount of hydrogen included in the element layerincluding the semiconductor substrate is large and the hydrogen mightdiffuse into the element layer including the oxide semiconductor.However, the structure described in this embodiment can preventdiffusion of hydrogen into the element layer including the oxidesemiconductor.

The oxide semiconductor is preferably a highly purified intrinsic orsubstantially highly purified intrinsic oxide semiconductor whosecarrier density has been reduced by reducing impurities such as hydrogenand water in the oxide semiconductor, details of which are describedlater. Using the oxide semiconductor to form a transistor can stabilizethe electrical characteristics of the transistor. In addition, using thehighly purified intrinsic or substantially highly purified intrinsicoxide semiconductor can reduce leakage current of the transistor in anoff state. Furthermore, using the highly purified intrinsic orsubstantially highly purified intrinsic oxide semiconductor can improvethe reliability of the transistor.

Note that the shapes of the wiring and plug of this embodiment are notlimited to those illustrated in FIGS. 4C and 4D. The wiring and plugwhich have different shapes from those illustrated in FIGS. 4C and 4Dare described below.

As for the difference in the shapes of the wiring and plug, an opening17 g illustrated in FIG. 6A has a different shape from the opening 17 fillustrated in FIG. 4C. The opening 17 g can be regarded as beingcomposed of an opening 17 ga which is located in the lower part andfunctions as a via hole or a contact hole, and an opening 17 gb which islocated in the upper part and functions as a groove in which a wiringpattern or the like is embedded. The opening 17 ga is formed in theinsulator 13 a and in the lower part of the insulator 14 b, and theopening 17 gb is formed in the insulator 15 c and in the upper part ofthe insulator 14 b. Accordingly, in the structure illustrated in FIG.6A, part of the conductor 20 a and part of the conductor 21 a whichfunction as a wiring and the like are provided so as to be embedded inthe upper part of the insulator 14 b. Here, the inner wall of theopening formed in the insulator 14 b has a step-wise shape formed by theinner wall of the opening 17 ga and the inner wall of the opening 17 gb.

As for the difference in the shapes of the wiring and plug, an opening17 h illustrated in FIG. 6B has a different shape from the opening 17 fillustrated in FIG. 4C. The opening 17 h can be regarded as beingcomposed of an opening 17 ha which is located in the lower part andfunctions as a via hole or a contact hole, and an opening 17 hb which islocated in the upper part and functions as a groove in which a wiringpattern or the like is embedded. The opening 17 ha is formed in thelower part of the insulator 13 a, and the opening 17 hb is formed in theinsulator 15 c and the insulator 14 b and in the upper part of theinsulator 13 a. Accordingly, in the structure illustrated in FIG. 6B,part of the conductor 20 a and part of the conductor 21 a which functionas a wiring and the like are provided so as to be embedded in the upperpart of the insulator 13 a. Here, the inner wall of the opening formedin the insulator 13 a has a step-wise shape formed by the inner wall ofthe opening 17 ha and the inner wall of the opening 17 hb.

As for the difference in the shapes of the wiring and plug, an opening17 i illustrated in FIG. 6C has a different shape from the opening 17 fillustrated in FIG. 4C. The opening 17 i can be regarded as beingcomposed of an opening 17 ia which is located in the lower part andfunctions as a via hole or a contact hole, and an opening 17 ib which islocated in the upper part and functions as a groove in which a wiringpattern or the like is embedded. The opening 17 ia is formed in theinsulator 13 a, and the opening 17 ib is formed in the insulator 15 cand the insulator 14 b. Accordingly, in the structure illustrated inFIG. 6C, part of the conductor 20 a and part of the conductor 21 a whichfunction as a wiring and the like are provided so as to be embedded inthe insulator 14 b. Here, the inner wall of the opening of the insulator14 b has a gently tapered shape.

As for the difference in the shapes of the wiring and plug, an opening17 j illustrated in FIG. 7A has a different shape from the opening 17 fillustrated in FIG. 4C. The opening 17 j can be regarded as beingcomposed of an opening 17 ja which is located in the lower part andfunctions as a via hole or a contact hole, and an opening 17 jb which islocated in the upper part and functions as a groove in which a wiringpattern or the like is embedded. The opening 17 ja is formed in theinsulator 13 a and the insulator 14 b, and the opening 17 jb is formedin the insulator 15 c. Accordingly, in the structure illustrated in FIG.7A, part of the conductor 20 a and part of the conductor 21 a whichfunction as a wiring and the like are provided so as to be embedded inthe insulator 15 c. Here, the inner wall of the opening 17 ja providedin the insulator 13 a and the insulator 14 b is substantiallyperpendicular to the conductor 12. The inner wall of the opening 17 jbprovided in the insulator 15 c is substantially perpendicular to theinsulator 14 b. In the case where the inner wall of the opening issubstantially perpendicular to the conductor 12 or the insulator 14 b insuch a manner, the conductor 20 a is preferably formed by an ALD methodor the like so that the conductor 20 a with a sufficiently largethickness is also formed on the inner wall of the opening.

As for the difference in the shapes of the wiring and plug, an opening17 k illustrated in FIGS. 7B and 7C has a different shape from theopening 17 j illustrated in FIG. 7A. The opening 17 k can be regarded asbeing composed of an opening 17 ka which is located in the lower partand functions as a via hole or a contact hole, and an opening 17 kbwhich is located in the upper part and functions as a groove in which awiring pattern or the like is embedded. As for the shapes of the wiringand the plug illustrated in FIGS. 7B and 7C, a maximum value of thewidth of the opening 17 ka substantially corresponds to a minimum valueof the width of the opening 17 kb. For example, the width of the opening17 ka in the direction of X1-X2 in FIGS. 7B and 7C substantiallycorresponds to the width of the opening 17 kb in the direction of X1-X2.Such a structure can reduce an area occupied by the wiring. In the caseof the opening 17 k having such a shape, for example, the width of theopening 17 a in the hard mask 16 in the direction of X1-X2 shown inFIGS. 1A and 1B is set to substantially correspond to the width of theopening 17 b in the resist mask 18 a in the direction of X1-X2 shown inFIGS. 1C and 1D.

The structure of a wiring and a plug illustrated in FIGS. 8A and 8B isdifferent from that illustrated in FIGS. 4C and 4D in that a conductor24 is provided over the conductor 21 a and the conductor 20 a. Here, aconductor that can be used as the conductor 20 a, e.g., tantalumnitride, may be used as the conductor 24. With such a structure, theconductor 21 a can be wrapped with the conductor 20 a and the conductor24 which are less permeable to hydrogen. Such a structure makes itpossible to effectively block hydrogen diffusing from the conductor 12,the insulator 13 a, and the like and prevent hydrogen from entering theupper layer through the conductor 21 a.

Note that to form the conductor 24, a pattern may be formed bylithography or the like; alternatively, an insulator having an openingsimilar to the insulator 15 c may be provided and the conductor 24 maybe embedded in the opening.

The method for forming a wiring and a plug described in this embodimentis not limited to that described above. A method for forming a wiringand a plug which is different from the above-described method isdescribed below.

The method for forming a wiring and a plug that is different from thatdescribed above is described with reference to FIGS. 9A to 9D, FIGS. 10Ato 10D, FIGS. 11A and 11B, and FIGS. 12A and 12B. A process after thestep shown in FIGS. 12A and 12B follows the step shown in FIGS. 3A and3B.

First, by a method similar to that described above, the conductor 12 isformed, the insulator 13 is formed over the conductor 12, the insulator14 is formed over the insulator 13, and the insulator 15 is formed overthe insulator 14.

Subsequently, a hard mask material 16 b is deposited over the insulator15 by a method similar to the method for depositing the material of thehard mask 16 (see FIGS. 9A and 9B). Here, FIG. 9A corresponds to a crosssection taken along dashed dotted line X1-X2 shown in FIG. 9B. In thesame manner, each cross-sectional view shown in the followingdescription corresponds to a cross section taken along dashed dottedline X1-X2 shown in the corresponding top view.

After that, a resist mask 18 b with an opening 17 m is formed over thehard mask material 16 b. For the formation of the resist mask 18 b, theabove description of the resist mask 18 a can be referred to.

Here, the opening 17 m corresponds to the opening 17 fa to be formedlater, e.g., a via hole or a contact hole. Therefore, the top-view shapeof the opening 17 m corresponds to that of the via hole or the contacthole.

Note that the top-view shape of the opening 17 m is, but not limited to,circular; the top-view shape can alternatively be, for example, ellipticor polygonal, e.g., a triangle or a quadrangle. In the case where apolygonal shape is employed, corners thereof may be rounded.

Next, the hard mask material 16 b is etched using the resist mask 18 bto form a hard mask 16 c with an opening 17 n (see FIGS. 9C and 9D).Here, etching is performed until the top surface of the insulator 15 isexposed in the opening 17 n. Note that dry etching is preferablyemployed for the etching. As a dry etching apparatus, an apparatussimilar to that described above can be used.

Next, the insulator 15 is etched using the resist mask 18 b to form theinsulator 15 a with an opening 17 p. Here, etching is performed untilthe top surface of the insulator 14 is exposed in the opening 17 p. Notethat dry etching is preferably employed for the etching. As a dryetching apparatus, an apparatus similar to that described above can beused.

Next, the insulator 14 is etched using the resist mask 18 b to form theinsulator 14 a with an opening 17 q (see FIGS. 10A and 10B). Here,etching is performed until the top surface of the insulator 13 isexposed in the opening 17 q. Note that dry etching is preferablyemployed for the etching. As a dry etching apparatus, an apparatussimilar to that described above can be used.

Next, the resist mask 18 b is removed (see FIGS. 10C and 10D). For theremoval of the resist mask 18 b, the description of the removal of theresist mask 18 a can be referred to.

Next, a resist mask 26 a with an opening 17 r is formed over the hardmask 16 c. For the formation of the resist mask 26 a, the abovedescription of the resist mask 18 a can be referred to. Note that aresist 26 b might remain in the opening 17 q and the opening 17 p afterthe opening 17 r is formed.

The opening 17 r corresponds to the opening 17 fb to be formed in alater step, i.e., a groove in which a wiring pattern is embedded.Therefore, the top-view shape of the opening 17 r corresponds to that ofthe groove in which the wiring pattern is embedded. The opening 17 qcorresponding to a via hole or a contact hole is preferably formed inthe opening 17 r that corresponds to the groove in which the wiringpattern is embedded. In that case, a minimum value of the width of theopening 17 r is greater than or equal to a maximum value of the width ofthe opening 17 q. For example, the width of the opening 17 r in thedirection of X1-X2 shown in FIGS. 11A and 11B is greater than or equalto the width of the opening 17 q in the direction of the X1-X2 shown inFIGS. 11A and 11B. In that case, the via hole or the contact hole can beformed with a margin with respect to the groove for the wiring pattern.

Next, the hard mask 16 c is etched using the resist mask 26 a to form ahard mask 16 d with an opening 17 s (see FIGS. 12A and 12B). Here,etching is performed until the top surface of the insulator 15 a isexposed in the opening 17 s. Note that dry etching is preferablyemployed for the etching. As a dry etching apparatus, an apparatussimilar to that described above can be used.

Then, the resist mask 26 a is removed. For the removal of the resistmask 26 a, the description of the removal of the resist mask 18 a can bereferred to. Note that in the case where the resist 26 b remains in theopening 17 q and the opening 17 p, the resist 26 b is preferably removedat the same time as removal of the resist mask 26 a.

After the resist mask 18 b is removed, the opening 17 q and the opening17 p may be filled with a filler. A material which can be removed at thesame time as removal of the resist mask 26 a, e.g., any of materialswhich can be removed by dry etching treatment such as theabove-described ashing, can be used as the filler. As such a filler, anamorphous-carbon-based material may be used, for example.

Removing the resist mask 26 a results in the shape illustrated in FIGS.3A and 3B. Thus, after this step, a wiring and a plug are formed byfollowing the step in FIGS. 3C and 3D and the subsequent steps.

<Structure of Transistor Including Oxide Semiconductor Film>

FIGS. 13A and 13B illustrate an example of the structure of a transistor60 a which is formed in the element layer including an oxidesemiconductor. FIG. 13A is a cross-sectional view of the transistor 60 ain a channel length direction A1-A2, and FIG. 13B is a cross-sectionalview of the transistor 60 a in a channel width direction A3-A4. Notethat in this specification, the channel length direction of a transistormeans the direction in which carriers move between a source (sourceregion or source electrode) and a drain (drain region or drainelectrode) in a plane parallel to the substrate, and the channel widthdirection means the direction perpendicular to the channel lengthdirection in the plane parallel to a substrate.

In the cross-sectional views such as FIGS. 13A and 13B, end portions ofsome of patterned conductors, semiconductors, and insulators haveright-angled corners; however, the semiconductor device in thisembodiment is not limited thereto and can have rounded end portions.

The transistor 60 a includes a conductor 62 a, a conductor 62 b, aninsulator 65, an insulator 63, an insulator 64, an insulator 66 a, asemiconductor 66 b, a conductor 68 a, a conductor 68 b, an insulator 66c, an insulator 72, and a conductor 74. Here, the conductor 62 a and theconductor 62 b serve as a back gate of the transistor 60 a, and theinsulator 65, the insulator 63, and the insulator 64 serve as gateinsulating films for the back gate of the transistor 60 a. The conductor68 a and the conductor 68 b serve as a source and a drain of thetransistor 60 a. The insulator 72 serves as a gate insulating film ofthe transistor 60 a, and the conductor 74 serves as a gate of thetransistor 60 a.

Note that as the details are described later, the insulator 66 a and theinsulator 66 c are each sometimes formed using a substance that canfunction as a conductor, a semiconductor, or an insulator when they areused alone. However, when the transistor is formed using a stackincluding the insulator 66 a, the semiconductor 66 b, and the insulator66 c, electrons flow in the semiconductor 66 b, in the vicinity of theinterface between the semiconductor 66 b and the insulator 66 a, and inthe vicinity of the interface between the semiconductor 66 b and theinsulator 66 c; thus, the insulator 66 a and the insulator 66 c have aregion not functioning as a channel of the transistor. For that reason,in this specification and the like, the insulator 66 a and the insulator66 c are not referred to as conductors or semiconductors but referred toas insulators or oxide insulators.

In this embodiment and the like, the term “insulator” can be replacedwith the term “insulating film” or “insulating layer”. In addition, theterm “conductor” can be replaced with the term “conductive film” or“conductive layer”. Moreover, the term “semiconductor” can be replacedwith the term “semiconductor film” or “semiconductor layer”.

In a portion below the transistor 60 a, an insulator 67 with an openingis provided over an insulator 61, the conductor 62 a is provided in theopening, and the conductor 62 b is provided over the conductor 62 a. Theinsulator 66 a, the semiconductor 66 b, and the insulator 66 c overlapat least part of the conductor 62 a and part of the conductor 62 b.Here, the conductor 62 a and the conductor 62 b functioning as the backgate of the transistor 60 a can be formed in parallel with formation ofthe conductor 21 a and the conductor 20 a functioning as the wiring andthe plug. Therefore, the insulator 61, the insulator 67, the conductor62 a, and the conductor 62 b correspond to the insulator 14 b, theinsulator 15 c, the conductor 20 a, and the conductor 21 a,respectively.

The insulator 65 is provided in contact with the conductor 62 a and theconductor 62 b so as to cover top surfaces of the conductor 62 a and theconductor 62 b. The insulator 63 is provided over the insulator 65, andthe insulator 64 is provided over the insulator 63.

Here, it is preferable that part of the conductor 68 a overlap one endof the conductor 62 a and one end of the conductor 62 b in the channellength direction, and that part of the conductor 68 b overlap the otherend of the conductor 62 a and the other end of the conductor 62 b in thechannel length direction. The conductor 62 a and the conductor 62 bprovided as described above can sufficiently overlap a region in thesemiconductor 66 b which is between the conductor 68 a and the conductor68 b, that is, a channel formation region in the semiconductor 66 b.Accordingly, with the use of the conductor 62 a and the conductor 62 b,the threshold voltage of the transistor 60 a can be controlled moreeffectively.

The insulator 66 a is provided over the insulator 64, and thesemiconductor 66 b is provided in contact with at least part of the topsurface of the insulator 66 a. Although end portions of the insulator 66a and the semiconductor 66 b are substantially aligned in FIGS. 13A and13B, the structure of the semiconductor device described in thisembodiment is not limited to this example.

The conductor 68 a and the conductor 68 b are formed in contact with atleast part of the top surface of the semiconductor 66 b. The conductor68 a and the conductor 68 b are spaced and are preferably formed to faceeach other with the conductor 74 provided therebetween as illustrated inFIG. 13A.

The insulator 66 c is provided in contact with at least part of the topsurface of the semiconductor 66 b. The insulator 66 c covers part of thetop surface of the conductor 68 a, part of the top surface of theconductor 68 b, and the like, and is preferably in contact with part ofthe top surface of the semiconductor 66 b between the conductor 68 a andthe conductor 68 b.

The insulator 72 is provided over the insulator 66 c. The insulator 72is preferably in contact with part of the top surface of the insulator66 c between the conductor 68 a and the conductor 68 b.

The conductor 74 is provided over the insulator 72. The conductor 74 ispreferably in contact with part of the top surface of the insulator 72between the conductor 68 a and the conductor 68 b.

An insulator 79 is provided to cover the conductor 74. Note that theinsulator 79 is not necessarily provided.

The structure of the transistor 60 a is not limited to that illustratedin FIGS. 13A and 13B. For example, side surfaces of the insulator 66 c,the insulator 72, and the conductor 74 in the direction of A1-A2 may bealigned. In addition, for example, the insulator 66 c and/or theinsulator 72 may cover the insulator 66 a, the semiconductor 66 b, theconductor 68 a, and the conductor 68 b and may be in contact with thetop surface of the insulator 64.

Note that the conductor 74 may be connected to the conductor 62 bthrough an opening formed in the insulator 72, the insulator 66 c, theinsulator 64, the insulator 63, the insulator 65, and the like.

An insulator 77 is provided over the insulator 64, the conductor 68 a,the conductor 68 b, and the conductor 74. In addition, an insulator 78is provided over the insulator 77.

<Oxide Semiconductor>

An oxide semiconductor used as the semiconductor 66 b is describedbelow.

The oxide semiconductor preferably contains at least indium or zinc. Inparticular, indium and zinc are preferably contained. In addition,aluminum, gallium, yttrium, tin, or the like is preferably contained.Furthermore, one or more elements selected from boron, silicon,titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum,cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and the likemay be contained.

Here, the case where the oxide semiconductor contains indium, an elementM, and zinc is considered. The element M is aluminum, gallium, yttrium,tin, or the like. Other elements that can be used as the element Minclude boron, silicon, titanium, iron, nickel, germanium, zirconium,molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten,and magnesium. Note that two or more of the above elements may be usedin combination as the element M.

Next, preferred ranges of atomic ratios of indium to the element M andzinc in the oxide semiconductor according to the present invention willbe described with reference to FIGS. 26A to 26C. Note that theproportion of oxygen atoms is not illustrated in FIGS. 26A to 26C. Theterms of the atomic ratio of indium to the element M and zinc in theoxide semiconductor are denoted by [In], [M], and [Zn], respectively.

In FIGS. 26A to 26C, dashed lines correspond to a line representing theatomic ratio of [In]:[M]:[Zn]=(1+α):(1−α):1 (−1≤α≤1), a linerepresenting the atomic ratio of [In]:[M]:[Zn]=(1+α):(1−α):2, a linerepresenting the atomic ratio of [In]:[M]:[Zn]=(1+α):(1−α):3, a linerepresenting the atomic ratio of [In]:[M]:[Zn]=(1+α):(1−α):4, and a linerepresenting the atomic ratio of [In]:[M]:[Zn]=(1+α):(1−α):5.

Dashed-dotted lines correspond to a line representing the atomic ratioof [In]:[M]:[Zn]=1:1:β (β≥0), a line representing the atomic ratio of[In]:[M]:[Zn]=1:2:β, a line representing the atomic ratio of[In]:[M]:[Zn]=1:3:β, a line representing the atomic ratio of[In]:[M]:[Zn]=1:4:β, a line representing the atomic ratio of[In]:[M]:[Zn]=2:1:β, and a line representing the atomic ratio of[In]:[M]:[Zn]=5:1:β.

An oxide semiconductor having the atomic ratio of [In]:[M]:[Zn]=0:2:1 ora neighborhood thereof in FIGS. 26A to 26C tends to have a spinelcrystal structure.

FIGS. 26A and 26B illustrate examples of the preferred ranges of theatomic ratios of indium to the element M and zinc contained in an oxidesemiconductor in one embodiment of the present invention.

FIG. 27 illustrates an example of the crystal structure of InMZnO₄ withan atomic ratio of [In]:[M]:[Zn]=1:1:1. The crystal structureillustrated in FIG. 27 is InMZnO₄ observed from a direction parallel toa b-axis. Note that a metal element in a layer that contains M, Zn, andoxygen (hereinafter, this layer is referred to as an “(M,Zn) layer”) inFIG. 27 represents the element M or zinc. In that case, the proportionof the element M is the same as the proportion of zinc. The element Mand zinc can be replaced with each other, and their arrangement israndom.

Note that InMZnO₄ has a layered crystal structure (also referred to as alayered structure) and includes one layer that contains indium andoxygen (hereinafter referred to as an In layer) for every two (M,Zn)layers that contain the element M, zinc, and oxygen, as illustrated inFIG. 27.

Indium and the element M can be replaced with each other. Therefore,when the element M in the (M,Zn) layer is replaced by indium, the layercan also be referred to as an (In,M,Zn) layer. In that case, a layeredstructure that includes one In layer for every two (In,M,Zn) layers isobtained.

An oxide semiconductor with an atomic ratio of [In]:[M]:[Zn]=1:1:2 has alayered structure that includes one In layer for every three (M,Zn)layers. In other words, if [Zn] is larger than [In] and [M], theproportion of (M,Zn) layers to In layers becomes higher when the oxidesemiconductor is crystallized.

Note that in the case where the number of (M,Zn) layers for every Inlayer is not an integer in the oxide semiconductor, the oxidesemiconductor might have a plurality of kinds of layered structureswhere the number of (M,Zn) layers for every In layer is an integer. Forexample, in the case of [In]:[M]:[Zn]=1:1:1.5, the oxide semiconductormight have the following layered structures: a layered structure thatincludes one In layer for every two (M,Zn) layers and a layeredstructure that includes one In layer for every three (M,Zn) layers.

For example, in the case where the oxide semiconductor is deposited witha sputtering apparatus, a film having an atomic ratio deviated from theatomic ratio of a target is formed. In particular, [Zn] in the filmmight be smaller than [Zn] in the target depending on the substratetemperature in deposition.

In some cases, a plurality of phases (two, three, or more phases)coexist in the oxide semiconductor. For example, in the case of theatomic ratio of [In]:[M]:[Zn]=0:2:1 or a neighborhood thereof, twophases, i.e., a spinel crystal structure and a layered crystalstructure, tend to coexist. In the case of the atomic ratio of[In]:[M]:[Zn]=1:0:0 or a neighborhood thereof, two phases, i.e., abixbyite crystal structure and a layered crystal structure, tend tocoexist. In the case where a plurality of phases coexist in an oxidesemiconductor, a grain boundary might be formed between differentcrystal structures.

In addition, an oxide semiconductor containing indium in a higherproportion can have higher carrier mobility (electron mobility). This isbecause in an oxide semiconductor containing indium, the element M, andzinc, the s orbital of heavy metal mainly contributes to carriertransfer, and when the indium content in the oxide semiconductor isincreased, overlaps of the s orbitals of In atoms are increased;therefore, an oxide semiconductor having a high content of indium hashigher carrier mobility than an oxide semiconductor having a low contentof indium.

In contrast, when the indium content and the zinc content in an oxidesemiconductor become lower, carrier mobility becomes lower. Thus, withan atomic ratio of [In]:[M]:[Zn]=0:1:0 and neighborhoods thereof (e.g.,a region C in FIG. 26C), insulation performance becomes better.

Accordingly, an oxide semiconductor in one embodiment of the presentinvention preferably has an atomic ratio represented by a region A inFIG. 26A. With the atomic ratio, a layered structure with high carriermobility and a few grain boundaries is easily obtained.

A region B in FIG. 26B represents atomic ratios from [In]:[M]:[Zn]=4:2:3to [In]:[M]:[Zn]=4:2:4.1 and neighborhoods thereof. The neighborhoodsinclude an atomic ratio of [In]:[M]:[Zn]=5:3:4. An oxide semiconductorwith an atomic ratio represented by the region B is an excellent oxidesemiconductor that has particularly high crystallinity and high carriermobility.

Note that conditions where a layered structure of an oxide semiconductoris formed are not uniquely determined by the atomic ratio. The atomicratio affects difficulty in forming a layered structure. Even oxidesemiconductors with the same atomic ratio have a layered structure insome cases, but not in others, depending on formation conditions.Therefore, the illustrated regions show atomic ratios at which a layeredstructure of an oxide semiconductor can be formed; boundaries of theregions A to C are not clear.

Next, the case where the oxide semiconductor is used for a transistorwill be described.

Note that when the oxide semiconductor is used for a transistor, carrierscattering or the like at a grain boundary can be reduced; thus, thetransistor can have high field-effect mobility. In addition, thetransistor can have high reliability.

An oxide semiconductor with low carrier density is preferably used forthe transistor. For example, an oxide semiconductor whose carrierdensity is lower than 8×10¹¹/cm³, preferably lower than 1×10¹¹/cm³,further preferably lower than 1×10¹⁰/cm³, and greater than or equal to1×10⁻⁹/cm³ is used.

A highly purified intrinsic or substantially highly purified intrinsicoxide semiconductor has few carrier generation sources, and thus canhave a low carrier density. A highly purified intrinsic or substantiallyhighly purified intrinsic oxide semiconductor has a low density ofdefect states and accordingly has a low density of trap states in somecases.

Charges trapped by the trap states in the oxide semiconductor take along time to be released and may behave like fixed charges. Thus, thetransistor whose channel region is formed in the oxide semiconductorhaving a high density of trap states has unstable electricalcharacteristics in some cases.

To obtain stable electrical characteristics of the transistor, it iseffective to reduce the concentration of impurities in the oxidesemiconductor. In addition, to reduce the concentration of impurities inthe oxide semiconductor, the concentration of impurities in a film thatis adjacent to the oxide semiconductor is preferably reduced. Examplesof impurities include hydrogen, nitrogen, alkali metal, alkaline earthmetal, iron, nickel, and silicon.

Here, the influence of impurities in the oxide semiconductor will bedescribed.

When silicon or carbon that is one of Group 14 elements is contained inthe oxide semiconductor, defect states are formed. Thus, theconcentration of silicon or carbon in the oxide semiconductor and aroundan interface with the oxide semiconductor (measured by secondary ionmass spectrometry (SIMS)) is set lower than or equal to 2×10¹⁸atoms/cm³, and preferably lower than or equal to 2×10¹⁷ atoms/cm³.

When the oxide semiconductor contains alkali metal or alkaline earthmetal, defect states are formed and carriers are generated, in somecases. Thus, a transistor including an oxide semiconductor whichcontains alkali metal or alkaline earth metal is likely to benormally-on. Therefore, it is preferable to reduce the concentration ofalkali metal or alkaline earth metal in the oxide semiconductor.Specifically, the concentration of alkali metal or alkaline earth metalin the oxide semiconductor, which is measured by SIMS, is lower than orequal to 1×10¹⁸ atoms/cm³, preferably lower than or equal to 2×10¹⁶atoms/cm³.

When the oxide semiconductor contains nitrogen, the oxide semiconductoreasily becomes n-type by generation of electrons serving as carriers andan increase of carrier density. Thus, a transistor including an oxidesemiconductor which contains nitrogen is likely to be normally-on. Forthis reason, nitrogen in the oxide semiconductor is preferably reducedas much as possible; the nitrogen concentration measured by SIMS is set,for example, lower than 5×10¹⁹ atoms/cm³, preferably lower than or equalto 5×10¹⁸ atoms/cm³, further preferably lower than or equal to 1×10¹⁸atoms/cm³, and still further preferably lower than or equal to 5×10¹⁷atoms/cm³.

Hydrogen contained in an oxide semiconductor reacts with oxygen bondedto a metal atom to be water, and thus causes an oxygen vacancy, in somecases. Due to entry of hydrogen into the oxygen vacancy, an electronserving as a carrier is generated in some cases. Furthermore, in somecases, bonding of part of hydrogen to oxygen bonded to a metal atomcauses generation of an electron serving as a carrier. Thus, atransistor including an oxide semiconductor that contains hydrogen islikely to be normally-on. Accordingly, it is preferable that hydrogen inthe oxide semiconductor be reduced as much as possible. Specifically,the hydrogen concentration measured by SIMS is set lower than 1×10²⁰atoms/cm³, preferably lower than 1×10¹⁹ atoms/cm³, further preferablylower than 5×10¹⁸ atoms/cm³, and still further preferably lower than1×10¹⁸ atoms/cm³.

When an oxide semiconductor with sufficiently reduced impurityconcentration is used for a channel formation region in a transistor,the transistor can have stable electrical characteristics. Furthermore,a highly purified intrinsic or substantially highly purified intrinsicoxide semiconductor has an extremely low off-state current; theoff-state current can be less than or equal to the measurement limit ofa semiconductor parameter analyzer, i.e., less than or equal to 1×10⁻¹³A, at a voltage (drain voltage) between a source electrode and a drainelectrode of from 1 V to 10 V even when an element has a channel width Wof 1×10⁶ μm and a channel length L of 10 μm.

The case where the semiconductor 66 b that is the oxide semiconductor ofthe transistor 60 a has a two-layer structure or three-layer structureis described below. A band diagram in which insulators are in contactwith the stacked-layer structure of the insulator 66 a, thesemiconductor 66 b, and the insulator 66 c, and a band diagram in whichinsulators are in contact with the stacked-layer structure of thesemiconductor 66 b and the insulator 66 c are described using FIGS. 28Aand 28B.

FIG. 28A shows an example of a band diagram along the thicknessdirection of a stacked-layer structure including an insulator I1, theinsulator 66 a (51), the semiconductor 66 b (S2), the insulator 66 c(S3), and an insulator I2. FIG. 28B is an example of a band diagramalong the thickness direction of a stacked-layer structure including theinsulator I1, the semiconductor 66 b (S2), the insulator 66 c (S3), andthe insulator I2. For easy understanding, these band diagrams show theenergy levels (Ec) of the conduction band minimum of the insulator I1,the insulator 66 a, the semiconductor 66 b, the insulator 66 c, and theinsulator I2.

The energy levels of the conduction band minimum of the insulator 66 aand the insulator 66 c are closer to the vacuum level than that of thesemiconductor 66 b; typically, a difference in the energy level of theconduction band minimum between the semiconductor 66 b and each of theinsulators 66 a and 66 c be preferably greater than or equal to 0.15 eVor greater than or equal to 0.5 eV, and less than or equal to 2 eV orless than or equal to 1 eV. In other words, it is preferable that theelectron affinity of the semiconductor 66 b be greater than or equal tothat of each of the insulator 66 a and the insulator 66 c, and that thedifference in electron affinity between the semiconductor 66 b and eachof the insulator 66 a and the insulator 66 c be greater than or equal to0.15 eV or greater than or equal to 0.5 eV, and less than or equal to 2eV or less than or equal to 1 eV.

As illustrated in FIGS. 28A and 28B, the energy level of the conductionband minimum gradually changes between the insulator 66 a and thesemiconductor 66 b and between the semiconductor 66 b and the insulator66 c. In other words, the energy level of the conduction band minimum iscontinuously varied or continuously connected. To obtain such banddiagrams, the density of defect states in a mixed layer formed at aninterface between the insulator 66 a and the semiconductor 66 b or aninterface between the semiconductor 66 b and the insulator 66 c ispreferably made low.

Specifically, when the insulator 66 a and the semiconductor 66 b or thesemiconductor 66 b and the insulator 66 c contain the same element (as amain component) in addition to oxygen, a mixed layer with a low densityof defect states can be formed. For example, in the case where thesemiconductor 66 b is an In—Ga—Zn oxide semiconductor, it is preferableto use an In—Ga—Zn oxide semiconductor, a Ga—Zn oxide semiconductor,gallium oxide, or the like as each of the insulator 66 a and theinsulator 66 c.

At this time, the semiconductor 66 b serves as a main carrier path.Since the density of defect states at the interface between theinsulator 66 a and the semiconductor 66 b and the interface between thesemiconductor 66 b and the insulator 66 c can be made low, the influenceof interface scattering on carrier conduction is small, and a highon-state current can be obtained.

Note that when a high gate voltage is applied, current also flows in theinsulator 66 a near the interface with the semiconductor 66 b and in theinsulator 66 c near the interface with the semiconductor 66 b in somecases.

As described above, the insulator 66 a and the insulator 66 c are formedusing a substance that can function as a conductor, a semiconductor, oran insulator when they are used alone. However, when the transistor isformed using a stack including the insulator 66 a, the semiconductor 66b, and the insulator 66 c, electrons flow in the semiconductor 66 b, inthe vicinity of the interface between the semiconductor 66 b and theinsulator 66 a, and in the vicinity of the interface between thesemiconductor 66 b and the insulator 66 c; thus, the insulator 66 a andthe insulator 66 c have a region not functioning as a channel of thetransistor. For that reason, in this specification and the like, theinsulator 66 a and the insulator 66 c are not referred to as conductorsor semiconductors but referred to as insulators or oxide insulators.Note that the reason why the insulator 66 a and the insulator 66 c arereferred to as an insulator or an oxide insulator is because they arecloser to an insulator than the semiconductor 66 b is in terms of theirfunctions in the transistor; thus, a substance that can be used for thesemiconductor 66 b is used for the insulator 66 a and the insulator 66 cin some cases.

When an electron is trapped in a trap state, the trapped electronbehaves like fixed charge; thus, the threshold voltage of the transistoris shifted in a positive direction. The insulator 66 a and the insulator66 c can make the trap state apart from the semiconductor 66 b. Thisstructure can prevent the positive shift of the threshold voltage of thetransistor.

A material whose conductivity is sufficiently lower than that of thesemiconductor 66 b is used for the insulator 66 a and the insulator 66c. In that case, the semiconductor 66 b, the interface between thesemiconductor 66 b and the insulator 66 a, and the interface between thesemiconductor 66 b and the insulator 66 c mainly function as a channelregion. For example, an oxide semiconductor with high insulationperformance and the atomic ratio represented by the region C in FIG. 26Cmay be used for the insulator 66 a and the insulator 66 c. Note that theregion C in FIG. 26C represents the atomic ratio of [In]:[M]:[Zn]=0:1:0or the vicinity thereof.

In the case where an oxide semiconductor with the atomic ratiorepresented by the region A is used as the semiconductor 66 b, it isparticularly preferable to use an oxide semiconductor with [M]/[In] ofgreater than or equal to 1, preferably greater than or equal to 2, aseach of the insulator 66 a and the insulator 66 c. In addition, it ispreferable to use an oxide semiconductor with sufficiently highinsulation performance and [M]/([Zn]+[In]) of greater than or equal to 1as the insulator 66 c.

The insulator 66 a, the semiconductor 66 b, and the insulator 66 c canbe formed by a sputtering method, a CVD method, an MBE method, a PLDmethod, an ALD method, or the like.

The insulator 66 a, the semiconductor 66 b, and the insulator 66 c arepreferably subjected to substrate heating during the deposition orsubjected to heat treatment after the deposition. Such heat treatmentcan reduce water or hydrogen included in the insulator 66 a, thesemiconductor 66 b, the insulator 66 c, and the like. Furthermore,excess oxygen can be supplied to the insulator 66 a, the semiconductor66 b, and the insulator 66 c in some cases. The heat treatment isperformed at a temperature higher than or equal to 250° C. and lowerthan or equal to 650° C., preferably higher than or equal to 300° C. andlower than or equal to 450° C., and further preferably higher than orequal to 350° C. and lower than or equal to 400° C. The heat treatmentis performed in an inert gas atmosphere or an atmosphere containing anoxidizing gas at 10 ppm or more, 1% or more, or 10% or more. The heattreatment may be performed under a reduced pressure. Alternatively, theheat treatment may be performed in such a manner that heat treatment isperformed in an inert gas atmosphere, and then another heat treatment isperformed in an atmosphere containing an oxidizing gas at 10 ppm ormore, 1% or more, or 10% or more in order to compensate released oxygen.For the heat treatment, lamp heating can be performed with use of an RTAapparatus. Heat treatment with an RTA apparatus is effective for animprovement in productivity because it needs short time as compared withthe case of using a furnace.

Note that in the case where tantalum nitride is used for the conductor62 a serving as the back gate of the transistor, the conductor 20 aforming the wiring and the plug illustrated in FIGS. 4A to 4D, or thelike, the temperature of the above heat treatment may be set to higherthan or equal to 350° C. and lower than or equal to 410° C., preferablyhigher than or equal to 370° C. and lower than or equal to 400° C. Theheat treatment within such a temperature range can prevent release ofhydrogen from the tantalum nitride film.

In addition, regions of the semiconductor 66 b or the insulator 66 cthat are in contact with the conductor 68 a and the conductor 68 binclude low-resistance regions in some cases. The low-resistance regionsare mainly formed when oxygen is extracted by the conductor 68 a and theconductor 68 b that are in contact with the semiconductor 66 b, or whena conductive material in the conductor 68 a or the conductor 68 b isbonded to an element in the semiconductor 66 b. The formation of thelow-resistance regions leads to a reduction in contact resistancebetween the conductor 68 a or 68 b and the semiconductor 66 b, wherebythe transistor 60 a can have a large on-state current.

The semiconductor 66 b might have a smaller thickness in a regionbetween the conductor 68 a and the conductor 68 b than in a regionoverlapping the conductor 68 a or the conductor 68 b. This is becausepart of the top surface of the semiconductor 66 b is removed at the timeof formation of the conductor 68 a and the conductor 68 b. In formationof the conductor to be the conductor 68 a and the conductor 68 b, aregion with low resistance like the above low-resistance regions isformed on the top surface of the semiconductor 66 b in some cases. Theremoval of the region that is on the top surface of the semiconductor 66b and between the conductor 68 a and the conductor 68 b can prevent achannel from being formed in the low-resistance region on the topsurface of the semiconductor 66 b.

Note that the three-layer structure including the insulator 66 a, thesemiconductor 66 b, and the insulator 66 c is an example. For example, atwo-layer structure not including the insulator 66 a or the insulator 66c may be employed. Alternatively, a single-layer structure not includingthe insulator 66 a and the insulator 66 c may be employed. Furtheralternatively, it is possible to employ an n-layer structure (n is aninteger of four or more) that includes any of the insulator,semiconductor, and conductor given as examples of the insulator 66 a,the semiconductor 66 b, and the insulator 66 c.

<Insulator and Conductor>

Components other than the semiconductor of the transistor 60 a aredescribed in detail below.

As the insulator 61, an insulator having a function of blocking hydrogenor water is used. Hydrogen and water in the insulator that is providedin the vicinity of the insulator 66 a, the semiconductor 66 b, and theinsulator 66 c cause carriers to be generated in the insulator 66 a, thesemiconductor 66 b, and the insulator 66 c that also function as oxidesemiconductors. Because of this, the reliability of the transistor 60 amight be decreased. In particular, when silicon or the like is used in asemiconductor substrate 91, hydrogen is used to terminate dangling bondsof the semiconductor substrate; thus, the hydrogen might diffuse intothe transistor including the oxide semiconductor. In that case, theinsulator 61 that has a function of blocking hydrogen or water caninhibit diffusion of hydrogen or water from layers below the transistorincluding the oxide semiconductor, increasing the reliability of thetransistor including the oxide semiconductor. It is preferable that theinsulator 61 be less permeable to hydrogen or water than the insulator65 and the insulator 64.

The insulator 61 preferably has a function of blocking oxygen. When theinsulator 61 blocks oxygen diffused from the insulator 64, oxygen can beeffectively supplied from the insulator 64 to the insulator 66 a, thesemiconductor 66 b, and the insulator 66 c.

The insulator 61 can be formed using, for example, aluminum oxide,aluminum oxynitride, gallium oxide, gallium oxynitride, yttrium oxide,yttrium oxynitride, hafnium oxide, or hafnium oxynitride. The use ofsuch a material enables the insulator 61 to function as an insulatingfilm having an effect of blocking diffusion of oxygen, hydrogen, orwater. The insulator 61 can be formed using, for example, siliconnitride or silicon nitride oxide. The use of such a material enables theinsulator 61 to function as an insulating film having an effect ofblocking diffusion of hydrogen or water. Note that the insulator 61 canbe formed by a sputtering method, a CVD method, an MBE method, a PLDmethod, an ALD method, or the like.

The insulator 67 may be formed to have a single-layer structure or astacked-layer structure including an insulator containing, for example,boron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon,phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium,lanthanum, neodymium, hafnium, or tantalum. Note that the insulator 67can be formed by a sputtering method, a CVD method, an MBE method, a PLDmethod, an ALD method, or the like.

The semiconductor 66 b in a region between the conductor 68 a and theconductor 68 b preferably overlaps at least part of the conductors 62 aand 62 b. The conductor 62 a and the conductor 62 b function as a backgate of the transistor 60 a. The conductor 62 a and the conductor 62 benable control of the threshold voltage of the transistor 60 a. Controlof the threshold voltage can prevent the transistor 60 a from beingturned on when a low voltage, e.g., a voltage of 0 V or lower, isapplied to the gate (conductor 74) of the transistor 60 a. Thus, theelectrical characteristics of the transistor 60 a can be easily madenormally-off characteristics.

Note that the conductors 62 a and 62 b functioning as a back gate may beconnected to a wiring or a terminal to which a predetermined potentialis supplied. For example, the conductors 62 a and 62 b may be connectedto a wiring to which a constant potential is supplied. The constantpotential can be a high power supply potential or a low power supplypotential such as a ground potential.

Any of the conductors that can be used as the conductor 20 can be usedas the conductor 62 a, and any of the conductors that can be used as theconductor 21 can be used as the conductor 62 b.

The insulator 65 is provided to cover the conductors 62 a and 62 b. Aninsulator similar to the insulator 64 or the insulator 72 to bedescribed later can be used as the insulator 65.

The insulator 63 is provided to cover the insulator 65. The insulator 63preferably has a function of blocking oxygen. Such an insulator 63 canprevent extraction of oxygen from the insulator 64 by the conductor 62 aand the conductor 62 b. Accordingly, oxygen can be effectively suppliedfrom the insulator 64 to the insulator 66 a, the semiconductor 66 b, andthe insulator 66 c. By improving the coverage with the insulator 63,extraction of oxygen from the insulator 64 can be further reduced andoxygen can be more effectively supplied from the insulator 64 to theinsulator 66 a, the semiconductor 66 b, and the insulator 66 c.

As the insulator 63, an oxide or a nitride containing boron, aluminum,silicon, scandium, titanium, gallium, yttrium, zirconium, indium,lanthanum, cerium, neodymium, hafnium, or thallium is used. It ispreferable to use hafnium oxide or aluminum oxide. Note that theinsulator 63 can be formed by a sputtering method, a CVD method, an MBEmethod, a PLD method, an ALD method, or the like.

Of the insulators 65, 63, and 64, the insulator 63 preferably includesan electron trap region. When the insulator 65 and the insulator 64 havea function of inhibiting release of electrons, the electrons trapped inthe insulator 63 behave as if they are negative fixed charges. Thus, theinsulator 63 has a function of a floating gate.

The amounts of hydrogen and water contained in the insulator 64 arepreferably small. For example, the insulator 64 may be formed to have asingle-layer structure or a stacked-layer structure including aninsulator containing boron, carbon, nitrogen, oxygen, fluorine,magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium,germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, ortantalum. The insulator 64 may be formed using aluminum oxide, magnesiumoxide, silicon oxide, silicon oxynitride, silicon nitride oxide, siliconnitride, gallium oxide, germanium oxide, yttrium oxide, zirconium oxide,lanthanum oxide, neodymium oxide, hafnium oxide, or tantalum oxide. Itis preferable to use silicon oxide or silicon oxynitride. Note that theinsulator 64 can be formed by a sputtering method, a CVD method, an MBEmethod, a PLD method, an ALD method, or the like.

The insulator 64 preferably contains excess oxygen. Such an insulator 64makes it possible to supply oxygen from the insulator 64 to theinsulator 66 a, the semiconductor 66 b, and the insulator 66 c. Theoxygen can reduce oxygen vacancies which are to be defects in theinsulator 66 a, the semiconductor 66 b, and the insulator 66 c which areoxide semiconductors. As a result, the insulator 66 a, the semiconductor66 b, and the insulator 66 c, can be oxide semiconductors with a lowdensity of defect states and stable characteristics.

In this specification and the like, excess oxygen refers to oxygen inexcess of the stoichiometric composition, for example. Alternatively,excess oxygen refers to oxygen released from a film or layer containingthe excess oxygen by heating, for example. Excess oxygen can move insidea film or a layer. Excess oxygen moves between atoms in a film or alayer, or replaces oxygen that is a constituent of a film or a layer andmoves like a billiard ball, for example.

The insulator 64 including excess oxygen releases oxygen molecules, thenumber of which is greater than or equal to 1.0×10¹⁴ molecules/cm² andless than or equal to 1.0×10¹⁶ molecules/cm², preferably greater than orequal to 1.0×10¹⁵ molecules/cm² and less than or equal to 5.0×10¹⁵molecules/cm² in thermal desorption spectroscopy (TDS) analysis in therange of surface temperatures of 100° C. to 700° C. or 100° C. to 500°C.

A method for measuring the number of released molecules using TDSanalysis is described below by taking the amount of released oxygen asan example.

The total amount of gas released from a measurement sample in TDSanalysis is proportional to the integral value of the ion intensity ofthe released gas. Then, comparison with a reference sample is made,whereby the total amount of released gas can be calculated.

For example, the number of oxygen molecules (N_(O2)) released from ameasurement sample can be calculated according to the following formulausing the TDS results of a silicon substrate containing hydrogen at apredetermined density, which is a reference sample, and the TDS resultsof the measurement sample. Here, all gases having a mass-to-charge ratioof 32 which are obtained in the TDS analysis are assumed to originatefrom an oxygen molecule. Note that CH₃OH, which is a gas having themass-to-charge ratio of 32, is not taken into consideration because itis unlikely to be present. Further, an oxygen molecule including anoxygen atom having a mass number of 17 or 18 which is an isotope of anoxygen atom is also not taken into consideration because the proportionof such a molecule in the natural world is minimal.N_(O2)=N_(H2)/S_(H2)×S_(O2) ×a

A value N_(H2) is obtained by conversion of the amount of hydrogenmolecules released from the standard sample into densities. A valueS_(H2) is the integral value of ion intensity when the standard sampleis subjected to TDS analysis. Here, the reference value of the standardsample is set to N_(H2)/S_(H2). S_(O2) is the integral value of ionintensity when the measurement sample is analyzed by TDS. α is acoefficient which influences the ion intensity in the TDS analysis.Refer to Japanese Published Patent Application No. H6-275697 for detailsof the above formula. The amount of released oxygen was measured with athermal desorption spectroscopy apparatus produced by ESCO Ltd.,EMD-WA1000S/W, using a silicon substrate containing certain amount ofhydrogen atoms as the reference sample.

Further, in the TDS analysis, oxygen is partly detected as an oxygenatom. The ratio of oxygen molecules and oxygen atoms can be calculatedfrom the ionization rate of the oxygen molecules. Note that since theabove α includes the ionization rate of the oxygen molecules, the amountof the released oxygen atoms can also be estimated through themeasurement of the amount of the released oxygen molecules.

Note that N_(O2) is the amount of the released oxygen molecules. Theamount of released oxygen in the case of being converted into oxygenatoms is twice the amount of the released oxygen molecules.

Furthermore, the insulator from which oxygen is released by heattreatment may contain a peroxide radical. Specifically, the spin densityattributed to the peroxide radical is greater than or equal to 5×10¹⁷spins/cm³. Note that the insulator containing a peroxide radical mayhave an asymmetric signal with a g factor of approximately 2.01 in ESR.

The insulator 64 or the insulator 63 may have a function of preventingdiffusion of impurities from the lower layers.

As described above, the top surface or the bottom surface of thesemiconductor 66 b preferably has high planarity. Thus, to improve theplanarity, the top surface of the insulator 64 may be subjected toplanarization treatment performed by CMP process or the like.

The conductor 68 a and the conductor 68 b function as the sourceelectrode and the drain electrode of the transistor 60 a.

The conductor 68 a and the conductor 68 b may each be formed so as tohave a single-layer structure or a stacked-layered structure including aconductor containing, for example, one or more kinds of boron, nitrogen,oxygen, fluorine, silicon, phosphorus, aluminum, titanium, chromium,manganese, cobalt, nickel, copper, zinc, gallium, yttrium, zirconium,molybdenum, ruthenium, silver, indium, tin, tantalum, and tungsten. Forexample, the conductor 68 a and the conductor 68 b each may have astacked-layered structure in which tungsten is stacked over tantalumnitride. As the conductor 68 a and the conductor 68 b, for example, analloy or a compound may be used, and a conductor containing aluminum, aconductor containing copper and titanium, a conductor containing copperand manganese, a conductor containing indium, tin, and oxygen, aconductor containing titanium and nitrogen, or the like may be used. Theconductor 68 a and the conductor 68 b can be formed by a sputteringmethod, a CVD method, an MBE method, a PLD method, an ALD method, or thelike.

The insulator 72 functions as a gate insulating film of the transistor60 a. Like the insulator 64, the insulator 72 may be an insulatorcontaining excess oxygen. Such an insulator 72 makes it possible tosupply oxygen from the insulator 72 to the insulator 66 a, thesemiconductor 66 b, and the insulator 66 c.

The insulator 72 and the insulator 77 may each be formed to have, forexample, a single-layer structure or a stacked-layer structure includingan insulator containing boron, carbon, nitrogen, oxygen, fluorine,magnesium, aluminum, silicon, phosphorus, chlorine, argon, gallium,germanium, yttrium, zirconium, lanthanum, neodymium, hafnium, ortantalum. The insulator 72 and the insulator 77 may each be formedusing, for example, aluminum oxide, magnesium oxide, silicon oxide,silicon oxynitride, silicon nitride oxide, silicon nitride, galliumoxide, germanium oxide, yttrium oxide, zirconium oxide, lanthanum oxide,neodymium oxide, hafnium oxide, or tantalum oxide. The insulator 72 andthe insulator 77 can be formed by a sputtering method, a CVD method, anMBE method, a PLD method, an ALD method, or the like.

The insulator 77 preferably contains excess oxygen. Such an insulator 77makes it possible to supply oxygen from the insulator 77 to theinsulator 66 a, the semiconductor 66 b, and the insulator 66 c. Theoxygen can reduce oxygen vacancies which are to be defects in theinsulator 66 a, the semiconductor 66 b, and the insulator 66 c which areoxide semiconductors. As a result, the insulator 66 a, the semiconductor66 b, and the insulator 66 c can be oxide semiconductors with a lowdensity of defect states and stable characteristics.

The insulator 77 including excess oxygen releases oxygen molecules, thenumber of which is greater than or equal to 1.0×10¹⁴ molecules/cm² andless than or equal to 1.0×10¹⁶ molecules/cm², preferably greater than orequal to 1.0×10¹⁵ molecules/cm² and less than or equal to 5.0×10¹⁵molecules/cm² in thermal desorption spectroscopy (TDS) analysis in therange of surface temperatures of 100° C. to 700° C. or 100° C. to 500°C.

It is preferable that the amount of impurities such as hydrogen, water,and nitrogen oxide (NO_(x), e.g., nitrogen monoxide and nitrogendioxide) contained in the insulator 77 be small. Such an insulator 77can prevent impurities such as hydrogen, water, and nitrogen oxide fromdiffusing from the insulator 77 into the insulator 66 a, thesemiconductor 66 b, and the insulator 66 c, so that the semiconductor 66b can have a low density of defect states and stable characteristics.

Here, the number of H₂O molecules released from the insulator 77 is lessthan or equal to 3.80×10¹⁵ molecules/cm², preferably less than or equalto 2.40×10¹⁵ molecules/cm² in TDS analysis in the range of surfacetemperatures from 200° C. to 560° C. It is further preferable that thenumber of H₂O molecules released from the insulator 77 be less than orequal to 7.00×10¹⁴ molecules/cm² in TDS analysis in the range of surfacetemperatures from 0° C. to 400° C. It is preferable that the number ofNO₂ molecules released from the insulator 77 be less than or equal to1.80×10¹³ molecules/cm² in TDS analysis.

The conductor 74 functions as a gate electrode of the transistor 60 a.As the conductor 74, any of the conductors that can be used as theconductor 62 b can be used.

Here, as illustrated in FIG. 13B, the semiconductor 66 b can beelectrically surrounded by electric fields of the conductors 62 a and 62b and the conductor 74 (a structure in which a semiconductor iselectrically surrounded by an electric field of a conductor is referredto as a surrounded channel (s-channel) structure). Therefore, a channelis formed in the entire semiconductor 66 b (the top, bottom, and sidesurfaces). In the s-channel structure, a large amount of current canflow between a source and a drain of a transistor, so that a highon-state current can be obtained.

In the case where the transistor has the s-channel structure, a channelis formed also in the side surface of the semiconductor 66 b. Therefore,as the semiconductor 66 b has a larger thickness, the channel regionbecomes larger. In other words, the thicker the semiconductor 66 b is,the larger the on-state current of the transistor is. In addition, whenthe semiconductor 66 b is thick, the proportion of the region with ahigh carrier controllability increases, leading to a smallersubthreshold swing value. For example, the semiconductor 66 b has aregion with a thickness greater than or equal to 10 nm, preferablygreater than or equal to 20 nm, further preferably greater than or equalto 30 nm. Note that to prevent a decrease in the productivity of thesemiconductor device, the semiconductor 66 b has a region with athickness of, for example, less than or equal to 150 nm.

The s-channel structure is suitable for a miniaturized transistorbecause a high on-state current can be obtained. A semiconductor deviceincluding the miniaturized transistor can have a high integration degreeand high density. For example, the channel length of the transistor ispreferably less than or equal to 40 nm, further preferably less than orequal to 30 nm, still further preferably less than or equal to 20 nm andthe channel width of the transistor is preferably less than or equal to40 nm, further preferably less than or equal to 30 nm, still furtherpreferably less than or equal to 20 nm.

Any of the insulators that can be used for the insulator 63 ispreferably formed as the insulator 79. For example, gallium oxide oraluminum oxide formed by an ALD method may be used as the insulator 79.Covering the conductor 74 with such an insulator 79 can inhibit theconductor 74 from depriving excess oxygen that has been supplied to theinsulator 77, resulting in preventing oxidation of the conductor 74.

Here, the thickness of the insulator 78 can be greater than or equal to5 nm, or greater than or equal to 20 nm, for example. It is preferablethat at least part of the insulator 78 be in contact with the topsurface of the insulator 77.

The insulator 78 may be formed to have, for example, a single-layerstructure or a stacked-layer structure including an insulator containingboron, carbon, nitrogen, oxygen, fluorine, magnesium, aluminum, silicon,phosphorus, chlorine, argon, gallium, germanium, yttrium, zirconium,lanthanum, neodymium, hafnium, or tantalum. The insulator 78 preferablyhas a blocking effect against oxygen, hydrogen, water, alkali metal,alkaline earth metal, and the like. As such an insulator, for example, anitride insulating film can be used. The nitride insulating film isformed using silicon nitride, silicon nitride oxide, aluminum nitride,aluminum nitride oxide, or the like. Note that instead of the nitrideinsulating film, an oxide insulating film having a blocking effectagainst oxygen, hydrogen, water, and the like, may be provided. As theoxide insulating film, an aluminum oxide film, an aluminum oxynitridefilm, a gallium oxide film, a gallium oxynitride film, an yttrium oxidefilm, an yttrium oxynitride film, a hafnium oxide film, and a hafniumoxynitride film can be given. Any of the above-described oxides that canbe used as the insulator 66 a or the insulator 66 c can also be used asthe insulator 78. The insulator 78 can be formed by a sputtering method,a CVD method, an MBE method, a PLD method, an ALD method, or the like.

Here, it is preferable that the insulator 78 be formed by a sputteringmethod and it is further preferable that the insulator 78 be formed by asputtering method in an atmosphere containing oxygen. When the insulator78 is formed by a sputtering method, oxygen is added to the vicinity ofa surface of the insulator 77 (after the formation of the insulator 78,the interface between the insulator 77 and the insulator 78) at the sametime as the formation. For example, aluminum oxide may be formed by asputtering method. In addition, aluminum oxide is preferably formedthereover by an ALD method. The use of an ALD method can preventformation of pin holes and the like, leading to a further improvement inthe blocking effect of the insulator 78 against oxygen, hydrogen, water,alkali metals, alkaline earth metals, and the like.

The insulator 78 is preferably subjected to heat treatment during orafter the deposition. By the heat treatment, the oxygen added to theinsulator 77 can be diffused to be supplied to the insulator 66 a, thesemiconductor 66 b, and the insulator 66 c. The oxygen may be suppliedfrom the insulator 77 to the insulator 66 a, the semiconductor 66 b, andthe insulator 66 c through the insulator 72 or the insulator 64. Theheat treatment is performed at a temperature higher than or equal to250° C. and lower than or equal to 650° C., preferably higher than orequal to 350° C. and lower than or equal to 450° C. The heat treatmentis performed in an inert gas atmosphere or an atmosphere containing anoxidizing gas at 10 ppm or more, 1% or more, or 10% or more. The heattreatment may be performed under a reduced pressure. For the heattreatment, lamp heating can be performed with use of an RTA apparatus.

Note that in the case where tantalum nitride is used for the conductor62 a serving as the back gate of the transistor, the conductor 20 aforming the wiring and the plug illustrated in FIGS. 4A to 4D, or thelike, the temperature of the above heat treatment may be set to higherthan or equal to 350° C. and lower than or equal to 410° C., preferablyhigher than or equal to 370° C. and lower than or equal to 400° C. Theheat treatment within such a temperature range can prevent release ofhydrogen from the tantalum nitride.

It is preferable that the insulator 78 be less permeable to oxygen thanthe insulator 77 and have a function of blocking oxygen. Such aninsulator 78 can prevent oxygen from being externally released to abovethe insulator 78 at the time of supply of oxygen from the insulator 77to the insulator 66 a, the semiconductor 66 b, and the insulator 66 c.

Aluminum oxide is preferably used for the insulator 78 because it ishighly effective in preventing passage of both oxygen and impuritiessuch as hydrogen and moisture.

Next, an modification example of the transistor 60 a is described withreference to FIGS. 13C and 13D. FIGS. 13C and 13D are a cross-sectionalview of the transistor 60 a in the channel length direction and that inthe channel width direction like FIGS. 13A and 13B.

A transistor 60 b illustrated in FIGS. 13C and 13D is different from thetransistor 60 a in FIGS. 13A and 13B in that the insulator 77 isprovided over the insulator 64, the conductor 68 a, and the conductor 68b; and that the insulator 66 c, the insulator 72, and the conductor 74are embedded in an opening formed in the insulator 77, the conductor 68a, and the conductor 68 b. For the other structures of the transistor 60b in FIGS. 13C and 13D, the structures of the transistor 60 a in FIGS.13A and 13B can be referred to.

Furthermore, in the transistor 60 b, an insulator 76 may be providedover the insulator 77, and the insulator 78 may be provided over theinsulator 76. Any of the insulators that can be used as the insulator 77can be used as the insulator 76. The transistor 60 b does not includethe insulator 79; however, the structure is not limited thereto, and theinsulator 79 may be provided.

Note that the structure of the transistor 60 b is not limited to thatillustrated in FIGS. 13C and 13D. For example, the insulator 66 c, theinsulator 72, and the conductor 74 may each have a tapered shape inwhich the side surface is inclined at an angle larger than or equal to30° and smaller than 90° to the top surface of the semiconductor 66 b.

<Structure of Capacitor>

FIG. 14A illustrates a structure example of a capacitor 80 a. Thecapacitor 80 a includes a conductor 82, an insulator 83, and a conductor84. As illustrated in FIG. 14A, the conductor 82 is provided over aninsulator 81, the insulator 83 covers the conductor 82, the conductor 84covers the insulator 83, and an insulator 85 is provided over theconductor 84.

Here, it is preferable that the insulator 83 be in contact with a sidesurface of the conductor 82, and that the conductor 84 be in contactwith a side surface of a projecting portion of the insulator 83.Accordingly, not only the top surface of the conductor 82 but also theside surface of the conductor 82 can function as a capacitor, resultingin an increased capacitance value.

The conductor 82 and conductor 84 may each be formed to have asingle-layer structure or a layered structure including a conductorcontaining, for example, one or more kinds of boron, nitrogen, oxygen,fluorine, silicon, phosphorus, aluminum, titanium, chromium, manganese,cobalt, nickel, copper, zinc, gallium, yttrium, zirconium, molybdenum,ruthenium, silver, indium, tin, tantalum, and tungsten. An alloy or acompound containing the above element may be used, for example, and aconductor containing aluminum, a conductor containing copper andtitanium, a conductor containing copper and manganese, a conductorcontaining indium, tin, and oxygen, a conductor containing titanium andnitrogen, or the like may be used. The conductor 82 and the conductor 84can be formed by a sputtering method, a CVD method, an MBE method, a PLDmethod, an ALD method, or the like.

For example, an insulator containing one or more of aluminum oxide,aluminum oxynitride, magnesium oxide, silicon oxide, silicon oxynitride,silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide,yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide,hafnium oxide, tantalum oxide, and the like can be used as the insulator83. Silicon oxynitride may be stacked over aluminum oxide, for example.Furthermore, a high-k material such as hafnium silicate (HfSi_(x)O_(y)(x>0, y>0)), hafnium silicate to which nitrogen is added(HfSi_(x)O_(y)N_(z) (x>0, y>0, z>0)), hafnium aluminate to whichnitrogen is added (HfAl_(x)O_(y)N_(z) (x>0, y>0, z>0)), hafnium oxide,or yttrium oxide is preferably used. In the case where a high-k materialis used as the insulator 83, the capacitance can be increased by heattreatment in some cases. The use of such a high-k material enablessufficient capacitance of the capacitor 80 a to be ensured even if theinsulator 83 has a large thickness. The insulator 83 having a largethickness can prevent leakage current generated between the conductor 82and the conductor 84. The insulator 83 can be formed by a sputteringmethod, a CVD method, an MBE method, a PLD method, an ALD method, or thelike.

As the insulator 81 and insulator 85, any of the insulators that can beused as the insulator 77 may be used. The insulator 85 may be formedusing an organosilane gas (e.g., tetra-ethyl-ortho-silicate (TEOS)).

Next, modification examples of the capacitor 80 a are described withreference to FIGS. 14B and 14C.

A capacitor 80 b illustrated in FIG. 14B is different from the capacitor80 a illustrated in FIG. 14A in that the conductor 84 overlaps the topsurface of the conductor 82 without being in contact with the sidesurface of the projecting portion of the insulator 83. Note thatalthough an edge portion of the side surface of the conductor 84 isaligned with an edge portion of the side surface of the conductor 82 inFIG. 14B, the capacitor 80 b is not limited thereto.

A capacitor 80 c illustrated in FIG. 14C is different from the capacitor80 a illustrated in FIG. 14A in that an insulator 86 with an opening isprovided over the insulator 81, and that the conductor 82 is provided inthe opening. Here, the opening in the insulator 86 and the top surfaceof the insulator 81 can be regarded as forming a groove portion, and theconductor 82 is preferably provided along the groove portion.Furthermore, as in FIG. 14C, the insulator 86 and the conductor 82 maybe formed so that their top surfaces are substantially aligned with eachother.

The insulator 83 is provided over the conductor 82, and the conductor 84is provided over the insulator 83. Here, in the groove portion, theconductor 84 has a region which faces the conductor 82 with theinsulator 83 provided therebetween. In addition, the insulator 83 ispreferably provided to cover the top surface of the conductor 82. Whenthe insulator 83 is provided as described above, leakage current can beprevented from flowing between the conductor 82 and the conductor 84. Inaddition, the end portions of the side surfaces of the insulator 83 maybe substantially aligned with the end portions of the side surfaces ofthe conductor 84. In this manner, the capacitor 80 c preferably has aconcave shape, a cylinder shape, or the like. Note that in the capacitor80 c, the shapes of the top surfaces of the conductor 82, the insulator83, and the conductor 84 may each be a polygonal shape other than thequadrangular shape or a circular shape including an elliptical shape.

<Structure of Transistor Formed in Semiconductor Substrate>

FIGS. 15A and 15B illustrate a structure example of a transistor 90 aincluded in the element layer including the semiconductor substrate.FIG. 15A is a cross-sectional view of the transistor 90 a in a channellength direction B1-B2, and FIG. 15B is a cross-sectional view of thetransistor 90 a in a channel width direction B3-B4.

A plurality of projecting portions are formed on the semiconductorsubstrate 91, and an element separation region 97 is formed in grooveportions (also referred to as trenches) between the plurality ofprojecting portions. An insulator 94 is formed over the semiconductorsubstrate 91 and the element separation region 97, and a conductor 96 isformed over the insulator 94. An insulator 95 is formed in contact witha side surface of the insulator 94 and a side surface of the conductor96. An insulator 99 is provided over the semiconductor substrate 91, theelement separation region 97, the insulator 95, and the conductor 96;and an insulator 98 is provided thereover.

As illustrated in FIG. 15A, a low-resistance region 93 a and alow-resistance region 93 b are formed in the projecting portion of thesemiconductor substrate 91 so that at least part of the insulator 95overlaps the low-resistance region 93 a and the low-resistance region 93b; and a low-resistance region 92 a and a low-resistance region 92 b areformed on the outer side than the low-resistance region 93 a and thelow-resistance region 93 b. Note that it is preferable that thelow-resistance region 92 a and the low-resistance region 92 b have lowerresistances than the low-resistance region 93 a and the low-resistanceregion 93 b.

Here, the conductor 96 functions as a gate of the transistor 90 a, theinsulator 94 functions as a gate insulating film of the transistor 90 a,the low-resistance region 92 a functions as one of a source and a drainof the transistor 90 a, and the low-resistance region 92 b functions asthe other of the source and the drain of the transistor 90 a. Theinsulator 95 functions as a side wall insulating film of the transistor90 a. The low-resistance region 93 a and the low-resistance region 93 bfunction as lightly doped drain (LDD) regions of the transistor 90 a. Inthe projecting portion of the semiconductor substrate 91, a region whichis positioned under the conductor 96 and between the low-resistanceregions 93 a and the low-resistance region 93 b functions as a channelformation region of the transistor 90 a.

As illustrated in FIG. 15B, in the transistor 90 a, the conductor 96overlaps side and top portions of the projecting portion in the channelformation region with the insulator 94 positioned therebetween, so thatcarriers flow in a wide area including the side and top portions of thechannel formation region. Therefore, an area over the substrate occupiedby the transistor 90 a can be reduced, and the number of transferredcarriers in the transistor 90 a can be increased. As a result, theon-state current and field-effect mobility of the transistor 90 a areincreased. Suppose the length of the projecting portion of the channelformation region in the channel width direction (i.e., channel width) isW and the height of the projecting portion of the channel formationregion is T. When the aspect ratio that corresponds to the ratio of theheight T of the projecting portion to the channel width W (T/W) is high,a region where carrier flows becomes wider. Thus, the on-state currentof the transistor 90 a is further increased and the field-effectmobility of the transistor 90 a is further increased. For example, whenthe transistor 90 a is formed using a bulk semiconductor substrate 91,the aspect ratio is desirably 0.5 or more, further desirably 1 or more.

The transistor 90 a illustrated in FIGS. 15A and 15B is subjected toelement isolation by a shallow trench isolation (STI) method; however,the semiconductor device in this embodiment is not limited thereto.

As the semiconductor substrate 91, a single-material semiconductorsubstrate formed using silicon, germanium, or the like or asemiconductor substrate formed using silicon carbide, silicon germanium,gallium arsenide, indium phosphide, zinc oxide, gallium oxide, or thelike may be used, for example. A single crystal silicon substrate ispreferably used as the semiconductor substrate 91. A semiconductorsubstrate in which an insulator region is provided in the abovesemiconductor substrate, e.g., a silicon on insulator (SOI) substrate orthe like may be used as the semiconductor substrate 91.

As the semiconductor substrate 91, for example, a semiconductorsubstrate including impurities imparting p-type conductivity is used.However, a semiconductor substrate including impurities imparting n-typeconductivity may be used as the semiconductor substrate 91.Alternatively, the semiconductor substrate 91 may be an i-typesemiconductor substrate.

The low-resistance region 92 a and the low-resistance region 92 bprovided in the semiconductor substrate 91 preferably contain an elementthat imparts n-type conductivity, such as phosphorus or arsenic, or anelement that imparts p-type conductivity, such as boron or aluminum.Similarly, the low-resistance region 93 a and the low-resistance region93 b also preferably contain an element that imparts n-typeconductivity, such as phosphorus or arsenic, or an element that impartsp-type conductivity, such as boron or aluminum. Since the low-resistanceregion 93 a and the low-resistance region 93 b preferably serve as LDDregions, the concentrations of the element imparting a conductivity typecontained in the low-resistance region 93 a and the low-resistanceregion 93 b are preferably lower than those of the element imparting aconductivity type contained in the low-resistance region 92 a and thelow-resistance region 92 b. Note that the low-resistance region 92 a andthe low-resistance region 92 b may be formed using silicide.

For example, an insulator containing one or more of aluminum oxide,aluminum oxynitride, magnesium oxide, silicon oxide, silicon oxynitride,silicon nitride oxide, silicon nitride, gallium oxide, germanium oxide,yttrium oxide, zirconium oxide, lanthanum oxide, neodymium oxide,hafnium oxide, tantalum oxide, and the like can be used as the insulator94 and the insulator 95. A high-k material such as hafnium silicate(HfSi_(x)O_(y) (x>0, y>0)), hafnium silicate to which nitrogen is added(HfSi_(x)O_(y)N_(z) (x>0, y>0, z>0)), hafnium aluminate to whichnitrogen is added (HfAl_(x)O_(y)N_(z) (x>0, y>0, z>0)), hafnium oxide,or yttrium oxide may be used. The insulator 94 and the insulator 95 canbe formed by a sputtering method, a CVD method, an MBE method, a PLDmethod, an ALD method, or the like.

It is preferable that the conductor 96 be formed using a metal selectedfrom tantalum, tungsten, titanium, molybdenum, chromium, niobium, andthe like, or an alloy material or a compound material including any ofthe metals as its main component. Alternatively, polycrystalline siliconto which an impurity such as phosphorus is added can be used. Stillalternatively, a stacked-layer structure including a film of metalnitride and a film of any of the above metals may be used for theconductor 96. As a metal nitride, tungsten nitride, molybdenum nitride,or titanium nitride can be used. When the metal nitride film isprovided, adhesiveness of the metal film can be increased; thus,separation can be prevented. The conductor 96 can be formed by asputtering method, a CVD method, an MBE method, a PLD method, an ALDmethod, or the like.

The insulator 98 and the insulator 99 may each be formed to have, forexample, a single-layer structure or a stacked-layered structureincluding an insulator containing boron, carbon, nitrogen, oxygen,fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon,gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium,or tantalum. The insulator 98 can be formed by a sputtering method, aCVD method, an MBE method, a PLD method, an ALD method, or the like.

Alternatively, the insulator 98 can be formed using siliconcarbonitride, silicon oxycarbide, or the like. Further alternatively,undoped silicate glass (USG), boron phosphorus silicate glass (BPSG),borosilicate glass (BSG), or the like can be used. USG, BPSG, and thelike may be formed by an atmospheric pressure CVD method. Alternatively,hydrogen silsesquioxane (HSQ) or the like may be applied by a coatingmethod.

Here, the insulator 99 preferably contains hydrogen in some cases. Forexample, silicon nitride containing hydrogen can be used as theinsulator 99. When the insulator 99 contains hydrogen, defects and thelike in the semiconductor substrate 91 are reduced and characteristicsof the transistor 90 a are improved in some cases. For example, in thecase where the semiconductor substrate 91 is formed using a materialcontaining silicon, a defect such as a dangling bond in the silicon canbe terminated by hydrogen.

Next, a modification example of the transistor 90 a is described withreference to FIGS. 15C and 15D. FIGS. 15C and 15D show a cross-sectionalview of the transistor 90 a in the channel length direction and that inthe channel width direction, like FIGS. 15A and 15B.

A transistor 90 b illustrated in FIGS. 15C and 15D is different from thetransistor 90 a illustrated in FIGS. 15A and 15B in that no projectingportion is formed on the semiconductor substrate 91. For the otherstructures of the transistor 90 b in FIGS. 15C and 15D, the structuresof the transistor 90 a in FIGS. 15A and 15B can be referred to.

Although the insulator 94 is provided in contact with the bottom surfaceof the conductor 96 in each of the transistor 90 a and the transistor 90b, the semiconductor device described in this embodiment is not limitedthereto. For example, the insulator 94 may be in contact with the bottomand side surfaces of the conductor 96.

<Structure Example of Semiconductor Device>

FIG. 16 illustrates a structure example of a semiconductor device inwhich an element layer (also referred to as an element layer 30) whichincludes an oxide semiconductor is provided over an element layer (alsoreferred to as an element layer 50) which includes a semiconductorsubstrate, and an element layer (also referred to as an element layer40) which includes a capacitor is provided over the element layer 30.FIG. 16 is a cross-sectional view taken along a channel length C1-C2 ofthe transistor 60 a and the transistor 90 a. Note that although thechannel length direction of the transistor 60 a is parallel to that ofthe transistor 90 a in FIG. 16, the directions are not limited theretoand can be set appropriately.

Since the transistor 90 a illustrated in FIG. 15A is provided in theelement layer 50, the above description can be referred to for thesemiconductor substrate 91, the element separation region 97, theinsulator 98, the insulator 99, the insulator 94, the insulator 95, theconductor 96, the low-resistance region 93 a, the low-resistance region93 b, the low-resistance region 92 a, and the low-resistance region 92b.

Part of a conductor 51 a, part of a conductor 52 a, part of a conductor51 b, part of a conductor 52 b, part of a conductor 51 c, and part of aconductor 52 c which function as plugs are provided in the element layer50. The conductor 51 a and the conductor 52 a are formed in an openingformed in the insulator 98 and the insulator 99 so that the bottomsurface of the conductor 51 a is in contact with the low-resistanceregion 92 a. The conductor 51 b and the conductor 52 b are formed in anopening formed in the insulator 98 so that the bottom surface of theconductor 51 b is in contact with the conductor 96. The conductor 51 cand the conductor 52 c are formed in an opening formed in the insulator98 and the insulator 99 so that the bottom surface of the conductor 51 cis in contact with the low-resistance region 92 b.

Here, the conductors 51 a to 51 c each can have a structure similar tothat of the conductor 20 a illustrated in FIGS. 4C and 4D. Theconductors 52 a to 52 c each can have a structure similar to that of theconductor 21 a illustrated in FIGS. 4C and 4D. However, the structuresare not limited thereto; the plug and the wiring may be formedseparately by a single damascene method or the like, for example.

As illustrated in FIG. 16, the conductors 51 a to 51 c and theconductors 52 a to 52 c preferably have a stacked-layer structure. Forthe conductors 51 a to 51 c, for example, a single layer or astacked-layer including any of titanium, tantalum, titanium nitride,tantalum nitride, and the like may be used. The use of a metal nitridesuch as tantalum nitride or titanium nitride, in particular tantalumnitride, for the conductors 51 a to 51 c can inhibit impurities such ashydrogen and water which are included in the element layer 50 and thelike from diffusing into the conductors 51 a to 51 c, which prevents theimpurities from entering the upper layer. These apply not only to theconductors 51 a to 51 c but also to other conductors which functions asplugs and wirings. Therefore, when conductors 111 a to 111 c andconductors 121 a to 121 c, which are located below the element layer 30,have a stacked-layer structure, and the bottom layer of thestacked-layer structure is formed using a metal nitride such as tantalumnitride or titanium nitride, in particular tantalum nitride, impuritiessuch as hydrogen and water can be prevented from diffusing into theelement layer 30 located over these conductors. Such a structure makesthe oxide semiconductor included in the element layer 30 a highlypurified intrinsic or substantially highly purified intrinsic oxidesemiconductor.

An insulator 102 a and an insulator 102 b are provided over theinsulator 98. Part of the conductor 51 a, part of the conductor 52 a,part of the conductor 51 b, part of the conductor 52 b, part of theconductor 51 c, and part of the conductor 52 c which function as plugsor the like are provided to be embedded in openings formed in theinsulator 102 a and the insulator 102 b. For example, in the case wherea metal which tends to diffuse, e.g., copper, is used for the conductors52 a to 52 c, an insulator which is less permeable to copper, such assilicon nitride or silicon nitride carbide, is used, in which caseimpurities such as copper can be prevented from diffusing into thetransistor 90 a. In addition, an insulator which has a lower hydrogenconcentration than the insulator 98 or the like is preferably used asthe insulator 102 a. The dielectric constant of the insulator 102 b ispreferably lower than that of the insulator 102 a. Although theinsulator 102 b and the insulator 102 a are stacked in FIG. 16, thestructure is not limited thereto, and a single-layer insulator may beprovided instead.

An insulator 104 is provided over the insulator 102 b, an insulator 106is provided over the insulator 104, and an insulator 108 is providedover the insulator 106. Any of the insulators that can be used as theinsulator 98 may be used for the insulator 102 a, the insulator 102 b,the insulator 104, the insulator 106, and the insulator 108. Any of theinsulator 102 a, the insulator 102 b, the insulator 104, the insulator106, and the insulator 108 preferably has a function of blocking oxygenand impurities such as hydrogen. The insulator with a function ofblocking oxygen and impurities such as hydrogen may be formed to have asingle-layer structure or a stacked-layer structure including aninsulator containing, for example, boron, carbon, nitrogen, oxygen,fluorine, magnesium, aluminum, silicon, phosphorus, chlorine, argon,gallium, germanium, yttrium, zirconium, lanthanum, neodymium, hafnium,or tantalum. For example, silicon nitride may be used.

For example, in the case where a metal which tends to diffuse, e.g.,copper, is used for the conductors 52 a to 52 c, an insulator which isless permeable to copper, such as silicon nitride or silicon nitridecarbide, is used as the insulator 104, in which case impurities such ascopper can be prevented from diffusing into the oxide semiconductor filmincluded in the element layer 30.

Part of the conductor 111 a, part of a conductor 112 a, part of theconductor 111 b, part of a conductor 112 b, part of the conductor 111 c,and part of a conductor 112 c which function as plugs are provided inthe insulator 104 and the insulator 106. In addition, part of theconductor 111 a, part of the conductor 112 a, part of the conductor 111b, part of the conductor 112 b, part of the conductor 111 c, and part ofthe conductor 112 c which function as wirings are provided in theinsulator 108. The conductor 111 a and the conductor 112 a are formed inan opening formed in the insulator 104, the insulator 106, and theinsulator 108 so that the bottom surface of the conductor 111 a is incontact with the conductor 52 a. The conductor 111 b and the conductor112 b are formed in an opening formed in the insulator 104, theinsulator 106, and the insulator 108 so that the bottom surface of theconductor 111 b is in contact with the conductor 52 b. The conductor 111c and the conductor 112 c are formed in an opening formed in theinsulator 104, the insulator 106, and the insulator 108 so that thebottom surface of the conductor 111 c is in contact with the conductor52 c.

Here, the conductors 111 a to 111 c each can have a structure similar tothat of the conductor 20 a illustrated in FIGS. 4C and 4D. Theconductors 112 a to 112 c each can have a structure similar to that ofthe conductor 21 a illustrated in FIGS. 4C and 4D. However, thestructures are not limited thereto; the plug and the wiring may beformed separately by a single damascene method or the like, for example.

An insulator 110 is provided over the insulator 108. For The insulator110, any of the insulators that can be used as the insulator 106 may beused.

Since the transistor 60 a illustrated in FIG. 13A is provided in theelement layer 30 over the insulator 110, the above description can bereferred to for the insulator 61, the insulator 67, the conductor 62 a,the conductor 62 b, the insulator 65, the insulator 63, the insulator64, the insulator 66 a, the semiconductor 66 b, the insulator 66 c, theconductor 68 a, the conductor 68 b, the insulator 72, the conductor 74,the insulator 79, the insulator 77, and the insulator 78.

Part of the conductor 121 a, part of a conductor 122 a, part of theconductor 121 b, part of a conductor 122 b, part of the conductor 121 c,and part of a conductor 122 c which function as plugs are provided inthe insulator 61 and the insulator 110. In addition, part of theconductor 121 a, part of the conductor 122 a, part of the conductor 121b, part of the conductor 122 b, part of the conductor 121 c, and part ofthe conductor 122 c which function as wirings are provided in theinsulator 67. The conductor 121 a and the conductor 122 a are formed inan opening formed in the insulator 67, the insulator 61, and theinsulator 110 so that the bottom surface of the conductor 121 a is incontact with the conductor 112 a. The conductor 121 b and the conductor122 b are formed in an opening formed in the insulator 67, the insulator61, and the insulator 110 so that the bottom surface of the conductor121 b is in contact with the conductor 112 b. The conductor 121 c andthe conductor 122 c are formed in an opening formed in the insulator 67,the insulator 61, and the insulator 110 so that the bottom surface ofthe conductor 121 c is in contact with the conductor 112 c.

Here, the conductors 121 a to 121 c each can have a structure similar tothat of the conductor 20 a illustrated in FIGS. 4C and 4D. Theconductors 122 a to 122 c each can have a structure similar to that ofthe conductor 21 a illustrated in FIGS. 4C and 4D.

The conductor 62 a and the conductor 62 b are formed in the same layeras the conductor 121 a, the conductor 122 a, the conductor 121 b, theconductor 122 b, the conductor 121 c, and the conductor 122 c. Detailsof a process for forming the conductor 62 a, the conductor 62 b, theconductor 121 a, and the conductor 122 a at the same time are describedlater.

As illustrated in FIG. 16, the semiconductor substrate 91 and thesemiconductor 66 b are separated by the insulator 61 and the conductors121 a to 121 c. Since the conductors 121 a to 121 c each have a functionof blocking diffusion of hydrogen and water, they can prevent impuritiessuch as hydrogen and water included in the element layer 50 and the likefrom diffusing into the semiconductor 66 b through the via holes formedin the insulator 61 or the conductors 122 a to 122 c that function asplugs.

Here, FIG. 17 illustrates a cross-sectional view corresponding to aC3-C4 cross section in the vicinity of a scribe line 138. As illustratedin FIG. 17, it is preferable that an opening be formed in the insulator67, the insulator 65, the insulator 63, the insulator 64, and theinsulator 77 in the vicinity of a region overlapping the scribe line138, and that the insulator 78 be formed to cover side surfaces of theinsulators 67, 65, 63, 64, and 77. Furthermore, the insulator 78 ispreferably in contact with the insulator 61 in the opening.

Such a shape enables the insulator 78 and the insulator 61 to cover eventhe side surfaces of the insulators 67, 65, 63, 64, and 77. Since theinsulator 78 and the insulator 61 each have a function of blockinghydrogen and water, even when the semiconductor device described in thisembodiment is scribed, hydrogen or water can be prevented from enteringthe insulators 67, 65, 63, 64, 77 from their side surfaces and diffusinginto the transistor 60 a.

In addition, excess oxygen can be supplied to the insulator 77 at thetime of forming the insulator 78, as described above. At that time, theinsulator 78 covering the side surface of the insulator 77 inhibitsdiffusion of oxygen into the outside of the insulator 78, whereby theinsulator 77 can be filled with oxygen and oxygen can be supplied fromthe insulator 77 to the insulator 66 a, the semiconductor 66 b, and theinsulator 66 c. The oxygen can reduce oxygen vacancies which are to bedefects in the insulator 66 a, the semiconductor 66 b, and the insulator66 c. As a result, the semiconductor 66 b can be an oxide semiconductorwith a low density of defect states and stable characteristics.

The insulator 81 is provided over the insulator 78. The insulator 81 canbe formed using any of the insulators that can be used as the insulator77.

Conductors 31 a and 32 a, conductors 31 b and 32 b, conductors 31 c and32 c, conductors 31 d and 32 d, and conductors 31 e and 32 e whichfunction as plugs are provided in the insulators 81, 78, 77, 65, 63, and64. The conductor 31 a and the conductor 32 a are formed in an openingformed in the insulator 81, the insulator 78, the insulator 77, theinsulator 64, the insulator 63, and the insulator 65 so that the bottomsurface of the conductor 31 a is in contact with the conductor 122 a.The conductor 31 b and the conductor 32 b are formed in an openingformed in the insulator 81, the insulator 78, and the insulator 77 sothat the bottom surface of the conductor 31 b is in contact with theconductor 68 a. The conductor 31 c and the conductor 32 c are formed inan opening formed in the insulator 81, the insulator 78, and theinsulator 77 so that the bottom surface of the conductor 31 c is incontact with the conductor 68 b. The conductor 31 d and the conductor 32d are formed in an opening formed in the insulator 81, the insulator 78,the insulator 77, the insulator 64, the insulator 63, and the insulator65 so that the bottom surface of the conductor 31 d is in contact withthe conductor 122 b. The conductor 31 e and the conductor 32 e areformed in an opening formed in the insulator 81, the insulator 78, theinsulator 77, the insulator 64, the insulator 63, and the insulator 65so that the bottom surface of the conductor 31 e is in contact with theconductor 122 c.

Here, the conductors 31 a to 31 e may be formed using any of theconductors that can be used as the conductor 20 a illustrated in FIGS.4C and 4D. The conductors 31 a to 31 e having such a structure can fillvia holes formed in the insulator 78. Since the conductors 31 a to 31 eeach have a function of blocking diffusion of hydrogen and water, theycan prevent impurities such as hydrogen and water from diffusing intothe transistor 60 a through the conductors 32 a to 32 e and the viaholes formed in the insulator 78. Here, the conductors 32 a to 32 e areformed using a conductor that can be used as the conductor 21 aillustrated in FIGS. 4C and 4D.

A conductor 33 a, a conductor 33 b, the conductor 82, and a conductor 33e are formed over the insulator 81. Here, the conductor 82 serves as oneof electrodes of the capacitor 80 a of the element layer 40. Theconductor 33 a is in contact with top surfaces of the conductors 31 aand 32 a; the conductor 33 b is in contact with top surfaces of theconductors 31 b and 32 b; the conductor 82 is in contact with topsurfaces of the conductors 31 c, 32 c, 31 d, and 32 d; and the conductor33 e is in contact with top surfaces of the conductors 31 e and 32 e.

Here, the conductors 31 a, 33 b, and 31 e may be formed using any of theconductors that can be used as the conductor 82.

Although not illustrated in the cross-sectional view of FIG. 16, wiringsand plugs that are connected to the conductor 74 and the conductor 62 bmay be separately provided.

Since the capacitor 80 a illustrated in FIG. 14A is provided in theelement layer 40, the above description can be referred to for theinsulator 81, the conductor 82, the insulator 83, the conductor 84, andthe insulator 85.

Conductors 41 a and 42 a, conductors 41 b and 42 b, conductors 41 c and42 c, and conductors 41 d and 42 d which function as plugs are providedin the element layer 40. The conductor 41 a and the conductor 42 a areformed in an opening formed in the insulator 83 and the insulator 85 sothat the bottom surface of the conductor 41 a is in contact with theconductor 33 a. The conductor 41 b and the conductor 42 b are formed inan opening formed in the insulator 83 and the insulator 85 so that thebottom surface of the conductor 41 b is in contact with the conductor 33b. The conductor 41 c and the conductor 42 c are formed in an openingformed in the insulator 85 so that the bottom surface of the conductor41 c is in contact with the conductor 84. The conductor 41 d and theconductor 42 d are formed in an opening formed in the insulator 83 andthe insulator 85 so that the bottom surface of the conductor 41 d is incontact with the conductor 33 e.

Here, the conductors 41 a to 41 d may be formed using any of theconductors that can be used as the conductor 20 a illustrated in FIGS.4C and 4D. The conductors 42 a to 42 d may be formed using any of theconductors that can be used as the conductor 21 a illustrated in FIGS.4C and 4D.

Conductors 43 a to 43 d functioning as wirings are formed over theinsulator 85. The conductor 43 a is in contact with top surfaces of theconductors 41 a and 42 a; the conductor 43 b is in contact with topsurfaces of the conductors 41 b and 42 b; the conductor 43 c is incontact with top surfaces of the conductors 41 c and 42 c; and theconductor 43 d is in contact with top surfaces of the conductors 41 dand 42 d.

Here, the conductors 43 a to 43 d are formed using any of the conductorsthat can be used as the conductor 33 a, the conductor 33 b, and theconductor 33 e. Since the conductors 43 a to 43 d are formed over theelement layer 30, high-temperature heat treatment is not necessary afterformation of the conductors 43 a to 43 d, in some cases. Accordingly,the conductors 43 a to 43 d are formed using a metal material which haslow heat resistance and low resistance, such as aluminum or copper, inwhich case wiring resistance can be reduced.

An insulator 134 is formed over the insulator 85 to cover the conductors43 a to 43 d. The insulator 134 can be formed using any of theinsulators that can be used as the insulator 85.

A conductor 131 and a conductor 132 which function as a plug is providedin the insulator 134. The conductor 131 and the conductor 132 are formedin an opening of the insulator 134 so that the bottom surface of theconductor 131 is in contact with the conductor 43 a.

Here, the conductor 131 may be formed using any of the conductors thatcan be used as the conductor 20 a illustrated in FIGS. 4C and 4D. Theconductor 132 may be formed using any of the conductors that can be usedas the conductor 21 a illustrated in FIGS. 4C and 4D.

A conductor 133 functioning as a wiring is formed over the insulator134. The conductor 133 is in contact with top surfaces of the conductors131 and 132. Here, the conductor 133 is formed using any of theconductors that can be used as the conductor 33 a, the conductor 33 b,and the conductor 33 e.

An insulator 136 with an opening is formed over the insulator 134 sothat the opening is located over the conductor 133. Any of theinsulators that can be used as the insulator 134 may be used as theinsulator 136. An organic insulating film such as a polyimide film maybe used as the insulator 136.

Although the wirings and the plugs in the layers above the element layer30 are separately formed in the semiconductor device illustrated in FIG.16, the semiconductor device of one embodiment of the present inventionis not limited thereto. For example, as illustrated in FIG. 18, thewirings and plugs in the layers above the element layer 30 can also beintegrally formed by, for example, the method illustrated in FIGS. 1A to1D, FIGS. 2A to 2D, FIGS. 3A to 3D, and FIGS. 4A to 4D.

The conductor 31 a and the conductor 32 a illustrated in FIG. 18correspond to the conductor 31 a, the conductor 32 a, and the conductor33 a illustrated in FIG. 16. The conductor 31 b and the conductor 32 billustrated in FIG. 18 correspond to the conductor 31 b, the conductor32 b, and the conductor 33 b illustrated in FIG. 16. A conductor 31 fand a conductor 32 f illustrated in FIG. 18 correspond to the conductor31 c, the conductor 32 c, the conductor 31 d, the conductor 32 d, andthe conductor 82 illustrated in FIG. 16. The conductor 31 e and theconductor 32 e illustrated in FIG. 18 correspond to the conductor 31 e,the conductor 32 e, and the conductor 33 e illustrated in FIG. 16.

Note that part of the conductor 31 a, part of the conductor 31 b, partof the conductor 31 f, part of the conductor 31 e, part of the conductor32 a, part of the conductor 32 b, part of the conductor 32 f, and partof the conductor 32 e are embedded in openings provided in the insulator81 in FIG. 18.

The conductor 41 a and the conductor 42 a illustrated in FIG. 18correspond to the conductor 41 a, the conductor 42 a, and the conductor43 a illustrated in FIG. 16. The conductor 41 b and the conductor 42 billustrated in FIG. 18 correspond to the conductor 41 b, the conductor42 b, and the conductor 43 b illustrated in FIG. 16. The conductor 41 cand the conductor 42 c illustrated in FIG. 18 correspond to theconductor 41 c, the conductor 42 c, and the conductor 43 c illustratedin FIG. 16. The conductor 41 d and the conductor 42 d illustrated inFIG. 18 correspond to the conductor 41 d, the conductor 42 d, and theconductor 43 d illustrated in FIG. 16.

An insulator 135 is provided between the insulator 85 and the insulator134. In FIG. 18, part of the conductor 41 a, part of the conductor 41 b,part of the conductor 41 c, part of the conductor 41 d, part of theconductor 42 a, part of the conductor 42 b, part of the conductor 42 c,and part of the conductor 42 d are embedded in openings provided in theinsulator 135 in FIG. 18. The insulator 135 can be formed using any ofthe materials that can be used as the insulator 134.

A method for forming the wiring and the plug (the conductor 121 a andthe conductor 122 a) and the back gate (the conductor 62 a and theconductor 62 b) in parallel is described using the structure in FIG. 16as an example, with reference to cross-sectional views illustrated inFIGS. 19A and 19B, FIGS. 20A and 20B, FIGS. 21A and 21B, and FIGS. 22Aand 22B. FIGS. 19A and 19B, FIGS. 20A and 20B, FIGS. 21A and 21B, andFIGS. 22A and 22B each illustrate a cross-sectional view taken along thedirection of C5-C6 that is parallel to the channel length directionC1-C2 of the transistor 60 a. Note that FIGS. 19A and 19B, FIGS. 20A and20B, FIGS. 21A and 21B, and FIGS. 22A and 22B are shown in anexaggerated way by changing the aspect ratio from that of FIG. 16.

The insulator 108 with an opening in which the conductor 112 a and theconductor 111 a are provided is formed, and an insulator 110 a is formedthereover. The insulator 110 a is to be the insulator 110 after anopening is formed. Here, the insulator 110 a corresponds to theinsulator 13 illustrated in FIGS. 1A to 1D.

An insulator 61 a is formed over the insulator 110 a. Any of theabove-described insulators that can be used as the insulator 61 may beused as the insulator 61 a. For example, a stack in which aluminum oxideformed by an ALD method is stacked over aluminum oxide formed by asputtering method is preferably used as the insulator 61 a. The use ofthe aluminum oxide formed by an ALD method can prevent formation of apin hole, resulting in further improvement in the blocking property ofthe insulator 61 against hydrogen and water. The insulator 61 a is to bethe insulator 61 after an opening is formed. Here, the insulator 61 acorresponds to the insulator 14 illustrated in FIGS. 1A to 1D.

An insulator 67 a is formed over the insulator 61 a. Any of theabove-described insulators that can be used as the insulator 67 may beused as the insulator 67 a. The insulator 67 a is to be the insulator 67after openings are formed. Here, the insulator 67 a corresponds to theinsulator 15 illustrated in FIGS. 1A to 1D.

Next, a material of a hard mask 146 is deposited over the insulator.Here, the material of the hard mask 146 may be a conductor such as ametal material, or an insulator. For example, titanium, tantalum,tungsten, titanium nitride, tantalum nitride, or the like may be used.In addition, the material of the hard mask 146 may be either a singlelayer or a stack of an insulator and a conductor. The material of thehard mask 146 can be deposited by a sputtering method, a CVD method, anMBE method, a PLD method, an ALD method, or the like.

Next, the material of the hard mask 146 is etched using a resist maskformed by lithography or the like, whereby the hard mask 146 with anopening 147 a and an opening 149 a is formed (see FIG. 19A). Here, theetching is performed until a top surface of the insulator 67 a isexposed in the opening 147 a and the opening 149 a. Note that the hardmask 146 corresponds to the hard mask 16 in FIGS. 1A to 1D.

The opening 147 a corresponds to an opening 147 fb to be formed in alater step, i.e., a groove in which a wiring pattern is embedded.Therefore, the top-view shape of the opening 147 a corresponds to thatof the wiring pattern. It is preferable that at least part of theopening 147 a overlaps the conductor 112 a.

The opening 149 a is to be an opening 149 c formed later, i.e., a groovein which a back gate is embedded. Therefore, the top-view shape of theopening 149 a corresponds to that of the back gate.

Dry etching is preferably used for the etching for forming the hard mask146. For the dry etching, for example, a C₄F₆ gas, a C₄F₈ gas, a CF₄gas, a SF₆ gas, a CHF₃ gas, a Cl₂ gas, a BCl₃ gas, a SiCl₄ gas, or thelike can be used alone or in combination. Alternatively, an oxygen gas,a helium gas, an argon gas, a hydrogen gas, or the like can be added toany of the above gases as appropriate. As a dry etching apparatus, anapparatus similar to that described above can be used.

Next, a resist mask 148 with an opening 147 b is formed over theinsulator 67 a and the hard mask 146 (see FIG. 19B). Here, the resistmask 148 preferably covers the hard mask 146. In particular, the resistmask 148 covers the opening 149 a formed in the hard mask 146. Note thatthe resist mask 148 corresponds to the resist mask 18 a illustrated inFIGS. 1C and 1D.

When an organic coating film is applied before a resist for the resistmask 148 is applied, the adhesion between the resist mask 148 and aninsulator 67 b can be improved. In the case where the organic coatingfilm is used, the organic coating film needs to be etched before etchingof the insulator 67 a.

Here, the opening 147 b corresponds to the opening 147 fa to be formedin a later step, i.e., a via hole or a contact hole. Therefore, thetop-view shape of the opening 147 b corresponds to that of the via holeor the contact hole. In addition, it is preferable that the opening 147b corresponding to the via hole or the contact hole be formed in theopening 147 a that correspond to the groove in which the wiring patternis embedded. In that case, a maximum value of the width of the opening147 b is less than or equal to a minimum value of the width of theopening 147 a. For example, the width of the opening 147 b in thedirection of C5-C6 shown in FIG. 19B is less than or equal to the widthof the opening 147 a in the direction of C5-C6 shown in FIG. 19A. Inthat case, the via hole or the contact hole can be formed with a marginwith respect to the groove for the wiring pattern.

Next, the insulator 67 a is etched using the resist mask 148 to form theinsulator 67 b with an opening 147 c (see FIG. 20A). Here, the etchingis performed until a top surface of the insulator 61 a is exposed in theopening 147 c. Note that dry etching is preferably employed for theetching. For the dry etching, for example, a C₄F₆ gas, a C₄F₈ gas, a CF₄gas, a SF₆ gas, a CHF₃ gas, or the like can be used alone or incombination. Alternatively, an oxygen gas, a nitrogen gas, a helium gas,an argon gas, a hydrogen gas, or the like can be added to any of theabove gases as appropriate. As a dry etching apparatus, an apparatussimilar to that described above can be used. For example, a dry etchingapparatus in which the frequency of a high-frequency power sourceconnected to one of parallel-plate electrodes is different from that ofa high-frequency power source connected to the other of theparallel-plate electrodes is preferably used. Dry etching conditionssuch as selection of an etching gas may be determined as appropriate soas to be suitable for an insulator used as the insulator 67 a.

Next, the insulator 61 a is etched using the resist mask 148 to form aninsulator 61 b with an opening 147 d (see FIG. 20B). Here, the etchingis performed until a top surface of the insulator 110 a is exposed inthe opening 147 d. Note that dry etching is preferably employed for theetching. For the dry etching, for example, a C₄F₆ gas, a C₄F₈ gas, a CF₄gas, a SF₆ gas, a CHF₃ gas, or the like can be used alone or incombination. Alternatively, an oxygen gas, a nitrogen gas, a helium gas,an argon gas, a hydrogen gas, or the like can be added to any of theabove gases as appropriate. As a dry etching apparatus, an apparatussimilar to that described above can be used. For example, a dry etchingapparatus in which the frequency of a high-frequency power sourceconnected to one of parallel-plate electrodes is different from that ofa high-frequency power source connected to the other of theparallel-plate electrodes is preferably used. Dry etching conditionssuch as selection of an etching gas may be determined as appropriate soas to be suitable for an insulator used as the insulator 61 a.

It is not necessary to stop the etching at the top surface of theinsulator 110 a when the opening 147 d is formed. For example, after theopening 147 d is formed, part of the insulator 110 a may be etched toform a recessed portion in a region under the opening 147 d.

Next, the resist mask 148 is removed (see FIG. 21A). In the case wherean organic coating film is formed under the resist mask 148, it ispreferably removed together with the resist mask 148. Dry etchingtreatment such as ashing or wet etching treatment can be used forremoval of the resist mask 148. Alternatively, wet etching treatment isperformed in addition to dry etching treatment. Further alternatively,dry etching treatment can be performed in addition to wet etchingtreatment.

As also illustrated in FIGS. 5B and 5C, after the resist mask 148 isremoved, a by-product might be formed so as to surround the edge of atop portion of the opening 147 c.

Next, the insulator 110 a, the insulator 61 b, and the insulator 67 bare etched using the hard mask 146 to form the insulator 110, theinsulator 61, and an insulator 67 c, in which an opening 147 e and anopening 149 b are formed (see FIG. 21B). Here, the etching is performeduntil the top surface of the conductor 112 a is exposed in the opening147 e. The edges of the openings 147 a and the opening 149 a of the hardmask 146 are also etched in some cases, whereby a hard mask 146 a may beformed. The edge of the opening 147 a of the hard mask 146 a has atapered shape, and an upper part of the edge of the opening 147 a isrounded.

Note that dry etching is preferably employed for the etching. For thedry etching, for example, a C₄F₆ gas, a C₄F₈ gas, a CF₄ gas, a SF₆ gas,a CHF₃ gas, or the like can be used alone or in combination.Alternatively, an oxygen gas, a nitrogen gas, a helium gas, an argongas, a hydrogen gas, or the like can be added to any of the above gasesas appropriate. As a dry etching apparatus, an apparatus similar to thatdescribed above can be used. For example, a dry etching apparatus inwhich the frequency of a high-frequency power source connected to one ofparallel-plate electrodes is different from that of a high-frequencypower source connected to the other of the parallel-plate electrodes ispreferably used. Dry etching conditions such as selection of an etchinggas may be determined as appropriate so as to be suitable for insulatorsused as the insulator 61 a and the insulator 110 a.

Here, the opening 147 e can be regarded as being composed of an opening147 ea which is located in a lower part and formed using the insulator61 b as a mask, and an opening 147 eb which is located in an upper partand formed using the hard mask 146 as a mask. The opening 147 eafunctions as a via hole or a contact hole in a later step, and theopening 147 eb functions as a groove in which a wiring pattern or thelike is embedded in a later step.

The edge (also referred to as the inner wall) of the opening 147 eb andthe edge of the opening 149 b in the insulator 67 c preferably each havea tapered shape.

The edge (also referred to as the inner wall) of the opening 147 ea inthe insulators 110 and 61 preferably has a tapered shape. Note that theupper part of the edge of the opening 147 ea, which is provided in theinsulator 61, is preferably rounded. Owing to such a shape of theopening 147 ea, a conductor 121 having a high blocking property againsthydrogen can be formed with good coverage in a later step.

To perform the dry etching so that the opening 147 ea has such a shape,it is preferable that the etching rate of the insulator 110 a not beextremely higher than the etching rate of the insulator 61 a. Forexample, the etching rate of the insulator 110 a is set to less than orequal to eight times, preferably less than or equal to six times,further preferably less than or equal to four times the etching rate ofthe insulator 61 a.

Dry etching under the above-described conditions can shape the edge ofthe opening 147 ea into a tapered shape. In addition, even in the casewhere a by-product is formed as illustrated in FIGS. 5B and 5C, theby-product can be removed, and the upper part of the edge of the opening147 ea of the insulator 61 can be rounded.

Note that the shapes of the openings 147 e and 149 b are not limited tothe above-described shapes. For example, the inner walls of the openings147 ea, 147 eb, and 149 b can be substantially perpendicular to theconductor 112 a and the insulators 61. Alternatively, the openings 147eb and 149 b may be formed in the insulators 67 c and 61; furtheralternatively, the openings 147 eb and 149 b may be formed in theinsulators 67 c, 61, and 110.

Next, the conductor 121 is formed in the openings 147 e and 149 b, and aconductor 122 is formed over the conductor 121 so as to be embedded inthe openings 147 e and 149 b (see FIG. 22A. Here, the conductor 121 andthe conductor 122 correspond to the conductor 20 and the conductor 21illustrated in FIG. 4A.

Here, it is preferable that the conductor 121 be formed with goodcoverage so as to cover the inner walls and bottom surfaces of theopenings 147 e and 149 b. In particular, it is preferable that theconductor 121 be in contact with the insulator 61 at the edge of theopening 147 e; and it is further preferable that the opening formed inthe insulators 110 and 61 be covered with the conductor 121 so that theconductor 20 is provided along the inner wall of the opening. When theedge of the opening 147 ea in the insulators 110 and 61 has a taperedshape, and the upper part of the edge of the opening 147 ea of theinsulator 61 is rounded in the above manner, the coverage with theconductor 121 can be further improved.

The conductor 121 is preferably formed using a conductor which is lesspermeable to hydrogen than the conductor 122. For the conductor 121, ametal nitride such as tantalum nitride or titanium nitride is used, andtantalum nitride is particularly preferably used. Such a conductor 121can prevent diffusion of impurities such as hydrogen and water into theconductor 122. In addition, effects, e.g., preventing diffusion of metalcomponents contained in the conductor 122, preventing oxidation of theconductor 122, and improving adhesion of the conductor 122 with theopening 147 e, can be obtained. Furthermore, in the case where theconductor 121 is formed using stacked layers, for example, titanium,tantalum, titanium nitride, tantalum nitride, or the like may be used;and a stacked-layer structure in which titanium nitride is provided overtantalum nitride is preferably used. Moreover, in the case wheretantalum nitride is deposited as the conductor 121, heat treatment maybe performed using an RTA apparatus after the deposition.

The conductor 121 can be formed by a sputtering method, a CVD method, anMBE method, a PLD method, an ALD method, or the like. Here, it ispreferable that the formation of the conductor 121 be performed by amethod providing good coverage, e.g., a collimated sputtering method, anMCVD method, or an ALD method.

By a collimated sputtering method, sputtered particles are likely toreach the bottom surface of the opening 147 ea that has a high aspectratio, whereby a film is sufficiently deposited over the bottom surfaceof the opening 147 ea. In addition, since the inner walls of theopenings 147 ea, 147 eb, and 149 b have a tapered shape in the abovemanner, the film can also be sufficiently deposited on the inner wallsof the openings 147 ea, 147 eb, and 149 b.

When the conductor 121 is formed by an ALD method, the conductor 121 canhave good coverage, and formation of a pin hole and the like in theconductor 121 can be prevented. Forming the conductor 121 in the abovemanner can further prevent impurities such as hydrogen and water frompassing through the conductor 121 and diffusing into the conductor 122.In the case where tantalum nitride is deposited as the conductor 121 byan ALD method, for example, pentakis(dimethylamino)tantalum (structuralformula: Ta[N(CH₃)₂]₅) can be used as a precursor.

The conductor 122 may be formed to have a single-layer structure or astacked-layer structure including a conductor containing, for example,one or more kinds of boron, nitrogen, oxygen, fluorine, silicon,phosphorus, aluminum, titanium, chromium, manganese, cobalt, nickel,copper, zinc, gallium, yttrium, zirconium, molybdenum, ruthenium,silver, indium, tin, tantalum, and tungsten. For example, tungsten canbe used.

The conductor 122 can be formed by a sputtering method, a CVD method, anMBE method, a PLD method, an ALD method, or the like. Since theconductor 122 is formed so as to be embedded in the opening 147 e, a CVDmethod (an MCVD method, in particular) is preferably used.

In the case where a conductor which inhibits diffusion of copper is usedas the conductor 121, the conductor 122 can be formed using copper withlow wiring resistance. For example, tantalum nitride formed by an ALDmethod is used as the conductor 121, and copper is used as the conductor122. In that case, tantalum nitride is preferably formed to cover thetop surface of the conductor 122 a to be formed later. With such astructure, copper can be used as the conductor 62 b functioning as aback gate of the transistor 60 a, and tantalum nitride can be used asthe conductor 62 a.

Next, polishing treatment is performed on the conductor 122, theconductor 121, the hard mask 146 a, and the insulator 67 c to form theconductors 121 a and 122 a which are embedded in an opening 147 f, andthe conductors 62 a and 62 b which are embedded in the opening 149 c(see FIG. 22B). As the polishing treatment, mechanical polishing,chemical polishing, chemical mechanical polishing (CMP) or the like maybe employed. For example, CMP treatment removes the upper part of theinsulator 67 c, the upper part of the conductor 122, the upper part ofthe conductor 121, and the hard mask 146 a, whereby the insulator 67,the conductor 122 a, the conductor 121 a, the conductor 62 a, and theconductor 62 b which have flat top surfaces can be formed.

Here, the opening 147 f can be regarded as being composed of the opening147 fa which is located in the lower part and functions as a via hole ora contact hole, and the opening 147 fb which is located in the upperpart and functions as a groove in which the wiring pattern or the likeis embedded. The opening 147 fa is formed in the insulator 110 and theinsulator 61, and the opening 147 fb is formed in the insulator 67. Partof the conductor 121 a and part of the conductor 122 a which areembedded in the opening 147 fa function as a plug, and part of theconductor 121 a and part of the conductor 122 a which are embedded inthe opening 147 fb function as a wiring and the like.

In this manner, the conductors 62 a and 62 b functioning as the backgate of the transistor 60 a can be formed in parallel with formation ofthe conductors 122 a and 121 a functioning as a plug and a wiring, bythe method described in FIGS. 1A to 1D, FIGS. 2A to 2D, FIGS. 3A to 3D,and FIGS. 4A to 4D. Thus, the back gate of the transistor 60 a and thewiring and the plug which are provided in the same layer as the backgate can be formed without an increase in the number of steps. Theconductors 62 a and 62 b functioning as a back gate make it possible tocontrol the threshold voltage of the transistor 60 a. Control of thethreshold voltage can prevent the transistor 60 a from being turned onwhen a low voltage, e.g., a voltage of 0 V or lower, is applied to thegate (conductor 74) of the transistor 60 a. That is, the transistor 60 acan have a normally-off electrical characteristics.

Note that the shapes of the wiring and plug of this embodiment are notlimited to those illustrated in FIG. 22B. A typical example of thewiring and plug which have different shapes from those illustrated inFIG. 22B are described below.

As for the shapes of the wiring and the plug, an opening 147 g and anopening 149 d in FIG. 23A have different shapes from the opening 147 fand the opening 149 c in FIG. 22B, respectively. Here, since the opening147 g composed of an opening 147 ga and an opening 147 gb has the sameshape as the opening 17 g illustrated in FIG. 6A; thus, the descriptionof the opening 17 g can be referred to. The opening 149 d is formed inthe insulator 67 and the upper part of the insulator 61. Accordingly,the conductors 62 a and 62 b functioning a back gate are provided so asto be embedded in the insulator 67 and the upper part of the insulator61 in the structure illustrated in FIG. 23A.

As for the shapes of the wiring and the plug, an opening 147 h and anopening 149 e in FIG. 23B have different shapes from the opening 147 fand the opening 149 c in FIG. 22B, respectively. Here, since the opening147 h composed of an opening 147 ha and an opening 147 hb has the sameshape as the opening 17 h illustrated in FIG. 6B; thus, the descriptionof the opening 17 h can be referred to. The opening 149 e is formed inthe insulator 67, the insulator 61, and an upper part of the insulator110. Accordingly, the conductors 62 a and 62 b functioning a back gateare provided so as to be embedded in the insulator 67, the insulator 61,and the upper part of the insulator 110 in the structure illustrated inFIG. 23B.

Next, a method for forming the transistor 60 a over the conductors 62 aand 62 b which function as a back gate of the transistor 60 a and areillustrated in FIGS. 22A and 22B is described with reference tocross-sectional views illustrated in FIGS. 24A to 24F and FIGS. 25A to25F. FIGS. 24A, 24C, and 24E and FIGS. 25A, 25C, and 25E arecross-sectional views of the transistor 60 a in the channel lengthdirection A1-A2, and FIGS. 24B, 24D, and 24F and FIGS. 25B, 25D, and 25Fare cross-sectional views of the transistor 60 a in the channel widthdirection A3-A4.

First, the insulator 65 is formed over the insulator 67, the conductor62 a, and the conductor 62 b. Any of the above-described insulators canbe used for the insulator 65. The insulator 65 can be formed by asputtering method, a CVD method, an MBE method, a PLD method, an ALDmethod, or the like. For example, silicon oxide, silicon oxynitride, orthe like may be formed as the insulator 65 by a PECVD method.

Then, the insulator 63 is formed over the insulator 65. Any of theabove-described insulators can be used as the insulator 63. Theinsulator 63 can be formed by a sputtering method, a CVD method, an MBEmethod, a PLD method, an ALD method, or the like. For example, hafniumoxide or aluminum oxide formed by an ALD method may be used as theinsulator 63.

Next, the insulator 64 is formed over the insulator 63 (see FIGS. 24Aand 24B). Any of the above-described insulators can be used as theinsulator 64. The insulator 64 can be formed by a sputtering method, aCVD method, an MBE method, a PLD method, an ALD method, or the like. Forexample, silicon oxide, silicon oxynitride, or the like may be formed asthe insulator 64 by a PECVD method. Alternatively, the insulator 65, theinsulator 63, and the insulator 64 may be successively formed by an ALDmethod without being exposed to the air.

Next, heat treatment is preferably performed. The heat treatment canfurther reduce water or hydrogen in the insulator 65, the insulator 63,and the insulator 64. In addition, the insulator 64 can contain excessoxygen in some cases. The heat treatment is performed at a temperaturehigher than or equal to 250° C. and lower than or equal to 650° C.,preferably higher than or equal to 350° C. and lower than or equal to450° C. Note that in the case where tantalum nitride is used for theconductor 62 a serving as the back gate of the transistor, or the like,the temperature of the above heat treatment may be set to higher than orequal to 350° C. and lower than or equal to 410° C., preferably higherthan or equal to 370° C. and lower than or equal to 400° C. The heattreatment within such a temperature range can prevent release ofhydrogen from the tantalum nitride. The heat treatment is performed inan inert gas atmosphere or an atmosphere containing an oxidizing gas at10 ppm or more, 1% or more, or 10% or more. The heat treatment may beperformed under a reduced pressure. Alternatively, the heat treatmentmay be performed in such a manner that heat treatment is performed in aninert gas atmosphere, and then another heat treatment is performed in anatmosphere containing an oxidizing gas at 10 ppm or more, 1% or more, or10% or more in order to compensate released oxygen. By the heattreatment, impurities such as hydrogen and water can be removed, forexample. For the heat treatment, lamp heating can be performed with useof an RTA apparatus. Heat treatment with an RTA apparatus is effectivefor an improvement in productivity because it needs short time ascompared with the case of using a furnace.

Next, an insulator 69 a to be the insulator 66 a is formed. Any of theabove-described insulators and semiconductors that can be used for theinsulator 66 a can be used for the insulator 69 a. The insulator 69 acan be deposited by a sputtering method, a CVD method, an MBE method, aPLD method, an ALD method, or the like. The insulator 69 a is preferablyformed while the substrate is being heated. The temperature of thesubstrate heating and the like may be similar to those of heat treatmentdescribed layer, for example.

Next, a semiconductor 69 b to be the semiconductor 66 b is formed. Anyof the above-described semiconductors that can be used for thesemiconductor 66 b can be used for the semiconductor 66 b. Thesemiconductor 66 b can be formed by a sputtering method, a CVD method,an MBE method, a PLD method, an ALD method, or the like. Thesemiconductor 66 b is preferably formed while the substrate is beingheated. The temperature of the substrate heating and the like may besimilar to those of heat treatment described layer, for example. Notethat successive film formation of the insulator 69 a and thesemiconductor to be semiconductor 66 b without exposure to the air canreduce entry of impurities into the films and their interface.

Next, heat treatment is preferably performed on the insulator 69 a andthe semiconductor 69 b. The heat treatment can reduce the hydrogenconcentrations of the insulator 66 a and the semiconductor 66 b in somecases. Furthermore, the heat treatment can reduce oxygen vacancies inthe insulator 66 a and the semiconductor 66 b in some cases. The heattreatment is performed at a temperature higher than or equal to 250° C.and lower than or equal to 650° C., preferably higher than or equal to350° C. and lower than or equal to 450° C. Note that in the case wheretantalum nitride is used for the conductor 62 a serving as the back gateof the transistor, or the like, the temperature of the above heattreatment may be set to higher than or equal to 350° C. and lower thanor equal to 410° C., preferably higher than or equal to 370° C. andlower than or equal to 400° C. The heat treatment within such atemperature range can prevent release of hydrogen from the tantalumnitride. The heat treatment is performed in an inert gas atmosphere oran atmosphere containing an oxidizing gas at 10 ppm or more, 1% or more,or 10% or more. The heat treatment may be performed under a reducedpressure. Alternatively, the heat treatment may be performed in such amanner that heat treatment is performed in an inert gas atmosphere, andthen another heat treatment is performed in an atmosphere containing anoxidizing gas at 10 ppm or more, 1% or more, or 10% or more in order tocompensate released oxygen. The heat treatment can increase thecrystallinity of the insulator 66 a and the semiconductor 66 b and canremove impurities such as hydrogen and water, for example. For the heattreatment, lamp heating can be performed with use of an RTA apparatus.Heat treatment with an RTA apparatus is effective for an improvement inproductivity because it needs short time as compared with the case ofusing a furnace. By heat treatment, the peak intensity is increased anda full width at half maximum is decreased when a CAAC-OS described lateris used for the insulator 66 a and the semiconductor 66 b. In otherwords, the crystallinity of a CAAC-OS is increased by heat treatment.

By the heat treatment, oxygen can be supplied from the insulator 64 tothe insulator 69 a and the semiconductor 69 b. The heat treatmentperformed on the insulator 64 makes it very easy to supply oxygen to theinsulator to be the insulator 66 a and the semiconductor to be thesemiconductor 66 b.

Here, the insulator 63 functions as a barrier film that blocks oxygen.The insulator 63 is provided below the insulator 64, thereby preventingthe oxygen that has diffused in the insulator 64 from diffusing into thelayers below the insulator 64.

Oxygen is supplied to the insulator to be the insulator 66 a and thesemiconductor to be the semiconductor 66 b to reduce oxygen vacancies inthis manner, whereby a highly purified intrinsic or substantially highlypurified intrinsic oxide semiconductor with a low density of defectstates can be obtained.

Next, a conductor 68 to be the conductors 68 a and 68 b is formed (seeFIGS. 24C and 24D). Any of the above-described conductors that can beused as the conductors 68 a and 68 b can be used as the conductor 68.The conductor 68 can be formed by the sputtering method, the CVD method,the MBE method, the PLD method, the ALD method, or the like. Forexample, tantalum nitride may be deposited by a sputtering method, andtungsten may be deposited thereover to form the conductor 68.

Then, a resist or the like is formed over the conductor 68, and then theinsulator 69 a, the semiconductor 69 b, and the conductor 68 areprocessed into an island shape using the resist or the like; as aresult, the conductor 68, the semiconductor 66 b, and the insulator 66 awhich have an island shape are formed.

Next, heat treatment may be performed. The heat treatment can furtherreduce water or hydrogen in the insulator 64, the insulator 63, theinsulator 65, the insulator 66 a, and the semiconductor 66 b. The heattreatment is performed at a temperature higher than or equal to 250° C.and lower than or equal to 650° C., preferably higher than or equal to350° C. and lower than or equal to 450° C. Note that in the case wheretantalum nitride is used for the conductor 62 a serving as the back gateof the transistor, or the like, the temperature of the above heattreatment may be set to higher than or equal to 350° C. and lower thanor equal to 410° C., preferably higher than or equal to 370° C. andlower than or equal to 400° C. The heat treatment within such atemperature range can prevent release of hydrogen from the tantalumnitride. The heat treatment may be performed in an inert gas atmosphere.The heat treatment may be performed in an atmosphere containing anoxidizing gas. The heat treatment may be performed under a reducedpressure. Alternatively, the heat treatment may be performed in such amanner that heat treatment is performed in an inert gas atmosphere, andthen another heat treatment is performed in an atmosphere containing anoxidizing gas at 10 ppm or more, 1% or more, or 10% or more in order tocompensate released oxygen. For the heat treatment, lamp heating can beperformed with use of an RTA apparatus. Heat treatment with an RTAapparatus is effective for an improvement in productivity because itneeds short time as compared with the case of using a furnace.

Owing to the heat treatments performed so far, impurities that affectthe oxide semiconductor, such as water and hydrogen, can be reducedbefore formation of the oxide semiconductor. In addition, since the viahole formed in the insulator 61 is filled with the conductor 121 a andthe like as described above, impurities contained in the layers belowthe insulator 61, such as hydrogen, can be prevented from diffusing intothe layers over the insulator 61. Furthermore, when the temperature ofprocess performed after formation of the oxide semiconductor is set tolower than or equal to the temperature at which hydrogen is diffusedfrom the conductor 121 a or the like, an influence by diffusion ofimpurities can be reduced.

When the heat treatment is performed at the stage where the insulator 66a and the semiconductor 66 b are formed and a surface of the insulator64 is exposed, as described above, it is possible to inhibit supply ofwater and hydrogen to the insulator 66 a and the semiconductor 66 b andto further reduce water and hydrogen in the insulator 64, the insulator63, and the insulator 65.

In the case where an etching gas containing impurities such as hydrogenand carbon are used for the formation of the insulator 66 a and thesemiconductor 66 b, the impurities such as hydrogen and carbon sometimesenter the insulator 66 a, the semiconductor 66 b, and the like. Theimpurities such as hydrogen and carbon that enter the insulator 66 a andthe semiconductor 66 b at the time of etching can be released by heattreatment performed after the formation of the insulator 66 a and thesemiconductor 66 b.

Next, a resist or the like is formed over the island-shaped conductor68, and processing is performed using the resist or the like to form theconductors 68 a and 68 b (see FIGS. 24E and 24F).

A low-resistance region is formed in a region of the semiconductor 66 bwhich is in contact with the conductor 68 a or 68 b in some cases. Aregion of the semiconductor 66 b between the conductors 68 a and 68 bmay have a smaller thickness than that of the region of thesemiconductor 66 b over which the conductor 68 a or 68 b is positioned.This region is formed by removing part of the top surface of thesemiconductor 66 b at the time of formation of the conductors 68 a and68 b.

Then, an insulator 69 c to be the insulator 66 c is formed over theinsulator 64, the insulator 66 a, the semiconductor 66 b, the conductor68 a, and the conductor 68 b. Any of the above-described insulators orsemiconductors that can be used for the insulator 66 c and the like isused for the insulator 69 c. The insulator 66 c can be formed by asputtering method, a CVD method, an MBE method, a PLD method, an ALDmethod, or the like. Before the formation of the insulator to be theinsulator 66 c, surfaces of the semiconductor 66 b and the like may beetched. For example, plasma containing a rare gas can be used for theetching. After that, the insulator to be the insulator 66 c issuccessively formed without being exposed to the air, whereby impuritiescan be prevented from entering an interface between the semiconductor 66b and the insulator 66 c. In some cases, impurities at an interfacebetween films are diffused more easily than impurities in a film. Forthis reason, a reduction in impurity at the interfaces leads to stableelectrical characteristics of a transistor.

Next, an insulator 72 a to be the insulator 72 is formed over theinsulator 69 c. Any of the above-described insulators that can be usedfor the insulator 72 can be used for the insulator 72 a, for example.The insulator 72 a can be formed by a sputtering method, a CVD method,an MBE method, a PLD method, an ALD method, or the like. For example,silicon oxynitride or the like may be deposited as the insulator 69 c bya PECVD method. Note that successive formation of the insulator 69 c andthe insulator 72 a without exposure to the air can reduce entry ofimpurities into the films and their interface.

Then, a conductor to be the conductor 74 is formed over the insulator72. As the conductor 74, the conductor that can be used for theconductor 74 may be used. The conductor to be conductor 74 can be formedby a sputtering method, a CVD method, an MBE method, a PLD method, anALD method, or the like. For example, to form the conductor to be theconductor 74, titanium is deposited by an ALD method and tungsten isdeposited thereover by a sputtering method.

Subsequently, a resist or the like is formed over the conductor that isto be the conductor 74, and processing is performed using the resist orthe like, whereby the conductor 74 is formed (see FIGS. 25A and 25B).

Next, an insulator to be the insulator 79 is formed over the insulator72 a. Any of the above-described insulators that can be used as theinsulator 79 can be used as the insulator to be the insulator 79. Theinsulator to be the insulator 79 can be formed by a sputtering method, aCVD method, an MBE method, a PLD method, an ALD method, or the like. Forexample, gallium oxide, aluminum oxide, or the like may be deposited asthe insulator to be the insulator 79 by an ALD method.

Next, a resist or the like is formed over the insulator to be theinsulator 79, and processing is performed using the resist or the like,whereby the insulator 79 is formed (see FIGS. 25C and 25D).

After that, the insulator 77 is formed over the insulator 64, theinsulator 79, the conductor 68 a, the conductor 68 b, and the like. Anyof the above-mentioned insulators can be used for the insulator 77. Asdescribed above, the amount of impurities such as hydrogen, water, andnitrogen oxide contained in the insulator 77 is preferably small. Theinsulator 77 can be formed by a sputtering method, a CVD method, an MBEmethod, a PLD method, an ALD method, or the like. For example, siliconoxynitride or the like may be deposited as the insulator 77 by a PECVDmethod.

Then, it is preferable that the planarity of the top surface of theinsulator 77 be improved by a CMP method or the like.

Here, as also illustrated in FIG. 17, an opening is preferably formed inthe insulators 67, 65, 63, 64, and 77 in the vicinity of a regionoverlapping the scribe line 138, by lithography or the like.

Then, the insulator 78 is formed over the insulator 77. Any of theabove-described insulators may be used as the insulator 78 (see FIGS.25E and 25F). The insulator 78 can be formed by a sputtering method, aCVD method, an MBE method, a PLD method, an ALD method, or the like. Asillustrated in FIG. 17, the insulator 78 is formed to cover sidesurfaces of the insulators 67, 65, 63, 64, and 77 in the opening in thevicinity of the scribe line 138, and the insulator 78 is in contact withthe insulator 61 in the opening.

The insulator 78 is formed preferably with the use of plasma, furtherpreferably by a sputtering method, and still further preferably by asputtering method in an atmosphere containing oxygen.

As the sputtering method, a direct current (DC) sputtering method inwhich a direct-current power source is used as a sputtering powersource, a DC sputtering method in which a pulsed bias is applied (i.e.,a pulsed DC sputtering method), or a radio frequency (RF) sputteringmethod in which a high frequency power source is used as a sputteringpower source may be used. Alternatively, a magnetron sputtering methodusing a magnet mechanism inside a chamber, a bias sputtering method inwhich voltage is also applied to a substrate during deposition, areactive sputtering method performed in a reactive gas atmosphere, orthe like may be used. Still alternatively, the above-described PESP orVDSP method may be used. The oxygen gas flow rate or deposition powerfor sputtering can be set as appropriate in accordance with the amountof oxygen to be added.

Here, as the insulator 78, an oxide insulating film of aluminum oxide orthe like having a blocking effect against oxygen, hydrogen, water, orthe like is preferably provided. For example, aluminum oxide may beformed as the insulator 78 by a sputtering method. In addition, aluminumoxide is preferably formed thereover by an ALD method. The use ofaluminum oxide formed by an ALD method can prevent formation of pinholes and the like, leading to a further improvement in the blockingeffect of the insulator 61 against hydrogen and water.

When the insulator 78 is formed by a sputtering method, oxygen is addedto the vicinity of a surface of the insulator 77 (after the formation ofthe insulator 78, an interface between the insulator 77 and theinsulator 78) at the same time as the formation. Although the oxygen isadded to the insulator 77 as an oxygen radical, for example, the stateof the oxygen at the time of being added is not limited thereto. Theoxygen may be added to the insulator 77 as an oxygen atom, an oxygenion, or the like. Note that by addition of oxygen, oxygen in excess ofthe stoichiometric composition is contained in the insulator 77 in somecases, and the oxygen in such a case can be called excess oxygen.

The insulator 78 is preferably formed while the substrate is beingheated. The substrate heating may be performed at a temperature higherthan or equal to 250° C. and lower than or equal to 650° C., preferablyhigher than or equal to 350° C. and lower than or equal to 450° C., forexample. Note that in the case where tantalum nitride is used for theconductor 62 a serving as the back gate of the transistor, or the like,the temperature of the above heat treatment may be set to higher than orequal to 350° C. and lower than or equal to 410° C., preferably higherthan or equal to 370° C. and lower than or equal to 400° C. The heattreatment within such a temperature range can prevent release ofhydrogen from the tantalum nitride.

Next, heat treatment is preferably performed. By the heat treatment,oxygen added to the insulator 64 or the insulator 77 can be diffused tobe supplied to the insulator 66 a, the semiconductor 66 b, and theinsulator 66 c. The heat treatment is performed at a temperature higherthan or equal to 250° C. and lower than or equal to 650° C., preferablyhigher than or equal to 350° C. and lower than or equal to 450° C. Theheat treatment is performed in an inert gas atmosphere or an atmospherecontaining an oxidizing gas at 10 ppm or more, 1% or more, or 10% ormore. The heat treatment may be performed under a reduced pressure. Forthe heat treatment, lamp heating can be performed with use of an RTAapparatus.

This heat treatment is preferably performed at a temperature lower thanthat of the heat treatment performed after formation of thesemiconductor 66 b. A temperature difference between the heat treatmentand the heat treatment performed after formation of the semiconductor 66b is higher than or equal to 20° C. and lower than or equal to 150° C.,preferably higher than or equal to 40° C. and lower than or equal to100° C. Accordingly, superfluous release of excess oxygen (oxygen) fromthe insulator 64 and the like can be inhibited. Note that in the casewhere heating at the time of formation of the layers (e.g., heating atthe time of formation of the insulator 78) doubles as the heat treatmentafter formation of the insulator 78, the heat treatment after formationof the insulator 78 is not necessarily performed.

By the heat treatment, oxygen added to the insulator 64 and theinsulator 77 is diffused to the insulator 64 or the insulator 72. Theinsulator 78 is less permeable to oxygen than the insulator 77 andfunctions as a barrier film that blocks oxygen. Since the insulator 78is formed over the insulator 77, oxygen diffuses into the insulator 77not in the upward direction but mainly in the horizontal direction orthe downward direction. In the case where the insulator 78 is heatedwhile the substrate is heated, oxygen can be concurrently added anddiffused to the insulator 64 and the insulator 77.

The oxygen diffused into the insulator 64 or the insulator 77 issupplied to the insulator 66 a, the insulator 66 c, and thesemiconductor 66 b. The insulator 63 having a function of blockingoxygen is provided below the insulator 64, thereby preventing the oxygendiffusing into the insulator 64 from diffusing into the layers below theinsulator 64. In the vicinity of the scribe line 138 illustrated in FIG.17, the insulators 78 and 61 covering the side surface of the insulator77 inhibit diffusion of oxygen into the outside of the insulator 78,whereby the insulator 77 can be filled with oxygen and oxygen can besupplied from the insulator 77 to the insulator 66 a, the semiconductor66 b, and the insulator 66 c.

In the heat treatment, the insulator 61, the conductor 121 a provided inthe via hole formed in the insulator 61, and the like can blockimpurities such as hydrogen and water that diffuse from the lowerlayers, and the insulator 78 can block impurities such as hydrogen andwater that diffuse from the top and side surfaces of the insulator 77.Thus, the amount of impurities such as hydrogen and water included inthe insulator 77, 66 a, 66 c, and 66 b which are wrapped with theinsulators 61 and 78 can be small. Impurities such as hydrogen aresometimes bonded to oxygen in the insulator 77 or the like to becomewater, which might prevent diffusion of oxygen. Therefore, reducing theamount of impurities such as hydrogen and water in the insulator 77 canpromote supply of oxygen.

In this manner, impurities such as water and hydrogen can be preventedfrom diffusing into the insulator 66 a, the insulator 66 c, and thesemiconductor 66 b, in particular, the semiconductor 66 b; as a result,oxygen can be efficiently supplied thereto. Oxygen is supplied to theinsulator 66 a, the insulator 66 c, and the semiconductor 66 b to reduceoxygen vacancies in this manner, whereby a highly purified intrinsic orsubstantially highly purified intrinsic oxide semiconductor with a lowdensity of defect states can be obtained.

Note that heat treatment after the formation of the insulator 78 may beperformed at any time after the insulator 78 is formed.

Through the above process, the transistor 60 a can be formed.

The use of the method for manufacturing a semiconductor device describedin this embodiment makes it possible to provide a semiconductor devicewith a transistor having stable electrical characteristics, asemiconductor device with a transistor having a low leakage current inan off state, a semiconductor device with a transistor havingnormally-off characteristics, and a semiconductor device with a highlyreliable transistor.

The structure and method described in this embodiment can be combined asappropriate with any of the other structures and methods described inthe other embodiments.

Embodiment 2

In this embodiment, an oxide semiconductor included in a semiconductordevice of one embodiment of the present invention is described below indetail.

<Structure of Oxide Semiconductor>

A structure of an oxide semiconductor is described below.

An oxide semiconductor is classified into a single crystal oxidesemiconductor and a non-single-crystal oxide semiconductor. Examples ofa non-single-crystal oxide semiconductor include a c-axis-alignedcrystalline oxide semiconductor (CAAC-OS), a polycrystalline oxidesemiconductor, a nanocrystalline oxide semiconductor (nc-OS), anamorphous-like oxide semiconductor (a-like OS), and an amorphous oxidesemiconductor.

From another perspective, an oxide semiconductor is classified into anamorphous oxide semiconductor and a crystalline oxide semiconductor.Examples of a crystalline oxide semiconductor include a single crystaloxide semiconductor, a CAAC-OS, a polycrystalline oxide semiconductor,and an nc-OS.

An amorphous structure is generally thought to be isotropic and have nonon-uniform structure, to be metastable and not have fixed positions ofatoms, to have a flexible bond angle, and to have a short-range orderbut have no long-range order, for example.

This means that a stable oxide semiconductor cannot be regarded as acompletely amorphous oxide semiconductor. Moreover, an oxidesemiconductor that is not isotropic (e.g., an oxide semiconductor thathas a periodic structure in a microscopic region) cannot be regarded asa completely amorphous oxide semiconductor. In contrast, an a-like OS,which is not isotropic, has an unstable structure that contains a void.Because of its instability, an a-like OS is close to an amorphous oxidesemiconductor in terms of physical properties.

<CAAC-OS>

First, a CAAC-OS is described.

A CAAC-OS is one of oxide semiconductors having a plurality of c-axisaligned crystal parts (also referred to as pellets).

Analysis of a CAAC-OS by X-ray diffraction (XRD) is described. Forexample, when the structure of a CAAC-OS including an InGaZnO₄ crystalthat is classified into the space group R-3m is analyzed by anout-of-plane method, a peak appears at a diffraction angle (2θ) ofaround 31° as shown in FIG. 29A. This peak is derived from the (009)plane of the InGaZnO₄ crystal, which indicates that crystals in theCAAC-OS have c-axis alignment, and that the c-axes are aligned in adirection substantially perpendicular to a surface over which theCAAC-OS film is formed (also referred to as a formation surface) or thetop surface of the CAAC-OS film. Note that a peak sometimes appears at a2θ of around 36° in addition to the peak at a 2θ of around 31°. The peakat a 2θ of around 36° is derived from a crystal structure that isclassified into the space group Fd-3m; thus, this peak is preferably notexhibited in a CAAC-OS.

On the other hand, in structural analysis of the CAAC-OS by an in-planemethod in which an X-ray is incident on the CAAC-OS in a directionparallel to the formation surface, a peak appears at a 2θ of around 56°.This peak is attributed to the (110) plane of the InGaZnO₄ crystal. Whenanalysis (φ scan) is performed with 2θ fixed at around 56° and with thesample rotated using a normal vector to the sample surface as an axis (φaxis), as shown in FIG. 29B, a peak is not clearly observed. Incontrast, in the case where single crystal InGaZnO₄ is subjected to φscan with 2θ fixed at around 56°, as shown in FIG. 29C, six peaks thatare derived from crystal planes equivalent to the (110) plane areobserved. Accordingly, the structural analysis using XRD shows that thedirections of a-axes and b-axes are irregularly oriented in the CAAC-OS.

Next, a CAAC-OS analyzed by electron diffraction is described. Forexample, when an electron beam with a probe diameter of 300 nm isincident on a CAAC-OS including an InGaZnO₄ crystal in a directionparallel to the formation surface of the CAAC-OS, a diffraction pattern(also referred to as a selected-area electron diffraction pattern) shownin FIG. 29D can be obtained. In this diffraction pattern, spots derivedfrom the (009) plane of an InGaZnO₄ crystal are included. Thus, theelectron diffraction also indicates that pellets included in the CAAC-OShave c-axis alignment and that the c-axes are aligned in a directionsubstantially perpendicular to the formation surface or the top surfaceof the CAAC-OS. Meanwhile, FIG. 29E shows a diffraction pattern obtainedin such a manner that an electron beam with a probe diameter of 300 nmis incident on the same sample in a direction perpendicular to thesample surface. As shown in FIG. 29E, a ring-like diffraction pattern isobserved. Thus, the electron diffraction using an electron beam with aprobe diameter of 300 nm also indicates that the a-axes and b-axes ofthe pellets included in the CAAC-OS do not have regular orientation. Thefirst ring in FIG. 29E is considered to be derived from the (010) plane,the (100) plane, and the like of the InGaZnO₄ crystal. The second ringin FIG. 29E is considered to be derived from the (110) plane and thelike.

In a combined analysis image (also referred to as a high-resolution TEMimage) of a bright-field image and a diffraction pattern of a CAAC-OS,which is obtained using a transmission electron microscope (TEM), aplurality of pellets can be observed. However, even in thehigh-resolution TEM image, a boundary between pellets, that is, a grainboundary is not clearly observed in some cases. Thus, in the CAAC-OS, areduction in electron mobility due to the grain boundary is less likelyto occur.

FIG. 30A shows a high-resolution TEM image of a cross section of theCAAC-OS that is observed from a direction substantially parallel to thesample surface. The high-resolution TEM image is obtained with aspherical aberration corrector function. The high-resolution TEM imageobtained with a spherical aberration corrector function is particularlyreferred to as a Cs-corrected high-resolution TEM image. TheCs-corrected high-resolution TEM image can be observed with, forexample, an atomic resolution analytical electron microscope JEM-ARM200Fmanufactured by JEOL Ltd.

FIG. 30A shows pellets in which metal atoms are arranged in a layeredmanner. FIG. 30A proves that the size of a pellet is greater than orequal to 1 nm or greater than or equal to 3 nm. Therefore, the pelletcan also be referred to as a nanocrystal (nc). Furthermore, the CAAC-OScan also be referred to as an oxide semiconductor including c-axisaligned nanocrystals (CANC). A pellet reflects unevenness of a formationsurface or a top surface of the CAAC-OS, and is parallel to theformation surface or the top surface of the CAAC-OS.

FIGS. 30B and 30C show Cs-corrected high-resolution TEM images of aplane of the CAAC-OS observed from a direction substantiallyperpendicular to the sample surface. FIGS. 30D and 30E are imagesobtained through image processing of FIGS. 30B and 30C. The method ofimage processing is as follows. The image in FIG. 30B is subjected tofast Fourier transform (FFT), so that FFT images are obtained. Then,mask processing is performed such that a range of from 2.8 nm⁻¹ to 5.0nm⁻¹ from the origin point in the obtained FFT images remains. After themask processing, the FFT images are processed by inverse fast Fouriertransform (IFFT) to obtain processed images. The images obtained in thismanner are called FFT filtering images. An FFT filtering image is aCs-corrected high-resolution TEM image from which a periodic componentis extracted, and shows a lattice arrangement.

In FIG. 30D, a portion where a lattice arrangement is broken is denotedwith a dashed line. A region surrounded by a dashed line is one pellet.The portion denoted with the dashed line is a junction of pellets. Thedashed line draws a hexagon, which means that the pellet has a hexagonalshape. Note that the shape of the pellet is not always a regular hexagonbut is a non-regular hexagon in many cases.

In FIG. 30E, a dotted line denotes a portion where the direction of alattice arrangement is changed between a region with a regular latticearrangement and another region with a regular lattice arrangement, and adashed line denotes the change in the direction of the latticearrangement. A clear crystal grain boundary cannot be observed even inthe vicinity of the dotted line. When a lattice point in the vicinity ofthe dotted line is regarded as a center and surrounding lattice pointsare joined, a distorted hexagon, pentagon, and/or heptagon can beformed. That is, a lattice arrangement is distorted so that formation ofa crystal grain boundary is inhibited. This is probably because theCAAC-OS can tolerate distortion owing to a low density of the atomicarrangement in an a-b plane direction, the interatomic bond distancechanged by substitution of a metal element, and the like.

As described above, the CAAC-OS has c-axis alignment, its pellets(nanocrystals) are connected in an a-b plane direction, and the crystalstructure has distortion. For this reason, the CAAC-OS can also bereferred to as an oxide semiconductor including a c-axis-aligneda-b-plane-anchored (CAA) crystal.

The CAAC-OS is an oxide semiconductor with high crystallinity. Entry ofimpurities, formation of defects, or the like might decrease thecrystallinity of an oxide semiconductor. This means that the CAAC-OS hassmall amounts of impurities and defects (e.g., oxygen vacancies).

Note that the impurity means an element other than the main componentsof the oxide semiconductor, such as hydrogen, carbon, silicon, or atransition metal element. For example, an element (specifically, siliconor the like) having higher strength of bonding to oxygen than a metalelement included in an oxide semiconductor extracts oxygen from theoxide semiconductor, which results in disorder of the atomic arrangementand reduced crystallinity of the oxide semiconductor. A heavy metal suchas iron or nickel, argon, carbon dioxide, or the like has a large atomicradius (or molecular radius), and thus disturbs the atomic arrangementof the oxide semiconductor and decreases crystallinity.

The characteristics of an oxide semiconductor having impurities ordefects might be changed by light, heat, or the like. Impuritiesincluded in the oxide semiconductor might serve as carrier traps orcarrier generation sources, for example. For example, oxygen vacanciesin the oxide semiconductor might serve as carrier traps or serve ascarrier generation sources when hydrogen is captured therein.

The CAAC-OS having small amounts of impurities and oxygen vacancies isan oxide semiconductor film with a low carrier density (specifically,lower than 8×10¹¹/cm³, preferably lower than 1×10¹¹/cm³, and furtherpreferably lower than 1×10¹⁰/cm³ and higher than or equal to1×10⁻⁹/cm³). Such an oxide semiconductor is referred to as a highlypurified intrinsic or substantially highly purified intrinsic oxidesemiconductor. A CAAC-OS has a low impurity concentration and a lowdensity of defect states. Thus, the CAAC-OS can be referred to as anoxide semiconductor having stable characteristics.

<nc-OS>

Next, an nc-OS is described.

Analysis of an nc-OS by XRD is described. When the structure of an nc-OSis analyzed by an out-of-plane method, a peak indicating orientationdoes not appear. That is, a crystal of an nc-OS does not haveorientation.

For example, when an electron beam with a probe diameter of 50 nm isincident on a 34-nm-thick region of thinned nc-OS including an InGaZnO₄crystal in a direction parallel to the formation surface, a ring-shapeddiffraction pattern (a nanobeam electron diffraction pattern) shown inFIG. 31A is observed. FIG. 31B shows a diffraction pattern obtained whenan electron beam with a probe diameter of 1 nm is incident on the samesample. As shown in FIG. 31B, a plurality of spots are observed in aring-like region. In other words, ordering in an nc-OS is not observedwith an electron beam with a probe diameter of 50 nm but is observedwith an electron beam with a probe diameter of 1 nm.

Furthermore, an electron diffraction pattern in which spots are arrangedin an approximately regular hexagonal shape is observed in some cases asshown in FIG. 31C when an electron beam having a probe diameter of 1 nmis incident on a region with a thickness of less than 10 nm. This meansthat an nc-OS has a well-ordered region, i.e., a crystal, in the rangeof less than 10 nm in thickness. Note that an electron diffractionpattern having regularity is not observed in some regions becausecrystals are aligned in various directions.

FIG. 31D shows a Cs-corrected high-resolution TEM image of a crosssection of an nc-OS observed from the direction substantially parallelto the formation surface. In a high-resolution TEM image, an nc-OS has aregion in which a crystal part is observed, such as the part indicatedby additional lines in FIG. 31D, and a region in which a crystal part isnot clearly observed. In most cases, the size of a crystal part includedin the nc-OS is greater than or equal to 1 nm and less than or equal to10 nm, or specifically, greater than or equal to 1 nm and less than orequal to 3 nm. Note that an oxide semiconductor including a crystal partwhose size is greater than 10 nm and less than or equal to 100 nm issometimes referred to as a microcrystalline oxide semiconductor. In ahigh-resolution TEM image of the nc-OS, for example, a grain boundary isnot clearly observed in some cases. Note that there is a possibilitythat the origin of the nanocrystal is the same as that of a pellet in aCAAC-OS. Therefore, a crystal part of the nc-OS may be referred to as apellet in the following description.

As described above, in the nc-OS, a microscopic region (for example, aregion with a size greater than or equal to 1 nm and less than or equalto 10 nm, in particular, a region with a size greater than or equal to 1nm and less than or equal to 3 nm) has a periodic atomic arrangement.There is no regularity of crystal orientation between different pelletsin the nc-OS. Thus, the orientation of the whole film is not ordered.Accordingly, the nc-OS cannot be distinguished from an a-like OS or anamorphous oxide semiconductor, depending on an analysis method.

Since there is no regularity of crystal orientation between the pellets(nanocrystals) as mentioned above, the nc-OS can also be referred to asan oxide semiconductor including random aligned nanocrystals (RANC) oran oxide semiconductor including non-aligned nanocrystals (NANC).

The nc-OS is an oxide semiconductor that has high regularity as comparedwith an amorphous oxide semiconductor. Therefore, the nc-OS is likely tohave a lower density of defect states than an a-like OS and an amorphousoxide semiconductor. Note that there is no regularity of crystalorientation between different pellets in the nc-OS. Therefore, the nc-OShas a higher density of defect states than the CAAC-OS.

<a-Like OS>

An a-like OS has a structure between those of the nc-OS and theamorphous oxide semiconductor.

FIGS. 32A and 32B are high-resolution cross-sectional TEM images of ana-like OS. FIG. 32A is the high-resolution cross-sectional TEM image ofthe a-like OS at the start of the electron irradiation. FIG. 32B is thehigh-resolution cross-sectional TEM image of a-like OS after theelectron (e) irradiation at 4.3×10⁸ e⁻/nm². FIGS. 32A and 32B show thatstripe-like bright regions extending vertically are observed in thea-like OS from the start of the electron irradiation. It can be alsofound that the shape of the bright region changes after the electronirradiation. Note that the bright region is presumably a void or alow-density region.

The a-like OS has an unstable structure because it contains a void. Toverify that an a-like OS has an unstable structure as compared with aCAAC-OS and an nc-OS, a change in structure caused by electronirradiation is described below.

An a-like OS, an nc-OS, and a CAAC-OS are prepared as samples. Each ofthe samples is an In—Ga—Zn oxide.

First, a high-resolution cross-sectional TEM image of each sample isobtained. The high-resolution cross-sectional TEM images show that allthe samples have crystal parts.

It is known that a unit cell of an InGaZnO₄ crystal has a structure inwhich nine layers including three In—O layers and six Ga—Zn—O layers arestacked in the c-axis direction. The distance between the adjacentlayers is equivalent to the lattice spacing on the (009) plane (alsoreferred to as d value). The value is calculated to be 0.29 nm fromcrystal structural analysis. Accordingly, a portion where the spacingbetween lattice fringes is greater than or equal to 0.28 nm and lessthan or equal to 0.30 nm is regarded as a crystal part of InGaZnO₄ inthe following description. Each of lattice fringes corresponds to thea-b plane of the InGaZnO₄ crystal.

FIG. 33 shows a change in the average size of crystal parts (at 22points to 30 points) in each sample. Note that the crystal part sizecorresponds to the length of a lattice fringe. FIG. 33 indicates thatthe crystal part size in the a-like OS increases with an increase in thecumulative electron dose in obtaining TEM images, for example. As shownin FIG. 33, a crystal part of approximately 1.2 nm (also referred to asan initial nucleus) at the start of TEM observation grows to a size ofapproximately 1.9 nm at a cumulative electron (e⁻) dose of 4.2×10⁸e⁻/nm². In contrast, the crystal part size in the nc-OS and the CAAC-OSshows little change from the start of electron irradiation to acumulative electron dose of 4.2×10⁸ e⁻/nm². As shown in FIG. 33, thecrystal part sizes in an nc-OS and a CAAC-OS are approximately 1.3 nmand approximately 1.8 nm, respectively, regardless of the cumulativeelectron dose. For the electron beam irradiation and TEM observation, aHitachi H-9000NAR transmission electron microscope was used. Theconditions of electron beam irradiation were as follows: theaccelerating voltage was 300 kV; the current density was 6.7×10⁵e⁻/(nm²·s); and the diameter of irradiation region was 230 nm.

In this manner, growth of the crystal part in the a-like OS is sometimesinduced by electron irradiation. In contrast, in the nc-OS and theCAAC-OS, growth of the crystal part is hardly induced by electronirradiation. Therefore, the a-like OS has an unstable structure ascompared with the nc-OS and the CAAC-OS.

The a-like OS has a lower density than the nc-OS and the CAAC-OS becauseit contains a void. Specifically, the density of the a-like OS is higherthan or equal to 78.6% and lower than 92.3% of the density of the singlecrystal oxide semiconductor having the same composition. The density ofeach of the nc-OS and the CAAC-OS is higher than or equal to 92.3% andlower than 100% of the density of the single crystal oxide semiconductorhaving the same composition. Note that it is difficult to deposit anoxide semiconductor having a density of lower than 78% of the density ofthe single crystal oxide semiconductor.

For example, in the case of an oxide semiconductor having an atomicratio of In:Ga:Zn=1:1:1, the density of single crystal InGaZnO₄ with arhombohedral crystal structure is 6.357 g/cm³. Accordingly, in the caseof the oxide semiconductor having an atomic ratio of In:Ga:Zn=1:1:1, thedensity of the a-like OS is higher than or equal to 5.0 g/cm³ and lowerthan 5.9 g/cm³. For example, in the case of the oxide semiconductorhaving an atomic ratio of In:Ga:Zn=1:1:1, the density of each of thenc-OS and the CAAC-OS is higher than or equal to 5.9 g/cm³ and lowerthan 6.3 g/cm³.

Note that in the case where an oxide semiconductor having a certaincomposition does not exist in a single crystal structure, single crystaloxide semiconductors with different compositions are combined at anadequate ratio, which makes it possible to calculate density equivalentto that of a single crystal oxide semiconductor with the desiredcomposition. The density of a single crystal oxide semiconductor havingthe desired composition can be calculated using a weighted averageaccording to the combination ratio of the single crystal oxidesemiconductors with different compositions. Note that it is preferableto use as few kinds of single crystal oxide semiconductors as possibleto calculate the density.

As described above, oxide semiconductors have various structures andvarious properties. Note that an oxide semiconductor may be a stackedlayer including two or more films of an amorphous oxide semiconductor,an a-like OS, an nc-OS, and a CAAC-OS, for example.

The structures and methods described in this embodiment can be used incombination as appropriate with any of the other structures and methodsdescribed in the other embodiments.

Embodiment 3

In this embodiment, an example of a circuit of a semiconductor deviceincluding the transistor or the like of one embodiment of the presentinvention is described.

<Circuit>

An example of a circuit of a semiconductor device including a transistoror the like of one embodiment of the present invention is describedbelow.

<CMOS Inverter>

A circuit diagram in FIG. 34A shows a configuration of what is called aCMOS inverter in which a p-channel transistor 2200 and an n-channeltransistor 2100 are connected to each other in series and in which gatesof them are connected to each other. Here, in the circuit shown in FIG.34A, the transistor 2200 can be formed using the transistor 60 a or thetransistor 60 b in FIGS. 13A to 13D, and the transistor 2100 can beformed using the transistor 90 a or the transistor 90 b in FIGS. 15A to15D.

In the semiconductor device shown in FIG. 34A, a p-channel transistor isformed utilizing a semiconductor substrate, and an n-channel transistoris formed above that; therefore, the area occupied by the element can bereduced. That is, the integration degree of the semiconductor device canbe improved. In addition, the manufacturing process can be simplifiedcompared with the case where an n-channel transistor and a p-channeltransistor are formed utilizing the same semiconductor substrate;therefore, the productivity of the semiconductor device can beincreased. Moreover, the yield of the semiconductor device can beimproved. For the p-channel transistor, some complicated steps such asformation of lightly doped drain (LDD) regions, formation of a shallowtrench structure, or distortion design can be omitted in some cases.Therefore, the productivity and yield of the semiconductor device can beincreased in some cases, compared with a semiconductor device where ann-channel transistor is formed utilizing the semiconductor substrate.

<CMOS Analog Switch>

A circuit diagram in FIG. 34B shows a configuration in which sources ofthe transistors 2100 and 2200 are connected to each other and drains ofthe transistors 2100 and 2200 are connected to each other. With such aconfiguration, the transistors can function as a so-called CMOS analogswitch. Here, in the circuit shown in FIG. 34B, the transistor 2200 canbe formed using the transistor 60 a or the transistor 60 b in FIGS. 13Ato 13D, and the transistor 2100 can be formed using the transistor 90 aor the transistor 90 b in FIGS. 15A to 15D.

<Memory Device 1>

An example of a semiconductor device (memory device) which includes thetransistor of one embodiment of the present invention, which can retainstored data even when not powered, and which has an unlimited number ofwrite cycles is shown in FIGS. 35A and 35B.

The semiconductor device illustrated in FIG. 35A includes a transistor3200 using a first semiconductor, a transistor 3300 using a secondsemiconductor, and a capacitor 3400. Note that a transistor similar tothe above-described transistor 2100 can be used as the transistor 3300.Here, the transistor 3200 is formed using the element layer 50, thetransistor 3300 is formed using the element layer 30, and the capacitor3400 is formed using the element layer 40, whereby the circuit shown inFIG. 35A can be configured using the semiconductor device illustrated inFIG. 16 or the like.

Note that the transistor 3300 is preferably a transistor with a lowoff-state current. For example, a transistor using an oxidesemiconductor can be used as the transistor 3300. Since the off-statecurrent of the transistor 3300 is low, stored data can be retained for along period at a predetermined node of the semiconductor device. Inother words, power consumption of the semiconductor device can bereduced because refresh operation becomes unnecessary or the frequencyof refresh operation can be extremely low.

In FIG. 35A, a first wiring 3001 is electrically connected to a sourceof the transistor 3200. A second wiring 3002 is electrically connectedto a drain of the transistor 3200. A third wiring 3003 is electricallyconnected to one of the source and the drain of the transistor 3300. Afourth wiring 3004 is electrically connected to the gate of thetransistor 3300. The gate of the transistor 3200 and the other of thesource and the drain of the transistor 3300 are electrically connectedto the one electrode of the capacitor 3400. A fifth wiring 3005 iselectrically connected to the other electrode of the capacitor 3400.

The semiconductor device in FIG. 35A has a feature that the potential ofthe gate of the transistor 3200 can be retained, and thus enableswriting, retaining, and reading of data as follows.

Writing and retaining of data are described. First, the potential of thefourth wiring 3004 is set to a potential at which the transistor 3300 ison, so that the transistor 3300 is turned on. Accordingly, the potentialof the third wiring 3003 is supplied to a node FG where the gate of thetransistor 3200 and the one electrode of the capacitor 3400 areelectrically connected to each other. That is, a predetermined electriccharge is supplied to the gate of the transistor 3200 (writing). Here,one of two kinds of electric charge providing different potential levels(hereinafter referred to as a low-level electric charge and a high-levelelectric charge) is supplied. After that, the potential of the fourthwiring 3004 is set to a potential at which the transistor 3300 is off,so that the transistor 3300 is turned off. Thus, the electric charge isheld at the node FG (retaining).

Since the off-state current of the transistor 3300 is low, the electriccharge of the node FG is retained for a long time.

Next, reading of data is described. An appropriate potential (a readingpotential) is supplied to the fifth wiring 3005 while a predeterminedpotential (a constant potential) is supplied to the first wiring 3001,whereby the potential of the second wiring 3002 varies depending on theamount of electric charge retained in the node FG. This is because inthe case of using an n-channel transistor as the transistor 3200, anapparent threshold voltage V_(th) _(_) _(H) at the time when thehigh-level electric charge is given to the gate of the transistor 3200is lower than an apparent threshold voltage V_(th) _(_) _(L) at the timewhen the low-level electric charge is given to the gate of thetransistor 3200. Here, an apparent threshold voltage refers to thepotential of the fifth wiring 3005 which is needed to make thetransistor 3200 be in “on state.” Thus, the potential of the fifthwiring 3005 is set to a potential V₀ which is between V_(th) _(_) _(H)and V_(th) _(_) _(L), whereby electric charge supplied to the node FGcan be determined. For example, in the case where the high-levelelectric charge is supplied to the node FG in writing and the potentialof the fifth wiring 3005 is V₀ (>V_(th) _(_) _(H)), the transistor 3200is brought into “on state.” In the case where the low-level electriccharge is supplied to the node FG in writing, even when the potential ofthe fifth wiring 3005 is V₀ (<V_(th) _(_) _(L)), the transistor 3200still remains in “off state.” Thus, the data retained in the node FG canbe read by determining the potential of the second wiring 3002.

Note that in the case where memory cells are arrayed, it is necessarythat data of a desired memory cell be read in read operation. Aconfiguration in which only data of a desired memory cell can be read bysupplying a potential at which the transistor 3200 is brought into an“off state” regardless of the charge supplied to the node FG, that is, apotential lower than V_(th) _(_) _(H) to the fifth wiring 3005 of memorycells from which data is not read may be employed, for example.Alternatively, a configuration in which only data of a desired memorycell can be read by supplying a potential at which the transistor 3200is brought into an “on state” regardless of the charge supplied to thenode FG, that is, a potential higher than V_(th) _(_) _(L) to the fifthwiring 3005 of memory cells from which data is not read may be employed.

Although an example in which two kinds of electric charge are retainedin the node FG, the semiconductor device of the present invention is notlimited to this example. For example, a structure in which three or morekinds of electric charge can be retained in the node FG of thesemiconductor device may be employed. With such a structure, thesemiconductor device can be a multi-level semiconductor device withincreased storage capacity.

<Memory Device 2>

The semiconductor device in FIG. 35B is different from the semiconductordevice in FIG. 35A in that the transistor 3200 is not provided. Also inthis case, data can be written and retained in a manner similar to thatof the semiconductor device in FIG. 35A. Here, in the circuit shown inFIG. 35B, the transistor 3300 can be formed using the transistor 60 a orthe transistor 60 b illustrated in FIGS. 13A to 13D, and the capacitor3400 can be formed using the capacitor 80 a and the like illustrated inFIGS. 14A to 14C. In addition, a sense amplifier or the like can beprovided below the semiconductor device shown in FIG. 35B, in which casethe transistor 90 a or the transistor 90 b illustrated in FIGS. 15A to15D can be used in the sense amplifier.

Reading of data in the semiconductor device in FIG. 35B is described.When the transistor 3300 is brought into on state, the third wiring 3003which is in a floating state and the capacitor 3400 are brought intoconduction, and the electric charge is redistributed between the thirdwiring 3003 and the capacitor 3400. As a result, the potential of thethird wiring 3003 is changed. The amount of change in the potential ofthe third wiring 3003 varies depending on the potential of the oneelectrode of the capacitor 3400 (or the electric charge accumulated inthe capacitor 3400).

For example, the potential of the third wiring 3003 after the chargeredistribution is (C_(B)×V_(B0)+C×V)/(C_(B)+C), where V is the potentialof the one electrode of the capacitor 3400, C is the capacitance of thecapacitor 3400, C_(B) is the capacitance component of the third wiring3003, and V_(B0) is the potential of the third wiring 3003 before thecharge redistribution. Thus, it can be found that, assuming that thememory cell is in either of two states in which the potential of the oneelectrode of the capacitor 3400 is V₁ and V₀ (V₁>V₀), the potential ofthe third wiring 3003 in the case of retaining the potential V₁(=(C_(B)×V_(B0)+C×V₁)/(C_(B)+C)) is higher than the potential of thethird wiring 3003 in the case of retaining the potential V₀(=(C_(B)×V_(B0)+C×V₀)/(C_(B)+C)).

Then, by comparing the potential of the third wiring 3003 with apredetermined potential, data can be read.

In this case, a transistor including the first semiconductor may be usedfor a driver circuit for driving a memory cell, and a transistorincluding the second semiconductor may be stacked over the drivercircuit as the transistor 3300.

When including a transistor using an oxide semiconductor and having alow off-state current, the semiconductor device described above canretain stored data for a long time. In other words, power consumption ofthe semiconductor device can be reduced because refresh operationbecomes unnecessary or the frequency of refresh operation can beextremely low. Moreover, stored data can be retained for a long timeeven when power is not supplied (note that a potential is preferablyfixed).

In the semiconductor device, high voltage is not needed for writing dataand deterioration of elements is unlikely to occur. Unlike in aconventional nonvolatile memory, for example, it is not necessary toinject and extract electrons into and from a floating gate; thus, aproblem such as deterioration of an insulator is not caused. That is,the semiconductor device of one embodiment of the present invention doesnot have a limit on the number of times data can be rewritten, which isa problem of a conventional nonvolatile memory, and the reliabilitythereof is drastically improved. Furthermore, data is written dependingon the on/off state of the transistor, whereby high-speed operation canbe achieved.

<Memory Device 3>

A modification example of the semiconductor device (memory device)illustrated in FIG. 35A is described with reference to a circuit diagramin FIG. 36.

The semiconductor device illustrated in FIG. 36 includes transistors4100, 4200, 4300, and 4400 and capacitors 4500 and 4600. Here, atransistor similar to the above-described transistor 3200 can be used asthe transistor 4100, and transistors similar to the above-describedtransistor 3300 can be used as the transistors 4200 to 4400. Althoughnot illustrated in FIG. 36, a plurality of semiconductor devices in FIG.36 are provided in a matrix. The semiconductor devices in FIG. 36 cancontrol writing and reading of a data voltage in accordance with asignal or a potential supplied to a wiring 4001, a wiring 4003, andwirings 4005 to 4009. Here, in the circuit shown in FIG. 36, thetransistor 4100 can be formed using the transistor 90 a or thetransistor 90 b illustrated in FIGS. 15A to 15D; the transistor 4200,the transistor 4300, and the transistor 4400 can each be formed usingthe transistor 60 a or the transistor 60 b illustrated in FIGS. 13A to13D; and the capacitor 4500 and the capacitor 4600 can each be formedusing the capacitor 80 a illustrated in FIGS. 14A to 14C.

One of a source and a drain of the transistor 4100 is connected to thewiring 4003. The other of the source and the drain of the transistor4100 is connected to the wiring 4001. Although the transistor 4100 is ap-channel transistor in FIG. 36, the transistor 4100 may be an n-channeltransistor.

The semiconductor device in FIG. 36 includes two data retentionportions. For example, a first data retention portion retains anelectric charge between one of a source and a drain of the transistor4400, one electrode of the capacitor 4600, and one of a source and adrain of the transistor 4200 which are connected to a node FG1. A seconddata retention portion retains an electric charge between a gate of thetransistor 4100, the other of the source and the drain of the transistor4200, one of a source and a drain of the transistor 4300, and oneelectrode of the capacitor 4500 which are connected to a node FG2.

The other of the source and the drain of the transistor 4300 isconnected to the wiring 4003. The other of the source and the drain ofthe transistor 4400 is connected to the wiring 4001. A gate of thetransistor 4400 is connected to the wiring 4005. A gate of thetransistor 4200 is connected to the wiring 4006. A gate of thetransistor 4300 is connected to the wiring 4007. The other electrode ofthe capacitor 4600 is connected to the wiring 4008. The other electrodeof the capacitor 4500 is connected to the wiring 4009.

The transistors 4200, 4300, and 4400 each function as a switch forcontrol of writing a data voltage and retaining an electric charge. Notethat, as each of the transistors 4200, 4300, and 4400, it is preferableto use a transistor having a low current that flows between a source anda drain in an off state (low off-state current). As an example of thetransistor with a low off-state current, a transistor including an oxidesemiconductor in its channel formation region (an OS transistor) ispreferably used. An OS transistor has a low off-state current and can bemanufactured to overlap with a transistor including silicon, forexample. Although the transistors 4200, 4300, and 4400 are n-channeltransistors in FIG. 36, the transistors 4200, 4300, and 4400 may bep-channel transistors.

The transistors 4200 and 4300 are preferably provided in a layerdifferent from the layer where the transistor 4400 is provided even whenthe transistors 4200, 4300, and 4400 are transistors including oxidesemiconductors. In other words, the semiconductor device in FIG. 36preferably includes, as illustrated in FIG. 36, a first layer 4021 wherethe transistor 4100 is provided, a second layer 4022 where thetransistors 4200 and 4300 are provided, and a third layer 4023 where thetransistor 4400 is provided. By stacking layers where transistors areprovided, the circuit area can be reduced, so that the size of thesemiconductor device can be reduced.

Next, operation of writing data to the semiconductor device illustratedin FIG. 36 is described.

First, operation of writing data voltage to the data retention portionconnected to the node FG1 (hereinafter referred to as writingoperation 1) is described. In the following description, data voltagewritten to the data retention portion connected to the node FG1 isV_(D1), and the threshold voltage of the transistor 4100 is V_(th).

In the writing operation 1, the potential of the wiring 4003 is set atV_(D1), and after the potential of the wiring 4001 is set at a groundpotential, the wiring 4001 is brought into an electrically floatingstate. The wirings 4005 and 4006 are set at a high level. The wirings4007 to 4009 are set at a low level. Then, the potential of the node FG2in the electrically floating state is increased, so that a current flowsthrough the transistor 4100. The current flows through the transistor4100, so that the potential of the wiring 4001 is increased. Thetransistors 4400 and 4200 are turned on. Thus, as the potential of thewiring 4001 is increased, the potentials of the nodes FG1 and FG2 areincreased. When the potential of the node FG2 is increased and a voltage(V_(gs)) between a gate and a source of the transistor 4100 reaches thethreshold voltage V_(th) of the transistor 4100, the current flowingthrough the transistor 4100 is decreased.

Accordingly, the potentials of the wiring 4001 and the nodes FG1 and FG2stop increasing, so that the potentials of the nodes FG1 and FG2 arefixed at “V_(D1)-V_(th)” in which V_(D1) is decreased by V_(th).

When a current flows through the transistor 4100, V_(D1) supplied to thewiring 4003 is supplied to the wiring 4001, so that the potentials ofthe nodes FG1 and FG2 are increased. When the potential of the node FG2becomes “V_(D1)-V_(th)” with the increase in the potentials, V_(gs) ofthe transistor 4100 becomes V_(th), so that the current flow is stopped.

Next, operation of writing data voltage to the data retention portionconnected to the node FG2 (hereinafter referred to as writing operation2) is described. In the following description, data voltage written tothe data retention portion connected to the node FG2 is V_(D2).

In the writing operation 2, the potential of the wiring 4001 is set atV_(D2), and after the potential of the wiring 4003 is set at a groundpotential, the wiring 4003 is brought into an electrically floatingstate. The wiring 4007 is set at the high level. The wirings 4005, 4006,4008, and 4009 are set at the low level. The transistor 4300 is turnedon, so that the wiring 4003 is set at the low level. Thus, the potentialof the node FG2 is decreased to the low level, so that the current flowsthrough the transistor 4100. By the current flow, the potential of thewiring 4003 is increased. The transistor 4300 is turned on. Thus, as thepotential of the wiring 4003 is increased, the potential of the node FG2is increased. When the potential of the node FG2 is increased and V_(gs)of the transistor 4100 becomes V_(th) of the transistor 4100, thecurrent flowing through the transistor 4100 is decreased. Accordingly,an increase in the potentials of the wiring 4003 and the node FG2 isstopped, so that the potential of the node FG2 is fixed at“V_(D2)-V_(th)” in which V_(D2) is decreased by V_(th).

In other words, when a current flows through the transistor 4100, V_(D2)supplied to the wiring 4001 is supplied to the wiring 4003, so that thepotential of the node FG2 is increased. When the potential of the nodeFG2 becomes “V_(D2)-V_(th)” with the increase in the potential, V_(gs)of the transistor 4100 becomes V_(th), so that the current flow isstopped. At this time, the transistors 4200 and 4400 are off and thepotential of the node FG1 remains at “V_(D1)-V_(th)” written in thewriting operation 1.

In the semiconductor device in FIG. 36, after data voltages are writtento the plurality of data retention portions, the wiring 4009 is set atthe high level, so that the potentials of the nodes FG1 and FG2 areincreased. Then, the transistors are turned off to stop the movement ofelectric charge; thus, the written data voltages are retained.

By the above-described writing operation of the data voltages to thenodes FG1 and FG2, the data voltages can be retained in the plurality ofdata retention portions. Although examples where “V_(D1)-V_(th)” and“V_(D2)-V_(th)” are used as the written potentials are described, theyare data voltages corresponding to multi-level data. Therefore, in thecase where the data retention portions each retain 4-bit data, 16-level“V_(D1)-V_(th)” and 16-level “V_(D2)-V_(th)” can be obtained.

Next, operation of reading data from the semiconductor deviceillustrated in FIG. 36 is described.

First, operation of reading data voltage to the data retention portionconnected to the node FG2 (hereinafter referred to as readingoperation 1) is described.

In the reading operation 1, after precharge is performed, the wiring4003 in an electrically floating state is discharged. The wirings 4005to 4008 are set low. When the wiring 4009 is set low, the potential ofthe node FG2 which is electrically floating is set at “V_(D2)-V_(th)”.The potential of the node FG2 is decreased, so that a current flowsthrough the transistor 4100. By the current flow, the potential of thewiring 4003 which is electrically floating is decreased. As thepotential of the wiring 4003 is decreased, V_(gs) of the transistor 4100is decreased. When V_(gs) of the transistor 4100 becomes V_(th) of thetransistor 4100, the current flowing through the transistor 4100 isdecreased. In other words, the potential of the wiring 4003 becomes“V_(D2)” which is larger than the potential of the node FG2,“V_(D2)-V_(th)”, by V_(th). The potential of the wiring 4003 correspondsto the data voltage of the data retention portion connected to the nodeFG2. The data voltage of the read analog value is subjected to A/Dconversion, so that data of the data retention portion connected to thenode FG2 is obtained.

In other words, the wiring 4003 after precharge is brought into afloating state and the potential of the wiring 4009 is changed from highto low, whereby a current flows through the transistor 4100. When thecurrent flows, the potential of the wiring 4003 which is in a floatingstate is decreased to be “V_(D2)”. In the transistor 4100, V_(gs)between “V_(D2)-V_(th)” of the node FG2 and “V_(D2)” of the wiring 4003becomes V_(th), so that the current stops. Then, “V_(D2)” written in thewriting operation 2 is read to the wiring 4003.

After data in the data retention portion connected to the node FG2 isobtained, the transistor 4300 is turned on to discharge “V_(D2)-V_(th)”of the node FG2.

Then, the electric charges retained in the node FG1 are distributedbetween the node FG1 and the node FG2, data voltage in the dataretention portion connected to the node FG1 is transferred to the dataretention portion connected to the node FG2. The wirings 4001 and 4003are set low. The wiring 4006 is set high. The wiring 4005 and thewirings 4007 to 4009 are set low. When the transistor 4200 is turned on,the electric charges in the node FG1 are distributed between the nodeFG1 and the node FG2.

Here, the potential after the electric charge distribution is decreasedfrom the written potential, “V_(D1)-V_(th)”. Thus, the capacitance ofthe capacitor 4600 is preferably larger than the capacitance of thecapacitor 4500. Alternatively, the potential written to the node FG1,“V_(D1)-V_(th)”, is preferably larger than the potential correspondingto the same data, “V_(D2)-V_(th)”. By changing the ratio of thecapacitances and setting the written potential larger in advance asdescribed above, a decrease in potential after the electric chargedistribution can be suppressed. The change in potential due to theelectric charge distribution is described later.

Next, operation of reading data voltage to the data retention portionconnected to the node FG1 (hereinafter referred to as reading operation2) is described.

In the reading operation 2, the wiring 4003 which is brought into anelectrically floating state after precharge is discharged. The wirings4005 to 4008 are set low. The wiring 4009 is set high at the time ofprecharge and then, set low. When the wiring 4009 is set low, thepotential of the node FG2 which is electrically floating is set at“V_(D1)-V_(th)”. The potential of the node FG2 is decreased, so that acurrent flows through the transistor 4100. The current flows, so thatthe potential of the wiring 4003 which is electrically floating isdecreased. As the potential of the wiring 4003 is decreased, V_(gs) ofthe transistor 4100 is decreased. When V_(gs) of the transistor 4100becomes V_(th) of the transistor 4100, the current flowing through thetransistor 4100 is decreased. In other words, the potential of thewiring 4003 becomes “V_(D1)” which is larger than the potential of thenode FG2, “V_(D1)-V_(th)”, by V_(th). The potential of the wiring 4003corresponds to the data voltage of the data retention portion connectedto the node FG1. The data voltage of the read analog value is subjectedto A/D conversion, so that data of the data retention portion connectedto the node FG1 is obtained. The above is the reading operation of thedata voltage of the data retention portion connected to the node FG1.

In other words, the wiring 4003 after precharge is brought into afloating state and the potential of the wiring 4009 is changed from highto low, whereby a current flows through the transistor 4100. When thecurrent flows, the potential of the wiring 4003 which is in a floatingstate is decreased to be “V_(D1)”. In the transistor 4100, V_(gs)between “V_(D1)-V_(th)” of the node FG2 and “V_(D1)” of the wiring 4003becomes V_(th), so that the current stops. Then, “V_(D1)” written in thewriting operation 1 is read to the wiring 4003.

In the above-described reading operation of data voltages from the nodesFG1 and FG2, the data voltages can be read from the plurality of dataretention portions. For example, 4-bit (16-level) data is retained ineach of the node FG1 and the node FG2, whereby 8-bit (256-level) datacan be retained in total. Although the first to third layers 4021 to4023 are provided in the structure illustrated in FIG. 36, the storagecapacity can be increased by adding layers without increasing the areaof the semiconductor device.

The read potential can be read as a voltage larger than the written datavoltage by V_(th). Therefore, V_(th) of “V_(D1)-V_(th)” and V_(th) of“V_(D2)-V_(th)” written in the writing operation can be canceled out inreading. As a result, the storage capacity per memory cell can beimproved and read data can be close to accurate data; thus, the datareliability becomes excellent.

<Memory Device 4>

The semiconductor device in FIG. 35C is different from the semiconductordevice in FIG. 35A in that the transistor 3500 and a sixth wiring 3006are included. Also in this case, data can be written and retained in amanner similar to that of the semiconductor device in FIG. 35A. Atransistor similar to the transistor 3200 described above can be used asthe transistor 3500. Here, the transistor 3200 and the transistor 3500are each formed using the element layer 50, the transistor 3300 isformed using the element layer 30, and the capacitor 3400 is formedusing the element layer 40, whereby the circuit shown in FIG. 35A can beconfigured using the semiconductor device illustrated in FIG. 10A or10B. Here, in the circuit shown in FIG. 35C, the transistor 3200 and thetransistor 3500 can each be formed using the transistor 90 a or thetransistor 90 b illustrated in FIGS. 15A to 15D, the transistor 3300 canbe formed using the transistor 60 a or the transistor 60 b illustratedin FIGS. 13A to 13D, and the capacitor 3400 can be formed using thecapacitor 80 a illustrated in FIGS. 14A to 14C.

The sixth wiring 3006 is electrically connected to a gate of thetransistor 3500, one of a source and a drain of the transistor 3500 iselectrically connected to the drain of the transistor 3200, and theother of the source and the drain of the transistor 3500 is electricallyconnected to the third wiring 3003.

The structure described in this embodiment can be used in appropriatecombination with the structure described in any of the otherembodiments.

Embodiment 4

In this embodiment, circuit configuration examples to which the OStransistors described in the above embodiment can be used are describedwith reference to FIGS. 37A to 37C, FIGS. 38A to 38C, FIGS. 39A and 39B,and FIGS. 40A and 40B.

FIG. 37A is a circuit diagram of an inverter. An inverter 800 outputs asignal whose logic is inverted from the logic of a signal supplied to aninput terminal IN to an output terminal OUT. The inverter 800 includes aplurality of OS transistors. A signal S_(BG) can switch electricalcharacteristics of the OS transistors.

FIG. 37B illustrates an example of the inverter 800. The inverter 800includes an OS transistor 810 and an OS transistor 820. The inverter 800can be formed using only n-channel transistors; thus, the inverter 800can be formed at lower cost than an inverter formed using acomplementary metal oxide semiconductor (i.e., a CMOS inverter).

Note that the inverter 800 including the OS transistors can be providedover a CMOS circuit including Si transistors. Since the inverter 800 canbe provided so as to overlap with the CMOS circuit, no additional areais required for the inverter 800, and thus, an increase in the circuitarea can be suppressed.

Each of the OS transistors 810 and 820 includes a first gate functioningas a front gate, a second gate functioning as a back gate, a firstterminal functioning as one of a source and a drain, and a secondterminal functioning as the other of the source and the drain.

The first gate of the OS transistor 810 is connected to its secondterminal.

The second gate of the OS transistor 810 is connected to a wiring thatsupplies the signal S_(BG). The first terminal of the OS transistor 810is connected to a wiring that supplies a voltage VDD. The secondterminal of the OS transistor 810 is connected to the output terminalOUT.

The first gate of the OS transistor 820 is connected to the inputterminal IN. The second gate of the OS transistor 820 is connected tothe input terminal IN. The first terminal of the OS transistor 820 isconnected to the output terminal OUT. The second terminal of the OStransistor 820 is connected to a wiring that supplies a voltage VSS.

FIG. 37C is a timing chart illustrating the operation of the inverter800. The timing chart in FIG. 37C illustrates changes of a signalwaveform of the input terminal IN, a signal waveform of the outputterminal OUT, a signal waveform of the signal S_(BG), and the thresholdvoltage of the OS transistor 810 (FET 810).

The signal S_(BG) can be supplied to the second gate of the OStransistor 810 to control the threshold voltage of the OS transistor810.

The signal S_(BG) includes a voltage V_(BG) _(_) _(A) for shifting thethreshold voltage in the negative direction and a voltage V_(BG) _(_)_(B) for shifting the threshold voltage in the positive direction. Thethreshold voltage of the OS transistor 810 can be shifted in thenegative direction to be a threshold voltage V_(TH) _(_) _(A) when thevoltage V_(BG) _(_) _(A) is applied to the second gate. The thresholdvoltage of the OS transistor 810 can be shifted in the positivedirection to be a threshold voltage V_(TH) _(_) _(B) when the voltageV_(BG) _(_) _(B) is applied to the second gate.

To visualize the above description, FIG. 38A shows a V_(g)-I_(d) curve,which is one of indicators of the transistor's electricalcharacteristics.

When a high voltage such as the voltage V_(BG) _(_) _(A) is applied tothe second gate, the electrical characteristics of the OS transistor 810can be shifted to match a curve shown by a dashed line 840 in FIG. 38A.When a low voltage such as the voltage V_(BG) _(_) _(B) is applied tothe second gate, the electrical characteristics of the OS transistor 810can be shifted to match a curve shown by a solid line 841 in FIG. 38A.As shown in FIG. 38A, switching the signal S_(BG) between the voltageV_(BG) _(_) _(A) and the voltage V_(BG) _(_) _(B) enables the thresholdvoltage of the OS transistor 810 to be shifted in the negative directionor the positive direction.

The shift of the threshold voltage in the positive direction toward thethreshold voltage V_(TH) _(_) _(B) can make a current less likely toflow in the OS transistor 810. FIG. 38B visualizes the state. Asillustrated in FIG. 38B, a current I_(B) that flows in the OS transistor810 can be extremely low. Thus, when a signal supplied to the inputterminal IN is at a high level and the OS transistor 820 is on (ON), thevoltage of the output terminal OUT can drop sharply.

Since a state in which a current is less likely to flow in the OStransistor 810 as illustrated in FIG. 38B can be obtained, a signalwaveform 831 of the output terminal in the timing chart in FIG. 37C canbe made steep. Shoot-through current between the wiring that suppliesthe voltage VDD and the wiring that supplies the voltage VSS can be low,leading to low-power operation.

The shift of the threshold voltage in the negative direction toward thethreshold voltage V_(TH) _(_) _(A) can make a current flow easily in theOS transistor 810. FIG. 38C visualizes the state. As illustrated in FIG.38C, a current I_(A) flowing at this time can be higher than at leastthe current I_(B). Thus, when a signal supplied to the input terminal INis at a low level and the OS transistor 820 is off (OFF), the voltage ofthe output terminal OUT can be increased sharply.

Since a state in which current is likely to flow in the OS transistor810 as illustrated in FIG. 38C can be obtained, a signal waveform 832 ofthe output terminal in the timing chart in FIG. 37C can be made steep.

Note that the threshold voltage of the OS transistor 810 is preferablycontrolled by the signal S_(BG) before the state of the OS transistor820 is switched, i.e., before time T1 or time T2. For example, as inFIG. 37C, it is preferable that the threshold voltage of the OStransistor 810 be switched from the threshold voltage V_(TH) _(_) _(A)to the threshold voltage V_(TH) _(_) _(B) before time T1 at which thelevel of the signal supplied to the input terminal IN is switched to ahigh level. Moreover, as in FIG. 37C, it is preferable that thethreshold voltage of the OS transistor 810 be switched from thethreshold voltage V_(TH) _(_) _(B) to the threshold voltage V_(TH) _(_)_(A) before time T2 at which the level of the signal supplied to theinput terminal IN is switched to a low level.

Although the timing chart in FIG. 37C illustrates the structure in whichthe level of the signal S_(BG) is switched in accordance with the signalsupplied to the input terminal IN, a different structure may be employedin which voltage for controlling the threshold voltage is held by thesecond gate of the OS transistor 810 in a floating state, for example.FIG. 39A illustrates an example of such a circuit configuration.

The circuit configuration in FIG. 39A is the same as that in FIG. 37B,except that an OS transistor 850 is added. A first terminal of the OStransistor 850 is connected to the second gate of the OS transistor 810.A second terminal of the OS transistor 850 is connected to a wiring thatsupplies the voltage V_(BG) _(_) _(B) (or the voltage V_(BG) _(_) _(A)).A first gate of the OS transistor 850 is connected to a wiring thatsupplies a signal S_(F). A second gate of the OS transistor 850 isconnected to the wiring that supplies the voltage V_(BG) _(_) _(B) (orthe voltage V_(BG) _(_) _(A)).

The operation with the circuit configuration in FIG. 39A is describedwith reference to a timing chart in FIG. 39B.

The voltage for controlling the threshold voltage of the OS transistor810 is supplied to the second gate of the OS transistor 810 before timeT3 at which the level of the signal supplied to the input terminal IN isswitched to a high level. The signal S_(F) is set to a high level andthe OS transistor 850 is turned on, so that the voltage V_(BG) _(_) _(B)for controlling the threshold voltage is supplied to a node N_(BG).

The OS transistor 850 is turned off after the voltage of the node N_(BG)becomes V_(BG) _(_) _(B). Since the off-state current of the OStransistor 850 is extremely low, the voltage V_(BG) _(_) _(B) held bythe node N_(BG) can be retained while the OS transistor 850 remains offand the node N_(BG) is in a state that is very close to a floatingstate. Therefore, the number of times the voltage V_(BG) _(_) _(B) issupplied to the second gate of the OS transistor 850 can be reduced andaccordingly, the power consumption for rewriting the voltage V_(BG) _(_)_(B) can be reduced.

Although FIG. 37B and FIG. 39A each illustrate the case where thevoltage is supplied to the second gate of the OS transistor 810 bycontrol from the outside, a different structure may be employed in whichvoltage for controlling the threshold voltage is generated on the basisof the signal supplied to the input terminal IN and supplied to thesecond gate of the OS transistor 810, for example. FIG. 40A illustratesan example of such a circuit configuration.

The circuit configuration in FIG. 40A is the same as that in FIG. 37B,except that a CMOS inverter 860 is provided between the input terminalIN and the second gate of the OS transistor 810. An input terminal ofthe CMOS inverter 860 is connected to the input terminal IN. An outputterminal of the CMOS inverter 860 is connected to the second gate of theOS transistor 810.

The operation with the circuit configuration in FIG. 40A is describedwith reference to a timing chart in FIG. 40B. The timing chart in FIG.40B illustrates changes of a signal waveform of the input terminal IN, asignal waveform of the output terminal OUT, an output waveform IN_B ofthe CMOS inverter 860, and a threshold voltage of the OS transistor 810(FET 810).

The output waveform IN_B which corresponds to a signal whose logic isinverted from the logic of the signal supplied to the input terminal INcan be used as a signal that controls the threshold voltage of the OStransistor 810. Thus, the threshold voltage of the OS transistor 810 canbe controlled as described with reference to FIGS. 38A to 38C. Forexample, the signal supplied to the input terminal IN is at a high leveland the OS transistor 820 is turned on at time T4 in FIG. 40B. At thistime, the output waveform IN_B is at a low level. Accordingly, a currentcan be made less likely to flow in the OS transistor 810; thus, thevoltage of the output terminal OUT can be sharply decreased.

Moreover, the signal supplied to the input terminal IN is at a low leveland the OS transistor 820 is turned off at time T5 in FIG. 40B. At thistime, the output waveform IN_B is at a high level. Accordingly, acurrent can easily flow in the OS transistor 810; thus, a rise in thevoltage of the output terminal OUT can be made steep.

As described above, in the configuration of the inverter including theOS transistor in this embodiment, the voltage of the back gate isswitched in accordance with the logic of the signal supplied to theinput terminal IN. In such a configuration, the threshold voltage of theOS transistor can be controlled. The control of the threshold voltage ofthe OS transistor by the signal supplied to the input terminal IN cancause a steep change in the voltage of the output terminal OUT.Moreover, shoot-through current between the wirings that supply powersupply voltages can be reduced. Thus, power consumption can be reduced.

Embodiment 5

In this embodiment, examples of a semiconductor device which includes aplurality of circuits including OS transistors described in the aboveembodiment are described with reference to FIGS. 41A to 41E, FIGS. 42Aand 42B, FIGS. 43A and 43B, FIGS. 44A to 44C, FIGS. 45A and 45B, FIGS.46A to 46C, and FIGS. 47A and 47B.

FIG. 41A is a block diagram of a semiconductor device 900. Thesemiconductor device 900 includes a power supply circuit 901, a circuit902, a voltage generation circuit 903, a circuit 904, a voltagegeneration circuit 905, and a circuit 906.

The power supply circuit 901 is a circuit that generates a voltageV_(ORG) used as a reference. The voltage V_(ORG) is not necessarily onevoltage and can be a plurality of voltages. The voltage V_(ORG) can begenerated on the basis of a voltage V₀ supplied from the outside of thesemiconductor device 900. The semiconductor device 900 can generate thevoltage V_(ORG) on the basis of one power supply voltage supplied fromthe outside. Thus, the semiconductor device 900 can operate without thesupply of a plurality of power supply voltages from the outside.

The circuits 902, 904, and 906 operate with different power supplyvoltages. For example, the power supply voltage of the circuit 902 is avoltage applied on the basis of the voltage V_(ORG) and the voltageV_(SS) (V_(ORG)>V_(SS)). For example, the power supply voltage of thecircuit 904 is a voltage applied on the basis of a voltage V_(POG) andthe voltage V_(SS) (V_(POG)>V_(ORG)). For example, the power supplyvoltages of the circuit 906 are voltages applied on the basis of thevoltage V_(ORG), the voltage V_(SS), and a voltage V_(NEG)(V_(ORG)>V_(SS)>V_(NEG)). When the voltage V_(SS) is equal to a groundpotential (GND), the kinds of voltages generated in the power supplycircuit 901 can be reduced.

The voltage generation circuit 903 is a circuit that generates thevoltage V_(POG). The voltage generation circuit 903 can generate thevoltage V_(POG) on the basis of the voltage V_(ORG) supplied from thepower supply circuit 901. Thus, the semiconductor device 900 includingthe circuit 904 can operate on the basis of one power supply voltagesupplied from the outside.

The voltage generation circuit 905 is a circuit that generates thevoltage V_(NEG). The voltage generation circuit 905 can generate thevoltage V_(NEG) on the basis of the voltage V_(ORG) supplied from thepower supply circuit 901. Thus, the semiconductor device 900 includingthe circuit 906 can operate on the basis of one power supply voltagesupplied from the outside.

FIG. 41B illustrates an example of the circuit 904 that operates withthe voltage V_(POG) and FIG. 41C illustrates an example of a waveform ofa signal for operating the circuit 904.

FIG. 41B illustrates a transistor 911. A signal supplied to a gate ofthe transistor 911 is generated on the basis of, for example, thevoltage V_(POG) and the voltage V_(SS). The signal is generated on thebasis of the voltage V_(POG) at the time when the transistor 911 isturned on and on the basis of the voltage V_(SS) at the time when thetransistor 911 is turned off. As shown in FIG. 41C, the voltage V_(POG)is higher than the voltage V_(ORG). Therefore, an operation for bringinga source (S) and a drain (D) of the transistor 911 into a conductionstate can be performed more surely. As a result, the frequency ofmalfunction of the circuit 904 can be reduced.

FIG. 41D illustrates an example of the circuit 906 that operates withthe voltage V_(NEG) and FIG. 41E illustrates an example of a waveform ofa signal for operating the circuit 906.

FIG. 41D illustrates a transistor 912 having a back gate. A signalsupplied to a gate of the transistor 912 is generated on the basis of,for example, the voltage V_(ORG) and the voltage V_(SS). The signal hasgenerated on the basis of the voltage V_(ORG) at the time when thetransistor 912 is turned on and on the basis of the voltage V_(SS) atthe time when the transistor 912 is turned off. A signal supplied to theback gate of the transistor 912 is generated on the basis of the voltageV_(NEG). As shown in FIG. 41E, the voltage V_(NEG) is lower than thevoltage V_(SS) (GND). Therefore, the threshold voltage of the transistor912 can be controlled so as to be shifted in the positive direction.Thus, the transistor 912 can be surely turned off and a current flowingbetween a source (S) and a drain (D) can be reduced. As a result, thefrequency of malfunction of the circuit 906 can be reduced and powerconsumption thereof can be reduced.

The voltage V_(NEG) may be directly supplied to the back gate of thetransistor 912. Alternatively, a signal supplied to the gate of thetransistor 912 may be generated on the basis of the voltage V_(ORG) andthe voltage V_(NEG) and the generated signal may be supplied to the backgate of the transistor 912.

FIGS. 42A and 42B illustrate a modification example of FIGS. 41D and41E.

In a circuit diagram illustrated in FIG. 42A, a transistor 922 whoseconduction state can be controlled by a control circuit 921 is providedbetween the voltage generation circuit 905 and the circuit 906. Thetransistor 922 is an n-channel OS transistor. The control signal S_(BG)output from the control circuit 921 is a signal for controlling theconduction state of the transistor 922. Transistors 912A and 912Bincluded in the circuit 906 are the same OS transistors as thetransistor 922.

A timing chart in FIG. 42B shows changes in a potential of the controlsignal S_(BG) and a potential of the node N_(BG). The potential of thenode N_(BG) indicates the states of potentials of back gates of thetransistors 912A and 912B. When the control signal S_(BG) is at a highlevel, the transistor 922 is turned on and the voltage of the nodeN_(BG) becomes the voltage V_(NEG). Then, when the control signal S_(BG)is at a low level, the node N_(BG) is brought into an electricallyfloating state. Since the transistor 922 is an OS transistor, itsoff-state current is small. Accordingly, even when the node N_(BG) is inan electrically floating state, the voltage V_(NEG) which has beensupplied can be held.

FIG. 43A illustrates an example of a circuit configuration applicable tothe above-described voltage generation circuit 903. The voltagegeneration circuit 903 illustrated in FIG. 43A is a five-stage chargepump including diodes D1 to D5, capacitors C1 to C5, and an inverterINV. A clock signal CLK is supplied to the capacitors C1 to C5 directlyor through the inverter INV. When a power supply voltage of the inverterINV is a voltage applied on the basis of the voltage V_(ORG) and thevoltage V_(SS), the voltage V_(POG), which has been increased to apositive voltage having a positively quintupled value of the voltageV_(ORG) by application of the clock signal CLK, can be obtained. Notethat a forward voltage of the diodes D1 to D5 is 0 V. A desired voltageV_(POG) can be obtained when the number of stages of the charge pump ischanged.

FIG. 43B illustrates an example of a circuit configuration applicable tothe above-described voltage generation circuit 905. The voltagegeneration circuit 905 illustrated in FIG. 43B is a four-stage chargepump including the diodes D1 to D5, the capacitors C1 to C5, and theinverter INV. The clock signal CLK is supplied to the capacitors C1 toC4 directly or through the inverter INV. When a power supply voltage ofthe inverter INV is a voltage applied on the basis of the voltageV_(ORG) and the voltage V_(SS), the voltage V_(NEG), which has beenreduced from GND (i.e., the voltage V_(SS)) to a negative voltage havinga negatively quadrupled value of the voltage V_(ORG) by application ofthe clock signal CLK, can be obtained. Note that a forward voltage ofthe diodes D1 to D5 is 0 V. A desired voltage V_(NEG) can be obtainedwhen the number of stages of the charge pump is changed.

The circuit configuration of the voltage generation circuit 903 is notlimited to the configuration of the circuit diagram illustrated in FIG.43A. Modification examples of the voltage generation circuit 903 areshown in FIGS. 44A to 44C and FIGS. 45A and 45B.

The voltage generation circuit 903A illustrated in FIG. 44A includestransistors M1 to M10, capacitors C11 to C14, and an inverter INV1. Theclock signal CLK is supplied to gates of the transistors M1 to M10directly or through the inverter INV1. By application of the clocksignal CLK, the voltage V_(POG), which has been increased to a positivevoltage having a positively quadrupled value of the voltage V_(ORG), canbe obtained. A desired voltage V_(POG) can be obtained when the numberof stages is changed. In the voltage generation circuit 903A in FIG.44A, off-state current of each of the transistors M1 to M10 can be lowwhen the transistors M1 to M10 are OS transistors, and leakage of chargeheld in the capacitors C11 to C14 can be suppressed. Accordingly,raising from the voltage V_(ORG) to the voltage V_(POG) can beefficiently performed.

The voltage generation circuit 903B illustrated in FIG. 44B includestransistors M11 to M14, capacitors C15 and C16, and an inverter INV2.The clock signal CLK is supplied to gates of the transistors M11 to M14directly or through the inverter INV2. By application of the clocksignal CLK, the voltage V_(POG), which has been increased to a positivevoltage having a positively doubled value of the voltage V_(ORG), can beobtained. In the voltage generation circuit 903B in FIG. 44B, off-statecurrent of each of the transistors M11 to M14 can be low when thetransistors M11 to M14 are OS transistors, and leakage of charge held inthe capacitors C15 and C16 can be suppressed. Accordingly, raising fromthe voltage V_(ORG) to the voltage V_(POG) can be efficiently performed.

The voltage generation circuit 903C in FIG. 44C includes an inductorI11, a transistor M15, a diode D6, and a capacitor C17. The conductionstate of the transistor M15 is controlled by a control signal EN. Owingto the control signal EN, the voltage V_(POG) which is obtained byincreasing the voltage V_(ORG) can be obtained. Since the voltagegeneration circuit 903C in FIG. 44C increases the voltage using theinductor I11, the voltage can be increased efficiently.

A voltage generation circuit 903D in FIG. 45A has a configuration inwhich the diodes D1 to D5 of the voltage generation circuit 903 in FIG.43A are replaced with diode-connected transistors M16 to M20. In thevoltage generation circuit 903D in FIG. 45A, when the OS transistors areused as the transistors M16 to M20, the off-state current can bereduced, so that leakage of charge held in the capacitors C1 to C5 canbe inhibited. Thus, efficient voltage increase from the voltage V_(ORG)to the voltage V_(POG) is possible.

A voltage generation circuit 903E in FIG. 45B has a configuration inwhich the transistors M16 to M20 of the voltage generation circuit 903Din FIG. 45A are replaced with transistor M21 to M25 having back gates.In the voltage generation circuit 903E in FIG. 45B, the back gates canbe supplied with voltages that are the same as those of the gates, sothat the current flowing through the transistors can be increased. Thus,efficient voltage increase from the voltage V_(ORG) to the voltageV_(POG) is possible.

Note that the modification examples of the voltage generation circuit903 can also be applied to the voltage generation circuit 905 in FIG.43B. The configurations of a circuit diagram in this case areillustrated in FIGS. 46A to 46C and FIGS. 47A and 47B. In a voltagegeneration circuit 905A illustrated in FIG. 46A, the voltage V_(NEG)which has been reduced from the voltage V_(SS) to a negative voltagehaving a negatively tripled value of the voltage V_(ORG) by applicationof the clock signal CLK, can be obtained. In a voltage generationcircuit 905B illustrated in FIG. 46B, the voltage V_(NEG) which has beenreduced from the voltage V_(SS) to a negative voltage having anegatively doubled value of the voltage V_(ORG) by application of theclock signal CLK, can be obtained.

The voltage generation circuits 905A to 905E illustrated in FIGS. 46A to46C and FIGS. 47A and 47B have configurations formed by changing thevoltages applied to the wirings or the arrangement of the elements ofthe voltage generation circuits 903A to 903E illustrated in FIGS. 44A to44C and FIGS. 45A and 45B. In the voltage generation circuits 905A to905E illustrated in FIGS. 46A to 46C and FIGS. 47A and 47B, an efficientvoltage decrease from the voltage V_(SS) to the voltage V_(NEG) ispossible.

As described above, in any of the structures of this embodiment, avoltage required for circuits included in a semiconductor device can beinternally generated. Thus, in the semiconductor device, the kinds ofpower supply voltages supplied from the outside can be reduced.

Embodiment 6

In this embodiment, an example of CPU including semiconductor devicessuch as the transistor of one embodiment of the present invention andthe above-described memory device is described. A configuration of CPUdescribed below can be formed using the semiconductor illustrated inFIG. 16 or the like.

<Configuration of CPU>

FIG. 48 is a block diagram illustrating a configuration example of a CPUincluding any of the above-described transistors as a component. Thefollowing configuration of the CPU can be obtained using thesemiconductor device illustrated in FIG. 16 or the like.

The CPU illustrated in FIG. 48 includes, over a substrate 1190, anarithmetic logic unit (ALU) 1191, an ALU controller 1192, an instructiondecoder 1193, an interrupt controller 1194, a timing controller 1195, aregister 1196, a register controller 1197, a bus interface 1198, arewritable ROM 1199, and a ROM interface 1189. A semiconductorsubstrate, an SOI substrate, a glass substrate, or the like is used asthe substrate 1190. The rewritable ROM 1199 and the ROM interface 1189may be provided over a separate chip. Needless to say, the CPU in FIG.48 is just an example in which the configuration has been simplified,and an actual CPU may have a variety of configurations depending on theapplication. For example, the CPU may have the following configuration:a structure including the CPU illustrated in FIG. 48 or an arithmeticcircuit is considered as one core; a plurality of such cores areincluded; and the cores operate in parallel. The number of bits that theCPU can process in an internal arithmetic circuit or in a data bus canbe 8, 16, 32, or 64, for example.

An instruction that is input to the CPU through the bus interface 1198is input to the instruction decoder 1193 and decoded therein, and then,input to the ALU controller 1192, the interrupt controller 1194, theregister controller 1197, and the timing controller 1195.

The ALU controller 1192, the interrupt controller 1194, the registercontroller 1197, and the timing controller 1195 conduct various controlsin accordance with the decoded instruction. Specifically, the ALUcontroller 1192 generates signals for controlling the operation of theALU 1191. While the CPU is executing a program, the interrupt controller1194 judges an interrupt request from an external input/output device ora peripheral circuit on the basis of its priority or a mask state, andprocesses the request. The register controller 1197 generates an addressof the register 1196, and reads/writes data from/to the register 1196 inaccordance with the state of the CPU.

The timing controller 1195 generates signals for controlling operationtimings of the ALU 1191, the ALU controller 1192, the instructiondecoder 1193, the interrupt controller 1194, and the register controller1197. For example, the timing controller 1195 includes an internal clockgenerator for generating an internal clock signal CLK2 based on areference clock signal CLK1, and supplies the internal clock signal CLK2to the above circuits.

In the CPU illustrated in FIG. 48, a memory cell is provided in theregister 1196. For the memory cell of the register 1196, any of theabove-described transistors, the above-described memory device, or thelike can be used.

In the CPU illustrated in FIG. 48, the register controller 1197 selectsoperation of retaining data in the register 1196 in accordance with aninstruction from the ALU 1191. That is, the register controller 1197selects whether data is retained by a flip-flop or by a capacitor in thememory cell included in the register 1196. When data retention by theflip-flop is selected, a power supply voltage is supplied to the memorycell in the register 1196. When data retention by the capacitor isselected, the data is rewritten in the capacitor, and supply of a powersupply voltage to the memory cell in the register 1196 can be stopped.

FIG. 49 is an example of a circuit diagram of a memory element 1200 thatcan be used as the register 1196. The memory element 1200 includes acircuit 1201 in which stored data is volatile when power supply isstopped, a circuit 1202 in which stored data is nonvolatile even whenpower supply is stopped, a switch 1203, a switch 1204, a logic element1206, a capacitor 1207, and a circuit 1220 having a selecting function.The circuit 1202 includes a capacitor 1208, a transistor 1209, and atransistor 1210. Note that the memory element 1200 may further includeanother element such as a diode, a resistor, or an inductor, as needed.

Here, the above-described memory device can be used as the circuit 1202.When supply of a power supply voltage to the memory element 1200 isstopped, GND (0 V) or a potential at which the transistor 1209 in thecircuit 1202 is turned off continues to be input to a gate of thetransistor 1209. For example, the gate of the transistor 1209 isgrounded through a load such as a resistor.

Shown here is an example in which the switch 1203 is a transistor 1213having one conductivity type (e.g., an n-channel transistor) and theswitch 1204 is a transistor 1214 having a conductivity type opposite tothe one conductivity type (e.g., a p-channel transistor). A firstterminal of the switch 1203 corresponds to one of a source and a drainof the transistor 1213, a second terminal of the switch 1203 correspondsto the other of the source and the drain of the transistor 1213, andconduction or non-conduction between the first terminal and the secondterminal of the switch 1203 (i.e., the on/off state of the transistor1213) is selected by a control signal RD input to a gate of thetransistor 1213. A first terminal of the switch 1204 corresponds to oneof a source and a drain of the transistor 1214, a second terminal of theswitch 1204 corresponds to the other of the source and the drain of thetransistor 1214, and conduction or non-conduction between the firstterminal and the second terminal of the switch 1204 (i.e., the on/offstate of the transistor 1214) is selected by the control signal RD inputto a gate of the transistor 1214.

One of a source and a drain of the transistor 1209 is electricallyconnected to one of a pair of electrodes of the capacitor 1208 and agate of the transistor 1210. Here, the connection portion is referred toas a node M2. One of a source and a drain of the transistor 1210 iselectrically connected to a line which can supply a low power supplypotential (e.g., a GND line), and the other thereof is electricallyconnected to the first terminal of the switch 1203 (the one of thesource and the drain of the transistor 1213). The second terminal of theswitch 1203 (the other of the source and the drain of the transistor1213) is electrically connected to the first terminal of the switch 1204(the one of the source and the drain of the transistor 1214). The secondterminal of the switch 1204 (the other of the source and the drain ofthe transistor 1214) is electrically connected to a line which cansupply a power supply potential VDD. The second terminal of the switch1203 (the other of the source and the drain of the transistor 1213), thefirst terminal of the switch 1204 (the one of the source and the drainof the transistor 1214), an input terminal of the logic element 1206,and one of a pair of electrodes of the capacitor 1207 are electricallyconnected to each other. Here, the connection portion is referred to asa node ml. The other of the pair of electrodes of the capacitor 1207 canbe supplied with a constant potential. For example, the other of thepair of electrodes of the capacitor 1207 can be supplied with a lowpower supply potential (e.g., GND) or a high power supply potential(e.g., VDD). The other of the pair of electrodes of the capacitor 1207is electrically connected to the line which can supply a low powersupply potential (e.g., a GND line). The other of the pair of electrodesof the capacitor 1208 can be supplied with a constant potential. Forexample, the other of the pair of electrodes of the capacitor 1208 canbe supplied with the low power supply potential (e.g., GND) or the highpower supply potential (e.g., VDD). The other of the pair of electrodesof the capacitor 1208 is electrically connected to the line which cansupply a low power supply potential (e.g., a GND line).

The capacitor 1207 and the capacitor 1208 are not necessarily providedas long as the parasitic capacitance of the transistor, the wiring, orthe like is actively utilized.

A control signal WE is input to the gate of the transistor 1209. As foreach of the switch 1203 and the switch 1204, a conduction state or anon-conduction state between the first terminal and the second terminalis selected by the control signal RD which is different from the controlsignal WE. When the first terminal and the second terminal of one of theswitches are in the conduction state, the first terminal and the secondterminal of the other of the switches are in the non-conduction state.

A signal corresponding to data retained in the circuit 1201 is input tothe other of the source and the drain of the transistor 1209. FIG. 49illustrates an example in which a signal output from the circuit 1201 isinput to the other of the source and the drain of the transistor 1209.The logic value of a signal output from the second terminal of theswitch 1203 (the other of the source and the drain of the transistor1213) is inverted by the logic element 1206, and the inverted signal isinput to the circuit 1201 through the circuit 1220.

In the example of FIG. 49, a signal output from the second terminal ofthe switch 1203 (the other of the source and the drain of the transistor1213) is input to the circuit 1201 through the logic element 1206 andthe circuit 1220; however, one embodiment of the present invention isnot limited thereto. The signal output from the second terminal of theswitch 1203 (the other of the source and the drain of the transistor1213) may be input to the circuit 1201 without its logic value beinginverted. For example, in the case where the circuit 1201 includes anode in which a signal obtained by inversion of the logic value of asignal input from the input terminal is retained, the signal output fromthe second terminal of the switch 1203 (the other of the source and thedrain of the transistor 1213) can be input to the node.

In FIG. 49, the transistors included in the memory element 1200 exceptthe transistor 1209 can each be a transistor in which a channel isformed in a film formed using a semiconductor other than an oxidesemiconductor or in the substrate 1190. For example, the transistor canbe a transistor whose channel is formed in a silicon film or a siliconsubstrate. Alternatively, all the transistors in the memory element 1200may be a transistor in which a channel is formed in an oxidesemiconductor. Further alternatively, in the memory element 1200, atransistor in which a channel is formed in an oxide semiconductor may beincluded besides the transistor 1209, and a transistor in which achannel is formed in a layer formed using a semiconductor other than anoxide semiconductor or in the substrate 1190 can be used for the rest ofthe transistors.

As the circuit 1201 in FIG. 49, for example, a flip-flop circuit can beused. As the logic element 1206, for example, an inverter or a clockedinverter can be used.

In a period during which the memory element 1200 is not supplied withthe power supply voltage, the semiconductor device of one embodiment ofthe present invention can retain data stored in the circuit 1201 by thecapacitor 1208 which is provided in the circuit 1202.

The off-state current of a transistor in which a channel is formed in anoxide semiconductor is extremely low. For example, the off-state currentof a transistor in which a channel is formed in an oxide semiconductoris significantly lower than that of a transistor in which a channel isformed in silicon having crystallinity. Thus, when the transistor isused as the transistor 1209, a signal held in the capacitor 1208 isretained for a long time also in a period during which the power supplyvoltage is not supplied to the memory element 1200. The memory element1200 can accordingly retain the stored content (data) also in a periodduring which the supply of the power supply voltage is stopped.

Since the above-described memory element performs pre-charge operationwith the switch 1203 and the switch 1204, the time required for thecircuit 1201 to retain original data again after the supply of the powersupply voltage is restarted can be shortened.

In the circuit 1202, a signal retained by the capacitor 1208 is input tothe gate of the transistor 1210. Therefore, after supply of the powersupply voltage to the memory element 1200 is restarted, the state of thetransistor 1210 (the on state or the off state) is determined inaccordance with the signal retained by the capacitor 1208, and a signalcan be read from the circuit 1202. Consequently, an original signal canbe accurately read even when a potential corresponding to the signalretained by the capacitor 1208 varies to some degree.

By applying the above-described memory element 1200 to a memory devicesuch as a register or a cache memory included in a processor, data inthe memory device can be prevented from being lost owing to the stop ofthe supply of the power supply voltage. Furthermore, shortly after thesupply of the power supply voltage is restarted, the memory device canbe returned to the same state as that before the power supply isstopped. Therefore, the power supply can be stopped even for a shorttime in the processor or one or a plurality of logic circuits includedin the processor, resulting in lower power consumption.

Although the memory element 1200 is used in a CPU, the memory element1200 can also be used in an LSI such as a digital signal processor(DSP), a programmable logic device (PLD), or a custom LSI, and a radiofrequency (RF) device.

The structure described in this embodiment can be used in appropriatecombination with any of the structures described in the otherembodiments.

Embodiment 7

In this embodiment, an example of an imaging device including thetransistor or the like of one embodiment of the present invention isdescribed.

<Imaging Device>

An imaging device of one embodiment of the present invention isdescribed below.

FIG. 50A is a plan view illustrating an example of an imaging device 200of one embodiment of the present invention. The imaging device 200includes a pixel portion 210 and peripheral circuits for driving thepixel portion 210 (a peripheral circuit 260, a peripheral circuit 270, aperipheral circuit 280, and a peripheral circuit 290). The pixel portion210 includes a plurality of pixels 211 arranged in a matrix with p rowsand q columns (p and q are each an integer of 2 or more). The peripheralcircuit 260, the peripheral circuit 270, the peripheral circuit 280, andthe peripheral circuit 290 are each connected to the plurality of pixels211, and a signal for driving the plurality of pixels 211 is supplied.In this specification and the like, in some cases, a “peripheralcircuit” or a “driver circuit” indicate all of the peripheral circuits260, 270, 280, and 290. For example, the peripheral circuit 260 can beregarded as part of the peripheral circuit.

The imaging device 200 preferably includes a light source 291. The lightsource 291 can emit detection light P1.

The peripheral circuit includes at least one of a logic circuit, aswitch, a buffer, an amplifier circuit, and a converter circuit. Theperipheral circuit may be formed over a substrate where the pixelportion 210 is formed. A semiconductor device such as an IC chip may beused as part or the whole of the peripheral circuit. Note that as theperipheral circuit, one or more of the peripheral circuits 260, 270,280, and 290 may be omitted.

As illustrated in FIG. 50B, the pixels 211 may be provided to beinclined in the pixel portion 210 included in the imaging device 200.When the pixels 211 are obliquely arranged, the distance between pixels(pitch) can be shortened in the row direction and the column direction.Accordingly, the quality of an image taken with the imaging device 200can be improved.

<Configuration Example 1 of Pixel>

The pixel 211 included in the imaging device 200 is formed with aplurality of subpixels 212, and each subpixel 212 is combined with afilter (color filter) which transmits light in a specific wavelengthband, whereby data for achieving color image display can be obtained.

FIG. 51A is a top view showing an example of the pixel 211 with which acolor image is obtained. The pixel 211 illustrated in FIG. 51A includesa subpixel 212 provided with a color filter that transmits light in ared (R) wavelength band (also referred to as a subpixel 212R), asubpixel 212 provided with a color filter that transmits light in agreen (G) wavelength band (also referred to as a subpixel 212G), and asubpixel 212 provided with a color filter that transmits light in a blue(B) wavelength band (also referred to as a subpixel 212B). The subpixel212 can function as a photosensor.

The subpixel 212 (the subpixel 212R, the subpixel 212G, and the subpixel212B) is electrically connected to a wiring 231, a wiring 247, a wiring248, a wiring 249, and a wiring 250. In addition, the subpixel 212R, thesubpixel 212G, and the subpixel 212B are connected to respective wirings253 which are independently provided. In this specification and thelike, for example, the wiring 248 and the wiring 249 that are connectedto the pixel 211 in the n-th row are referred to as a wiring 248[n] anda wiring 249[n]. For example, the wiring 253 connected to the pixel 211in the m-th column is referred to as a wiring 253[m]. Note that in FIG.51A, the wirings 253 connected to the subpixel 212R, the subpixel 212G,and the subpixel 212B in the pixel 211 in the m-th column are referredto as a wiring 253[m]R, a wiring 253[m]G, and a wiring 253[m]B. Thesubpixels 212 are electrically connected to the peripheral circuitthrough the above wirings.

The imaging device 200 has a structure in which the subpixel 212 iselectrically connected to the subpixel 212 in an adjacent pixel 211which is provided with a color filter transmitting light in the samewavelength band as the subpixel 212, via a switch. FIG. 51B shows aconnection example of the subpixels 212: the subpixel 212 in the pixel211 arranged in the n-th (n is an integer greater than or equal to 1 andless than or equal to p) row and the m-th (m is an integer greater thanor equal to 1 and less than or equal to q) column and the subpixel 212in the adjacent pixel 211 arranged in an (n+1)-th row and the m-thcolumn. In FIG. 51B, the subpixel 212R arranged in the n-th row and them-th column and the subpixel 212R arranged in the (n+1)-th row and them-th column are connected to each other via a switch 201. The subpixel212G arranged in the n-th row and the m-th column and the subpixel 212Garranged in the (n+1)-th row and the m-th column are connected to eachother via a switch 202. The subpixel 212B arranged in the n-th row andthe m-th column and the subpixel 212B arranged in the (n+1)-th row andthe m-th column are connected to each other via a switch 203.

The color filter used in the subpixel 212 is not limited to red (R),green (G), and blue (B) color filters, and color filters that transmitlight of cyan (C), yellow (Y), and magenta (M) may be used. By provisionof the subpixels 212 that sense light in three different wavelengthbands in one pixel 211, a full-color image can be obtained.

The pixel 211 including the subpixel 212 provided with a color filtertransmitting yellow (Y) light may be provided, in addition to thesubpixels 212 provided with the color filters transmitting red (R),green (G), and blue (B) light. The pixel 211 including the subpixel 212provided with a color filter transmitting blue (B) light may beprovided, in addition to the subpixels 212 provided with the colorfilters transmitting cyan (C), yellow (Y), and magenta (M) light. Whenthe subpixels 212 sensing light in four different wavelength bands areprovided in one pixel 211, the reproducibility of colors of an obtainedimage can be increased.

For example, in FIG. 51A, in regard to the subpixel 212 sensing light ina red wavelength band, the subpixel 212 sensing light in a greenwavelength band, and the subpixel 212 sensing light in a blue wavelengthband, the pixel number ratio (or the light receiving area ratio) thereofis not necessarily 1:1:1. For example, the Bayer arrangement in whichthe pixel number ratio (the light receiving area ratio) is set atred:green:blue=1:2:1 may be employed. Alternatively, the pixel numberratio (the light receiving area ratio) of red and green to blue may be1:6:1.

Although the number of subpixels 212 provided in the pixel 211 may beone, two or more subpixels are preferably provided. For example, whentwo or more subpixels 212 sensing light in the same wavelength band areprovided, the redundancy is increased, and the reliability of theimaging device 200 can be increased.

When an infrared (IR) filter that transmits infrared light and absorbsor reflects visible light is used as the filter, the imaging device 200that senses infrared light can be achieved.

Furthermore, when a neutral density (ND) filter (dark filter) is used,output saturation which occurs when a large amount of light enters aphotoelectric conversion element (light-receiving element) can beprevented. With a combination of ND filters with different dimmingcapabilities, the dynamic range of the imaging device can be increased.

Besides the above-described filter, the pixel 211 may be provided with alens. An arrangement example of the pixel 211, a filter 254, and a lens255 is described with cross-sectional views in FIGS. 52A and 52B. Withthe lens 255, the photoelectric conversion element can receive incidentlight efficiently. Specifically, as illustrated in FIG. 52A, light 256enters a photoelectric conversion element 220 through the lens 255, thefilter 254 (a filter 254R, a filter 254G, and a filter 254B), a pixelcircuit 230, and the like which are provided in the pixel 211.

As indicated by a region surrounded with dashed dotted lines, however,part of the light 256 indicated by arrows might be blocked by somewirings 257. Thus, a preferable structure is such that the lens 255 andthe filter 254 are provided on the photoelectric conversion element 220side as illustrated in FIG. 52B, whereby the photoelectric conversionelement 220 can efficiently receive the light 256. When the light 256enters the photoelectric conversion element 220 from the photoelectricconversion element 220 side, the imaging device 200 with highsensitivity can be provided.

As the photoelectric conversion element 220 illustrated in FIGS. 52A and52B, a photoelectric conversion element in which a p-n junction or ap-i-n junction is formed may be used.

The photoelectric conversion element 220 may be formed using a substancethat has a function of absorbing a radiation and generating electriccharges. Examples of the substance that has a function of absorbing aradiation and generating electric charges include selenium, lead iodide,mercury iodide, gallium arsenide, cadmium telluride, and cadmium zincalloy.

For example, when selenium is used for the photoelectric conversionelement 220, the photoelectric conversion element 220 can have a lightabsorption coefficient in a wide wavelength band, such as visible light,ultraviolet light, infrared light, X-rays, and gamma rays.

One pixel 211 included in the imaging device 200 may include thesubpixel 212 with a first filter in addition to the subpixel 212illustrated in FIGS. 51A and 51B.

<Configuration Example 2 of Pixel>

An example of a pixel including a transistor including silicon and atransistor including an oxide semiconductor is described below. Atransistor similar to any of the transistors described in the aboveembodiment can be used as each of the transistors.

FIG. 53 is a cross-sectional view of an element included in an imagingdevice. The imaging device illustrated in FIG. 53 includes a transistor351 including silicon over a silicon substrate 300, transistors 352 and353 which include an oxide semiconductor and are stacked over thetransistor 351, and a photodiode 360 provided in the silicon substrate300. The transistors and the photodiode 360 are electrically connectedto various plugs 370 and wirings 371. In addition, an anode 361 of thephotodiode 360 is electrically connected to the plug 370 through alow-resistance region 363.

The imaging device includes a layer 310 including the transistor 351provided on the silicon substrate 300 and the photodiode 360 provided inthe silicon substrate 300, a layer 320 which is in contact with thelayer 310 and includes the wirings 371, a layer 330 which is in contactwith the layer 320 and includes the transistors 352 and 353, and a layer340 which is in contact with the layer 330 and includes a wiring 372 anda wiring 373.

In the example of the cross-sectional view in FIG. 53, a light-receivingsurface of the photodiode 360 is provided on the side opposite to asurface of the silicon substrate 300 where the transistor 351 is formed.With this structure, a light path can be secured without an influence ofthe transistors and the wirings. Thus, a pixel with a high apertureratio can be formed. Note that the light-receiving surface of thephotodiode 360 can be the same as the surface where the transistor 351is formed.

In the case where a pixel is formed with use of only transistorsincluding an oxide semiconductor, the layer 310 may include thetransistor including an oxide semiconductor. Alternatively, the layer310 may be omitted, and the pixel may include only transistors includingan oxide semiconductor.

Note that the silicon substrate 300 may be an SOI substrate.Furthermore, the silicon substrate 300 can be replaced with a substratemade of germanium, silicon germanium, silicon carbide, gallium arsenide,aluminum gallium arsenide, indium phosphide, gallium nitride, or anorganic semiconductor.

Here, an insulator 380 is provided between the layer 310 including thetransistor 351 and the photodiode 360 and the layer 330 including thetransistors 352 and 353. However, there is no limitation on the positionof the insulator 380. An insulator 379 is provided under the insulator380, and an insulator 381 is provided over the insulator 380. Here, theinsulator 379 corresponds to the insulator 110 illustrated in FIG. 16,the insulator 380 corresponds to the insulator 61 illustrated in FIG.16, and the insulator 381 corresponds to the insulator 67 illustrated inFIG. 16.

Conductors 390 a to 390 e are provided in openings formed in theinsulators 379 and 380. The conductors 390 a, 390 b, and 390 ecorrespond to the conductor 121 a, the conductor 122 a, and the likeillustrated in FIG. 16 and function as plugs and wirings. The conductor390 c corresponds to the conductor 62 a and the conductor 62 billustrated in FIG. 16 and functions as a back gate of the transistor353. The conductor 390 d corresponds to the conductor 62 a and theconductor 62 b illustrated in FIG. 16 and functions as a back gate ofthe transistor 352.

Hydrogen in an insulator provided in the vicinity of a channel formationregion of the transistor 351 terminates dangling bonds of silicon;accordingly, the reliability of the transistor 351 can be improved. Incontrast, hydrogen in the insulator provided in the vicinity of thetransistor 352, the transistor 353, and the like becomes one of factorsgenerating a carrier in the oxide semiconductor. Thus, the hydrogen maycause a reduction of the reliability of the transistor 352, thetransistor 353, and the like. For this reason, in the case where thetransistor including an oxide semiconductor is provided over thetransistor including a silicon-based semiconductor, it is preferablethat the insulator 380 having a function of blocking hydrogen beprovided between the transistors. When the hydrogen is confined inlayers below the insulator 380, the reliability of the transistor 351can be improved. In addition, the hydrogen can be prevented fromdiffusing from the layers below the insulator 380 to layers above theinsulator 380; thus, the reliability of the transistor 352, thetransistor 353, and the like can be increased. The conductors 390 a, 390b, and 390 e can prevent hydrogen from diffusing to the layers providedthereover through the via holes formed in the insulator 380, resultingin improvement in the reliability of the transistors 352 and 353 and thelike.

In the cross-sectional view in FIG. 53, the photodiode 360 in the layer310 and the transistor in the layer 330 can be formed so as to overlapwith each other. Thus, the degree of integration of pixels can beincreased. In other words, the resolution of the imaging device can beincreased.

Part or the whole of the imaging device may be bent. The bent imagingdevice enables the curvature of field and astigmatism to be reduced.Thus, the optical design of lens and the like, which is used incombination of the imaging device, can be facilitated. For example, thenumber of lenses used for aberration correction can be reduced;accordingly, a reduction in size or weight of electronic devices usingthe imaging device, and the like, can be achieved. In addition, thequality of a captured image can be improved.

The structure described in this embodiment can be used in appropriatecombination with the structure described in any of the otherembodiments.

Embodiment 8

In this embodiment, electronic devices including the transistor or thelike of one embodiment of the present invention are described.

<Electronic Device>

The semiconductor device of one embodiment of the present invention canbe used for display devices, personal computers, or image reproducingdevices provided with recording media (typically, devices whichreproduce the content of recording media such as digital versatile discs(DVDs) and have displays for displaying the reproduced images). Otherexamples of electronic devices that can be equipped with thesemiconductor device of one embodiment of the present invention aremobile phones, game machines including portable game consoles, portabledata terminals, e-book readers, cameras such as video cameras anddigital still cameras, goggle-type displays (head mounted displays),navigation systems, audio reproducing devices (e.g., car audio systemsand digital audio players), copiers, facsimiles, printers, multifunctionprinters, automated teller machines (ATM), and vending machines. FIGS.54A to 54F illustrate specific examples of these electronic devices.

FIG. 54A illustrates a portable game console including a housing 1901, adisplay portion 1903, a microphone 1905, a speaker 1906, an operationkey 1907, and the like. Although the portable game console in FIG. 54Ahas the one display portion 1903, the number of display portionsincluded in the portable game console is not limited to this. Forexample, a plurality of display portions may be included. In addition, astylus for operating the display portion 1903 may be attached.

FIG. 54B illustrates a portable data terminal including a first housing1911, a second housing 1912, a first display portion 1913, a seconddisplay portion 1914, a joint 1915, an operation key 1916, and the like.The first display portion 1913 is provided in the first housing 1911,and the second display portion 1914 is provided in the second housing1912. The first housing 1911 and the second housing 1912 are connectedto each other with the joint 1915, and the angle between the firsthousing 1911 and the second housing 1912 can be changed with the joint1915. An image on the first display portion 1913 may be switched inaccordance with the angle at the joint 1915 between the first housing1911 and the second housing 1912. A display device with a position inputfunction may be used as at least one of the first display portion 1913and the second display portion 1914. Note that the position inputfunction can be added by providing a touch panel in a display device.Alternatively, the position input function can be added by providing aphotoelectric conversion element called a photosensor in a pixel portionof a display device.

FIG. 54C illustrates a notebook personal computer, which includes ahousing 1921, a display portion 1922, a keyboard 1923, a pointing device1924, and the like.

FIG. 54D illustrates an electric refrigerator-freezer, which includes ahousing 1931, a door for a refrigerator 1932, a door for a freezer 1933,and the like.

FIG. 54E illustrates a video camera, which includes a first housing1941, a second housing 1942, a display portion 1943, operation keys1944, a lens 1945, a joint 1946, and the like. The operation keys 1944and the lens 1945 are provided for the first housing 1941, and thedisplay portion 1943 is provided for the second housing 1942. The firsthousing 1941 and the second housing 1942 are connected to each otherwith the joint 1946, and the angle between the first housing 1941 andthe second housing 1942 can be changed with the joint 1946. Imagesdisplayed on the display portion 1943 may be switched in accordance withthe angle at the joint 1946 between the first housing 1941 and thesecond housing 1942.

FIG. 54F illustrates a car including a car body 1951, wheels 1952, adashboard 1953, lights 1954, and the like.

In Embodiment 8, embodiments of the present invention have beendescribed. However, embodiments of the present invention are not limitedto the above-described embodiments. That is, various embodiments of theinvention are described in this embodiment and the like, and oneembodiment of the present invention is not limited to a particularembodiment. Although an example in which a channel formation region, asource region, a drain region, or the like of a transistor includes anoxide semiconductor is described as one embodiment of the presentinvention, one embodiment of the present invention is not limited tothis example. Depending on circumstances or conditions, varioustransistors or a channel formation region, a source region, a drainregion, or the like of a transistor in one embodiment of the presentinvention may include various semiconductors. Depending on circumstancesor conditions, various transistors or a channel formation region, asource region, a drain region, or the like of a transistor in oneembodiment of the present invention may include, for example, at leastone of silicon, germanium, silicon germanium, silicon carbide, galliumarsenide, aluminum gallium arsenide, indium phosphide, gallium nitride,and an organic semiconductor. Alternatively, for example, depending oncircumstances or conditions, various transistors or a channel formationregion, a source region, a drain region, or the like of a transistor inone embodiment of the present invention does not necessarily include anoxide semiconductor. The structure described in this embodiment can beused in appropriate combination with the structure described in any ofthe other embodiments.

Example 1

This example describes observation results of a wiring and a plug formedby the method described in the above embodiment. The observations wereperformed using a scanning electron microscope (SEM) and a scanningtransmission electron microscope (STEM).

Samples of this example were each formed in the following manner: atungsten film, a silicon oxide film, an aluminum oxide film, and asilicon oxynitride film were stacked in this order; the stacked filmswere etched to form an opening; and a tantalum film, a titanium film,and a tungsten film were stacked in this order to be embedded in theopening.

Processes for fabricating Sample 1A and Sample 1B used in this examplewere described below. Note that the process for Sample 1A differs fromthat for Sample 1B in a way to form the tantalum nitride film. Asputtering method and a collimated sputtering method were used to formthe tantalum nitride films in Sample 1A and Sample 1B, respectively.

First, a silicon substrate was prepared and subjected to heat treatmentin an HCl atmosphere so as to form a thermally oxidized silicon filmwith a thickness of 100 nm.

Next, a tungsten film (hereinafter, denoted by W in the drawings) wasformed over the thermally oxidized silicon film by a sputtering methodso as to have a thickness of 50 nm.

After that, a silicon oxide film (hereinafter, denoted by SiO_(x) in thedrawings) was formed over the tungsten film by a PECVD method so as tohave a thickness of 200 nm. As for the flow rates of the depositiongases in the formation of the silicon oxide film, the flow rates of aTEOS gas and an oxygen gas were 15 sccm and 750 sccm, respectively.

Then, an aluminum film (hereinafter, denoted by AlO_(x) in the drawings)was formed over the silicon oxide film by a sputtering method so as tohave a thickness of 30 nm. In the formation of the aluminum oxide film,an aluminum oxide target was used, the flow rates of an argon gas and anoxygen gas were each 25 sccm, the power of an RF power source was 2.5kW, the pressure was 0.4 Pa, and the substrate temperature was 250° C.

Subsequently, a silicon oxynitride film (hereinafter, denoted by SiON inthe drawings) was formed over the aluminum oxide film by a PECVD methodso as to have a thickness of 100 nm. As for the flow rate of depositiongases in the formation of the silicon oxynitride film, the flow rates ofSiH₄ and N₂O gases were 5 sccm and 1000 sccm, respectively.

Next, a tungsten film serving as a hard mask material was formed overthe silicon oxynitride film by a sputtering method so as to have athickness of 30 nm.

After that, an organic coating film was applied to the tungsten filmserving as a hard mask material, and a resist material is appliedthereto. The resist material was subjected to lithography using anelectron beam to form a resist mask. The organic coating film and thetungsten film serving as a hard mask material were dry etched using theresist mask, whereby a hard mask (hereinafter, denoted by HM-W in thedrawing) was formed. The dry etching was performed using an ICP etchingapparatus under the conditions where the flow rates of Cl₂ and CF₄ were60 sccm and 40 sccm, respectively; a high-frequency power of 2000 W wasapplied to a coil-shaped electrode; a high-frequency power of 50 W wasapplied to an electrode on the substrate side: the pressure was 0.67 Pa;and the process time was 20 seconds. After the dry etching, the resistmask and the organic coating film were removed by ashing.

Then, an organic coating film was applied to the silicon oxynitride filmto cover the hard mask, and a resist material is applied thereto. Theresist material was subjected to lithography using an electron beam toform a resist mask (hereinafter, denoted by Resist in the drawings).This step corresponds to the step illustrated in FIGS. 1C and 1Ddescribed in the above embodiment.

FIG. 55A shows a cross-sectional SEM image (magnified by 150,000 times)at the step. Note that the cross-sectional SEM image was taken by SU8030produced by Hitachi High-Technologies Corporation. As shown FIG. 55A, anopening of the resist mask is also formed inside an opening of the hardmask in a manner similar to that in FIGS. 1C and 1D.

Next, the silicon oxynitride film was dry etched using the resist maskto form a hole-like opening in the silicon oxynitride film. This stepcorresponds to the step illustrated in FIGS. 2A and 2B described in theabove embodiment.

In the dry etching, a CCP etching apparatus was used, and first etchingconditions and second etching conditions were employed in this order.The first etching conditions were as follows: the flow rate of a CF₄ gaswas 100 sccm, a high-frequency power of 1000 W was applied to the upperelectrode, a high-frequency power of 100 W was applied to the lowerelectrode, the pressure was 6.5 Pa, and the process time was 15 seconds.Etching under the first etching conditions can remove the organiccoating film. The second etching conditions were as follow: the flowrates of a C₄F₆ gas, an O₂ gas, and an Ar gas were 22 sccm, 30 sccm, and800 sccm, respectively; a high-frequency power of 500 W was applied tothe upper electrode; a high-frequency power of 1150 W was applied to thelower electrode; the pressure was 3.3 Pa; and the process time was 25seconds. Etching under the second etching conditions can remove thesilicon oxynitride film.

FIG. 55B shows a cross-sectional SEM image (magnified by 150,000 times)at the step. Note that the cross-sectional SEM image was taken by SU8030produced by Hitachi High-Technologies Corporation. As shown FIG. 55B, anopening is also formed in the silicon oxynitride film in a mannersimilar to that in FIGS. 2A and 2B.

Next, the aluminum oxide film was dry etched using the resist mask toform a hole-like opening in the aluminum oxide film. This stepcorresponds to the step illustrated in FIGS. 2C and 2D described in theabove embodiment.

In the dry etching, a CCP etching apparatus was used, and third etchingconditions were employed. The third etching conditions were as follow:the flow rates of a CHF₃ gas and an Ar gas were 50 sccm and 275 sccm,respectively; a high-frequency power of 300 W was applied to the upperelectrode; a high-frequency power of 1200 W was applied to the lowerelectrode; the pressure was 2.6 Pa; and the process time was 30 seconds.Etching under the third etching conditions can remove the aluminum oxidefilm.

FIG. 56A shows a cross-sectional SEM image (magnified by 150,000 times)at the step. Note that the cross-sectional SEM image was taken by SU8030produced by Hitachi High-Technologies Corporation. As shown FIG. 56A, anopening is formed in the aluminum oxide film. In addition, the upperpart of the silicon oxide film is also etched, resulting in the stateshown in FIG. 5A.

Next, the resist mask was removed by ashing. This step corresponds tothe step illustrated in FIGS. 3A and 3B described in the aboveembodiment.

The ashing was performed using a CCP etching apparatus under theconditions where the flow rate of an oxygen gas was 200 sccm, ahigh-frequency power of 500 W was applied to the upper electrode, ahigh-frequency power of 100 W was applied to the lower electrode, thepressure was 2.0 Pa, and the process time was 20 seconds.

FIG. 56B shows a cross-sectional SEM image (magnified by 150,000 times)at the step. Note that the cross-sectional SEM image was taken by SU8030produced by Hitachi High-Technologies Corporation. As observed in FIG.56B, a by-product similar to that illustrated in FIGS. 5B and 5C wasformed to surround the edge of the upper part of the opening of thesilicon oxynitride film.

Next, the silicon oxynitride film, the aluminum oxide film, and thesilicon oxide film were dry etched using the hard mask to form anopening in these stacked films. This step corresponds to the stepillustrated in FIGS. 3C and 3D described in the above embodiment.

In the dry etching, a CCP etching apparatus was used, and fourth etchingconditions were employed. The fourth etching conditions were as follow:the flow rates of a C₄F₆ gas, an O₂ gas, and an Ar gas were 22 sccm, 30sccm, and 800 sccm, respectively; a high-frequency power of 500 W wasapplied to the upper electrode; a high-frequency power of 1150 W wasapplied to the lower electrode; the pressure was 3.3 Pa; and the processtime was 25 seconds.

Note that after the dry etching was performed under the fourth etchingconditions, plasma treatment was performed in an oxygen atmosphere toremove a residue generated by the etching. The plasma treatment wasperformed using a CCP etching apparatus under the conditions where theflow rate of an oxygen gas was 200 sccm, a high-frequency power of 500 Wwas applied to the upper electrode, a high-frequency power of 100 W wasapplied to the lower electrode, the pressure was 2.6 Pa, and the processtime was 10 seconds. Note that each of Sample 1A and Sample 1B wassuccessively processed without being exposed to the air during theperiod from the dry etching under the first etching conditions to theplasma treatment.

FIGS. 57A and 57B show a cross-sectional SEM image (magnified by 150,000times) and a bird's eye-view SEM image (magnified by 100,000) at thisstep, respectively. Note that the cross-sectional SEM images were takenby SU8030 produced by Hitachi High-Technologies Corporation. As shown inFIG. 57A, the inner wall of the opening also had a tapered shape in amanner similar to that of FIGS. 3C and 3D, the by-product observed inFIG. 56B was removed, and an upper part of the edge of the opening wasrounded.

The following description shows comparison between Sample 1C in whichthe stacked films were processed in the same fabrication process asSample 1A and Sample 1B, and Sample 1D which was different from Sample1C only in the fourth etching conditions. FIG. 58A shows across-sectional SEM image (magnified by 150,000 times) of Sample 1C, andFIG. 58B shows a cross-sectional SEM image (magnified by 150,000 times)of Sample 1D. Note that the cross-sectional SEM images were taken bySU8030 produced by Hitachi High-Technologies Corporation.

Dry etching for Sample 1D was performed using a CCP etching apparatusunder fifth etching conditions, instead of the fourth etchingconditions. The fifth etching conditions were as follow: the flow ratesof a C₄F₈ gas, a CF₄ gas, an O₂ gas, and an Ar gas were 12 sccm, 56sccm, 3 sccm, and 75 sccm, respectively; a high-frequency power of 800 Wwas applied to the upper electrode; a high-frequency power of 150 W wasapplied to the lower electrode; the pressure was 10.6 Pa; and theprocess time was 35 seconds.

Here, in Sample 1C shown in FIG. 58A, the inner wall of an openingfunctioning as a via hole had a tapered shape, and the angle of theinner wall with respect to the tungsten film was approximately 77°. Asshown in FIG. 58A, the by-product observed in FIG. 56B was removed, andan upper part of the edge of the opening was rounded.

In contrast, in Sample 1D shown in FIG. 58B, the inner wall of theopening functioning as a via hole was substantially perpendicular to thetungsten film, and the angle of the inner wall with respect to thetungsten film was approximately 88°. In addition, the by-productobserved in FIG. 56B remained in FIG. 58B.

Here, in the fourth etching conditions used for Sample 1C, the ratio ofthe etching rate of A10, to the etching rate of SiO_(x) was 4.3, whereasin the fifth etching conditions used for Sample 1D, the ratio of theetching rate of A10, to the etching rate of SiO_(x) was 8.3.

Accordingly, in order that the inner wall of the opening functioning asa via hole has a tapered shape, and that the by-product formed at theupper part of the edge of the opening is removed, it is presumablypreferable that the etching rate of SiO_(x) not be excessively largewith respect to the etching rate of AlO_(x). For example, the etchingrate of SiO_(x) may be less than or equal to eight times, preferablyless than or equal to six times, further preferably less than or equalto four times the etching rate of AlO_(x).

Next, a tantalum nitride film was formed in the opening formed in thestacked films. Here, the tantalum nitride film was deposited by asputtering method in Sample 1A and by a collimated sputtering method inSample 1B.

The formation of the tantalum nitride film in Sample 1A was performedusing a tantalum target under the conditions where the flow rates of anargon gas and a nitrogen gas were 50 sccm and 10 sccm, respectively; thepower of a DC power source was 1.0 kW; and the pressure was 0.6 Pa.

The formation of the tantalum nitride film in Sample 1B was performedunder the conditions where the flow rates of an argon gas and a nitrogengas were 40 sccm and 10 sccm, respectively; the power of a DC powersource was 2.0 kW; and the pressure was 0.7 Pa. A collimator waspositioned between the target and the substrate when the film formationwas performed for Sample 1B.

Next, a titanium nitride film was formed over the tantalum nitride filmby an ALD method to be positioned in the opening in the stacked films.For the formation of the titanium nitride film, the substratetemperature and pressure were set to 412° C. and 667 Pa, respectively;and a cycle of the following steps was repeated: a TiCl₄ gas wasintroduced for 0.05 seconds, purging was performed with N₂ for 0.2second, an NH₃ gas was introduced for 0.3 seconds, and purging wasperformed with N₂ for 0.3 seconds. Here, the TiCl₄ gas was introduced ata flow rate of 50 sccm, and the NH₃ gas was introduced at a flow rate of2700 sccm. In addition, an N₂ gas was introduced at a flow rate of 4500sccm from a gas pipe positioned close to a gas pipe for supplying theTiCl₄ gas, and an N₂ gas was introduced at a flow rate of 4000 sccm froma gas pipe positioned close to a gas pipe for supplying the NH₃ gas,during the deposition.

Next, a tungsten film was formed over the titanium nitride film by ametal CVD method so as to fill the opening formed in the stacked films.This step corresponds to that illustrated in FIGS. 4A and 4B in theabove embodiment. Note that the tantalum nitride film and the titaniumnitride film formed in the step correspond to the conductor 20 in FIG.4A, and the tungsten film in the step corresponds to the conductor 21 inFIG. 4A. The formation of the tungsten film by a metal CVD method wasperformed by the following three steps.

For the first step, a 3-nm-thick film was deposited by three cyclesunder the following conditions: the flow rate of a WF₆ gas was 160 sccm,the flow rate of an SiH₄ gas was 400 sccm, the flow rate of an Ar gaswas 6000 sccm, the flow rate of an N₂ gas was 2000 sccm, the flow rateof an Ar gas for the rear side of the stage was 4000 sccm, the pressurewas 1000 Pa, and the substrate temperature was 390° C.

For the second step, a 41-nm-thick film was deposited in 15 secondsunder the following conditions: the flow rate of a WF₆ gas was 250 sccm,the flow rates of an H₂ gas for two gas lines were 4000 sccm and 1700sccm, the flow rate of an Ar gas was 2000 sccm, the flow rate of an N₂gas was 2000 sccm, the flow rate of an Ar gas for the rear side of thestage was 4000 sccm, the pressure was 10666 Pa, and the substratetemperature was 390° C.

For the third step, a film was deposited so as to have a thickness of250 nm, under the following conditions: the flow rate of a WF₆ gas was250 sccm, the flow rates of an H₂ gas for two gas lines were 2200 sccmand 1700 sccm, the flow rate of an Ar gas was 2000 sccm, the flow rateof an N₂ gas was 200 sccm, the flow rate of an Ar gas for the rear sideof the stage was 4000 sccm, the pressure was 10666 Pa, and the substratetemperature was 390° C.

Next, CMP treatment was performed to remove an upper part of the siliconoxynitride film, an upper part of the tantalum nitride film, an upperpart of the titanium nitride film, an upper part of the tungsten film,and the hard mask. This step corresponds to the step illustrated inFIGS. 4C and 4D described in the above embodiment.

FIG. 59 shows a cross-sectional STEM image (magnified by 200,000 times)of Sample 1A at this step. FIG. 60 shows a cross-sectional STEM image(magnified by 250,000 times) of Sample 1B. Note that the cross-sectionalSTEM image was taken by HD2300 produced by Hitachi High-TechnologiesCorporation. FIG. 59 and FIG. 60 show the thicknesses of the tantalumnitride film on the bottom and side surfaces of a lower part of theopening which functions as a via hole, and the thicknesses of thetantalum nitride film on the bottom and side surfaces of an upper partof the opening which functions as a groove for a wiring pattern.

As shown in FIG. 59 and FIG. 60, the stacked films, i.e., the tantalumnitride film, the titanium nitride film, and the tungsten film, areformed with good coverage in the opening. In particular, there is nospace between the tantalum nitride film having a high blocking propertyagainst hydrogen and each of the silicon oxide film, the aluminum oxidefilm, and the silicon oxynitride film. This is probably influenced bythe tapered shape of the inner wall of the opening and the rounded shapeof the upper part of the edge of the opening.

When the plug is provided to penetrate the aluminum oxide film having ahigh blocking property against hydrogen and water in this manner, thevia hole formed in the aluminum oxide film can be sealed up with thetantalum nitride forming the plug. Accordingly, the upper layers and thelower layers are separated by the tantalum nitride film and the aluminumoxide film having a high blocking property against hydrogen and water,which can prevent hydrogen and water included in the lower part fromdiffusing into the upper layers through the plug or the via hole inwhich the plug is formed. Therefore, in the semiconductor device inwhich the transistor including an oxide semiconductor is provided overthe semiconductor substrate as in the above embodiment, the oxidesemiconductor can be a highly purified intrinsic or substantially highlypurified intrinsic oxide semiconductor; as a result, the semiconductordevice with the transistor having stable electrical characteristics canbe obtained.

In addition, it is found from comparison between Sample 1A in FIG. 59and Sample 1B in FIG. 60 that the thickness of the tantalum nitride filmon the bottom surface of the lower part of the opening that functions asa via hole in Sample 1B is approximately three times as large as that inSample 1A. This result verified that a collimated sputtering method madeit possible to form the tantalum nitride film with a larger thickness inthe lower part of the opening that had a high aspect ratio andfunctioned as via hole. In this manner, when the tantalum nitride filmwith a large thickness is also formed on the bottom part of the opening,diffusion of hydrogen from the lower layers to the upper layers can befurther inhibited.

The structure described in this example can be combined as appropriatewith any of the structures described in another example and the aboveembodiments.

Example 2

In this example, Samples 2A to 2R were fabricated and subjected to TDSmeasurement and sheet-resistance measurement.

<1. Structures of Samples>

FIGS. 61A and 61B illustrate structures of the samples. FIGS. 61A and61B are cross-sectional views illustrating the structures of the samplesin Examples.

Samples 2A to 2Q each include a substrate 6001, an insulator 6002 overthe substrate 6001, an insulator 6003 over the insulator 6002, and aconductor 6004 over the insulator 6003, as illustrated in FIG. 61A.Sample 2R includes the substrate 6001, the insulator 6002 over thesubstrate 6001, and the insulator 6003 over the insulator 6002, asillustrated in FIG. 61B.

<2. Method for Fabricating Samples>

Next, methods for fabricating the samples are described.

First, a silicon wafer was used as the substrate 6001, and a thermaloxide film was formed as the insulator 6002 thereover. The insulator6002 was formed to a thickness of 100 nm at 950° C. in an oxygenatmosphere containing HCl at 3 vol %.

Next, a 280-nm-thick silicon oxynitride film was formed as the insulator6003 over the insulator 6002 by a plasma CVD method. As the depositiongases, silane (CF₄) at a flow rate of 40 sccm, monoxide dinitrogen (N₂O)at a flow rate of 800 sccm, ammonia (NH₄) at a flow rate of 300 sccm,and hydrogen (H₂) at a flow rate of 900 sccm were used. In addition, thepressure of a reaction chamber was 160 Pa, the substrate temperature was325° C., and a high-frequency (RF) power of 250 W was applied during thedeposition.

Then, the conductor 6004 was formed over the insulator 6003 in each ofSamples 2A to 2Q by a sputtering method. Note that Sample 2R, in whichthe conductor 6004 was not provided, was used as a reference example.Tantalum nitride was formed as the conductor 6004 in each of Samples 2Ato 2Q under conditions shown in Table 1. Note that, in all thedeposition conditions, the pressure during deposition was 0.7 Pa, andthe distance between the target and the substrate was 60 mm.

TABLE 1 Deposition conditions of conductor 6004 Substrate SampleThickness Gas flow Power temperature name [nm] rate [sccm] (DC) [kW] [°C.] Sample 2A 20 N₂ = 10, Ar = 40 2.0 200 Sample 2B 20 N₂ = 20, Ar = 302.0 200 Sample 2C 20 N₂ = 25, Ar = 25 2.0 200 Sample 2D 20 N₂ = 10, Ar =40 4.0 200 Sample 2E 20 N₂ = 20, Ar = 30 4.0 200 Sample 2F 20 N₂ = 25,Ar = 25 4.0 200 Sample 2G 20 N₂ = 25, Ar = 25 4.0 R.T Sample 2H 20 N₂ =25, Ar = 25 4.0 300 Sample 2J 20 N₂ = 25, Ar = 25 4.0 400 Sample 2K 40N₂ = 25, Ar = 25 4.0 200 Sample 2L 40 N₂ = 25, Ar = 25 4.0 300 Sample 2M40 N₂ = 25, Ar = 25 4.0 400 Sample 2N 20 N₂ = 20, Ar = 30 4.0 R.T Sample2P 20 N₂ = 20, Ar = 30 4.0 300 Sample 2Q 20 N₂ = 20, Ar = 30 4.0 400Sample 2R — — — —

Through the above process, Samples 2A to 2R of this example werefabricated.

<3. TDS Measurement Results of Samples>

FIG. 62 shows TDS measurement results of Samples 2A to 2C in each ofwhich the conductor 6004 was formed at a deposition power (DC) of 2.0kW, and Samples 2D to 2F and 2R in each of which the conductor 6004 wasformed at a deposition power (DC) of 4.0 kW. Note that the gas flow rateduring the deposition of Samples 2A to 2C was different from that ofSamples 2D to 2F. The temperature range for TDS was from 50° C. to 600°C. The released amount of gases with a mass-to-charge ratio of 2 and 18,i.e., gases corresponding to hydrogen molecules (H₂) and water molecules(H₂O), were measured by TDS.

FIG. 62 indicates that when the conductor 6004 was provided, theconductor 6004 prevented diffusion of hydrogen from the layers below. Inaddition, the results show that the barrier property against hydrogenbecomes high as the proportion of a nitrogen (N₂) gas in the depositiongas for depositing the conductor 6004 was increased. Furthermore, theresults of Samples 2C and 2F show that in the case where a mixed gas ofa nitrogen (N₂) gas at a flow rate of 25 sccm and an argon gas at a flowrate of 25 sccm was used as the deposition gas, and the power during thedeposition was high, the barrier property against hydrogen wasincreased.

FIG. 63 shows TDS measurement results of Samples 2F to 2J in each ofwhich the thickness of the conductor 6004 was 20 nm, and Samples 2K to2M and 2R in each of which the thickness of the conductor 6004 was 40nm. Note that the substrate temperature during the deposition of Samples2F to 2J was different from that of Samples 2K to 2M. The temperaturerange for TDS was from 50° C. to 500° C. The released amount of gaseswith a mass-to-charge ratio of 2 and 18, i.e., gases corresponding tohydrogen molecules (H₂) and water molecules (H₂O), were measured by TDS.

FIG. 63 indicates that formation of the conductor 6004 preventeddiffusion of hydrogen from the layers below. In addition, the resultsshow that the barrier property against hydrogen was high when thesubstrate temperature during the deposition of the conductor 6004 washigh. In particular, hydrogen began to diffuse at a substratetemperature of approximately 350° C. to 410° C., or approximately 370°C. to 400° C. in TDS measurement. Furthermore, as the thickness of theconductor 6004 was increased, the barrier property against hydrogen wasincreased.

<4. Measurement Results of Sheet Resistances of Samples>

FIG. 64A shows measurement results of the sheet resistances of Samples2A to 2C that were fabricated at a deposition power (DC) of 2.0 kW, andthose of Samples 2D to 2F that were fabricated at a deposition power(DC) of 4.0 kW.

The results shown in FIG. 64A indicate that as the proportion of anitrogen (N₂) gas was high during deposition of the conductor 6004, theresistance increased, and that the resistance was likely to increasewhen the power (DC) during deposition of the conductor 6004 was low.

FIG. 64B shows the measurement results of sheet resistances of Samples2F to 2J, which were fabricated using a mixed gas of a nitrogen (N₂) gasat a flow rate of 25 sccm and an argon gas at a flow rate of 25 sccm,respectively, as the deposition gases; and Samples 2E and 2N to 2Q,which were fabricated using a mixed gas of a nitrogen (N₂) gas at a flowrate of 20 sccm and an argon gas at a flow rate of 30 sccm,respectively, as the deposition gases. Note that the substratetemperature during the deposition of Samples 2A to 2C was different fromthat of Samples 2D to 2F.

The results shown in FIG. 64B indicate that as the substrate temperatureduring the deposition of the conductor 6004 was low, the resistanceincreased. In addition, as the proportion of a nitrogen (N₂) gas duringthe deposition of the conductor 6004 was large, the resistance was morelikely to increase.

The structure described in this example can be combined as appropriatewith any of the structures described in another example and the aboveembodiments.

This application is based on Japanese Patent Application serial no.2015-213152 filed with Japan Patent Office on Oct. 29, 2015, the entirecontents of which are hereby incorporated by reference.

What is claimed is:
 1. A method for manufacturing a semiconductordevice, comprising the steps of: forming a first conductor over asemiconductor substrate; forming a first insulator over the firstconductor; forming a second insulator over the first insulator; forminga third insulator over the second insulator; forming a hard mask with afirst opening over the third insulator; forming a resist mask with asecond opening over the hard mask; etching the third insulator using theresist mask to form a third opening in the third insulator; etching thesecond insulator using the resist mask to form a fourth opening in thesecond insulator; removing the resist mask; etching the first to thirdinsulators using the hard mask to form a fifth opening in the first tothird insulators; forming a second conductor to cover an inner wall anda bottom surface of the fifth opening; forming a third conductor overthe second conductor to fill the fifth opening; performing polishingtreatment on the hard mask, the second conductor, and the thirdconductor so that the hard mask is removed, and that levels of topsurfaces of the second conductor, the third conductor, and the thirdinsulator are substantially equal to each other; and forming an oxidesemiconductor over the second conductor and the third conductor, whereinthe second insulator is in contact with the second conductor at an edgeof the fifth opening, wherein the second insulator is less permeable tohydrogen than the first insulator, and wherein the second conductor isless permeable to hydrogen than the third conductor.
 2. The method formanufacturing a semiconductor device, according to claim 1, wherein amaximum value of a width of the second opening is smaller than a minimumvalue of a width of the first opening.
 3. The method for manufacturing asemiconductor device, according to claim 1, wherein the second conductorcomprises tantalum and nitrogen.
 4. The method for manufacturing asemiconductor device, according to claim 1, wherein the second insulatorcomprises aluminum and oxygen.
 5. A method for manufacturing asemiconductor device, comprising the steps of: forming a firstconductor; forming a first insulator over the first conductor; forming asecond insulator over the first insulator; forming a third insulatorover the second insulator; forming a hard mask with a first opening overthe third insulator; forming a resist mask with a second opening overthe hard mask; etching the second insulator and the third insulatorusing the resist mask to form a third opening in the second insulatorand the third insulator; removing the resist mask; etching the first tothird insulators using the hard mask to form a fourth opening in thefirst to third insulators; forming a second conductor to cover an innerwall and a bottom surface of the fourth opening; forming a thirdconductor over the second conductor; and performing polishing treatmenton the hard mask, the second conductor, and the third conductor so thatthe hard mask is removed, and that levels of top surfaces of the secondconductor, the third conductor, and the third insulator aresubstantially equal to each other, wherein the second insulator is lesspermeable to hydrogen than the first insulator, and wherein the secondconductor is less permeable to hydrogen than the third conductor.
 6. Themethod for manufacturing a semiconductor device, according to claim 5,wherein a maximum value of a width of the second opening is smaller thana minimum value of a width of the first opening.
 7. The method formanufacturing a semiconductor device, according to claim 5, wherein thesecond conductor comprises tantalum and nitrogen.
 8. The method formanufacturing a semiconductor device, according to claim 5, wherein thesecond insulator comprises aluminum and oxygen.
 9. A method formanufacturing a semiconductor device, comprising the steps of: forming afirst conductor; forming a first insulator over the first conductor;forming a second insulator over the first insulator; forming a thirdinsulator over the second insulator; forming a hard mask with a firstopening over the third insulator; forming a resist mask with a secondopening over the hard mask; etching the second insulator and the thirdinsulator using the resist mask to form a third opening in the secondinsulator and the third insulator; removing the resist mask; etching thefirst to third insulators using the hard mask to form a fourth openingin the first to third insulators; and forming a second conductor tocover an inner wall and a bottom surface of the fourth opening, whereinthe second insulator is less permeable to hydrogen than the firstinsulator.
 10. The method for manufacturing a semiconductor device,according to claim 9, wherein a maximum value of a width of the secondopening is smaller than a minimum value of a width of the first opening.11. The method for manufacturing a semiconductor device, according toclaim 9, wherein the second conductor comprises tantalum and nitrogen.12. The method for manufacturing a semiconductor device, according toclaim 9, wherein the second insulator comprises aluminum and oxygen.